Lateral insulated-gate bipolar transistor and manufacturing method therefor
Provided is a lateral insulated-gate bipolar transistor (LIGBT), comprising a substrate ( 10 ), an anode terminal and a cathode terminal on the substrate ( 10 ), and a drift region ( 30 ) and a gate ( 61 ) located between the anode terminal and the cathode terminal. The anode terminal comprises a P-type buried layer ( 52 ) on the substrate ( 10 ), an N-type buffer region ( 54 ) on the P-type buried layer ( 52 ), and a P+ collector region ( 56 ) on the surface of the N-type buffer region ( 54 ). The LIGBT further comprises a trench gate adjacent to the anode terminal, wherein the trench gate penetrates from the surfaces of the N-type buffer region ( 54 ) and the P+ collector region ( 56 ) to the P-type buried layer ( 52 ), and the trench gate comprises an oxidation layer ( 51 ) on the inner surface of a trench and polysilicon ( 53 ) filled into the oxidation layer.
1. A lateral insulated-gate bipolar transistor, comprising:
a substrate;
an anode terminal and a cathode terminal formed on the substrate; wherein the anode terminal comprising a P-type buried layer formed on the substrate, an N-type buffer region formed on the P-type buried layer, and a P+ collector region formed on a surface of the N-type buffer region;
a drift region and a gate located between the anode terminal and the cathode terminal;
a trench gate extending from the N-type buffer region and a surface of the P+ collector region to the P-type buried layer, the trench gate comprising an oxidation layer formed on an inner surface of a trench and polysilicon filled in the trench and on the oxidation layer.
2. The lateral insulated-gate bipolar transistor according to claim 1 , wherein the P-type buried layer is separated from the N-type buffer region by the drift region.
3. The lateral insulated-gate bipolar transistor according to claim 1 , wherein the lateral insulated-gate bipolar transistor is a silicon-on-insulator type lateral insulated-gate bipolar transistor, and the lateral insulated-gate bipolar transistor further comprises a buried oxide layer located between the substrate and the drift region, the P-type buried layer is located on the buried oxide layer.
4. The lateral insulated-gate bipolar transistor according to claim 1 , wherein the substrate is a P-type substrate, and the drift region is an N-type drift region.
5. The lateral insulated-gate bipolar transistor according to claim 1 , wherein the cathode terminal comprises a P-type body region located on the substrate, and a P+ region and an N+ region located on a surface of the P-type body region.
6. The lateral insulated-gate bipolar transistor according to claim 5 , wherein the cathode terminal further comprises a cathode metal; the gate comprises a gate oxide layer, and a polysilicon gate located on the gate oxide layer.
7. The lateral insulated-gate bipolar transistor according to claim 6 , wherein the gate oxide layer has a thickness of 800 angstroms to 2000 angstroms.
8. A method of manufacturing a lateral insulated-gate bipolar transistor, comprising the following steps of:
providing a substrate having a drift region;
implanting P-type ions into the drift region via a high energy ions implantation, thus forming a P-type buried layer;
implanting N-type ions on the P-type buried layer, thus forming an N-type buffer region;
performing a thermal drive-in to diffuse the implanted P-type ions and N-type ions;
implanting P-type ions into the drift region, performing thermal annealing to form a P-type body region;
performing lithography and etching to form a trench extending from a surface of the N-type buffer region into the P-type buried layer;
forming an oxide layer on an inner surface of the trench;
filling the trench with polysilicon; and
performing ion implantation to form a P+ collector region on the surface of the N-type buffer region, and forming a P+ region and an N+ region on a surface of the P-type body region; wherein the P+ collector region is in contact with the oxide layer.
9. The method of claim 8 , wherein during the step of performing lithography and etching to form the trench extending from the surface of the N-type buffer region into the P-type buried layer, the etching is performed using a reactive ion etching process.
10. The method of claim 8 , wherein during the step of forming the oxide layer on an inner surface of the trench, the oxide layer is formed by thermal oxidation; wherein during the step of filling the oxide layer with polysilicon, a polysilicon gate is formed by a deposition process.
11. The method of claim 8 , wherein during the step of providing the substrate having the drift region, a buried oxide layer is formed between the drift region and the substrate; wherein during the step of implanting P-type ions into the drift region via the high energy ions implantation, the P-type buried layer is formed on the buried oxide layer.
12. The method of claim 8 , wherein during the step of implanting P-type ions into the drift region via the high energy ions implantation, the implanted ions are boron ions.
13. The method of claim 8 , wherein the substrate is a P-type substrate, and the drift region is an N-type drift region.
14. The method of claim 8 , wherein the P+ collector region is in contact with the oxide layer in the trench, and the P+ collector region serves as a drain of a P-channel MOSFET.