Curable organopolysiloxane composition, semiconductor sealant comprising same, and semiconductor device

1. A curable organopolysiloxane composition, comprising:

(A) a curing reactive organopolysiloxane component having at least two carbon-carbon double bonds per molecule and formed by semi-curing and reacting a resin organopolysiloxane and chain organopolysiloxane in the presence of a hydrosilylation reaction catalyst, wherein the curing reactive organopolysiloxane component comprises an organopolysiloxane in which 10 mol % or more of all silicon-atom bonded organic groups are aryl groups; and

(B) an organic peroxide selected from the group consisting of peroxyalkyls, peroxydiacyls, peroxyesters, and peroxycarbonates;

wherein the organic peroxide (B) has a 10 hour half-life temperature of 90° C. or higher;

wherein semi-curing and reacting of component (A) is carried out at a temperature of approximately 80 to 100° C.; and

wherein the composition is non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa·s or lower.

2. The curable organopolysiloxane composition according to claim 1 , wherein the organic peroxide (B) is a peroxyalkyl.

3. The curable organopolysiloxane composition according to claim 1 , further comprising: (C) an inorganic filler.

4. The curable organopolysiloxane composition according to claim 1 , further comprising: one or more components selected from a reaction suppressant, an adhesion imparting agent, and a heat resistance imparting agent.

5. The curable organopolysiloxane composition according to claim 1 , having a softening point within a range of 25° C. to 100° C.

6. The curable organopolysiloxane composition according to claim 1 , wherein the melt viscosity at 100° C. is 500 to 8000 Pa·s.

7. The curable organopolysiloxane composition according to claim 1 , wherein when the torque value after 180° C./3 min is 100%, the time to reach 90% is less than 2 minutes and 30 seconds.

8. The curable organopolysiloxane composition according to claim 1 , wherein a type D durometer hardness at 25° C. of a cured product obtained by curing the curable organopolysiloxane composition is 60 or higher.

9. The curable organopolysiloxane composition according to claim 1 , wherein the coefficient of linear expansion of a cured product obtained by curing the curable organopolysiloxane composition is 100 ppm/° C. or lower.

10. A cured product formed by curing the curable organopolysiloxane composition according to claim 1 .

11. A light-reflecting material for a semiconductor or optical semiconductor, said light-reflecting material comprising the cured product according to claim 10 .

12. The light-reflecting material according to claim 11 , wherein the semiconductor or optical semiconductor is a power semiconductor.

13. A semiconductor device comprising the cured product according to claim 10 .

14. The semiconductor device of claim 13 , further comprising a semiconductor element and wherein the cured product seals the semiconductor element.

15. The semiconductor device of claim 13 , further defined as an optical semiconductor device or a power semiconductor device.

16. A sealing agent for a semiconductor, said sealing agent comprising the curable organopolysiloxane composition according to claim 1 .

17. A method of molding a cured product, said method comprising:

(I) heating and melting at 100° C. or higher to fluidize the curable organopolysiloxane composition according to claim 1 to give a melted curable organopolysiloxane composition;

(II) flowing into a metal die the melted curable organopolysiloxane composition; and

(III) curing the melted curable organopolysiloxane composition in the metal die by peroxide curing at 150° C. or higher.

18. The curable organopolysiloxane composition according to claim 1 , wherein the curing reactive organopolysiloxane component comprises an organopolysiloxane in which 10 mol % or more and 47 mol % or less of all silicon-atom bonded organic groups are aryl groups.