Fe—P—Cr alloy thin plate and method for manufacturing same
The present invention relates to an Fe—P—Cr alloy thin plate and a method for manufacturing the same. An embodiment of the present invention provides an Fe—P—Cr alloy thin plate including, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), and the balance of Fe and other inevitable impurities.
1. An Fe—P—Cr alloy thin plate comprising, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), and the balance of Fe and other inevitable impurities.
2. The Fe—P—Cr alloy thin plate of claim 1 , wherein the Fe—P—Cr alloy thin plate further includes Ni (0.5-5.0%) in terms of wt %.
3. The Fe—P—Cr alloy thin plate of claim 2 , wherein the thin plate has Vickers hardness of less than or equal to 600 HV.
4. The Fe—P—Cr alloy thin plate of claim 3 , wherein the thin plate has a saturation magnetic flux density of greater than or equal to 1.5 T.
5. The Fe—P—Cr alloy thin plate of claim 4 , wherein the thin plate has a thickness of 1 μm to 100 μm.
6. The Fe—P—Cr alloy thin plate of claim 5 , wherein the Fe—P—Cr alloy thin plate has a mixed form of amorphous and crystal grains.
7. The Fe—P—Cr alloy thin plate of claim 6 , wherein the crystal grain has a particle diameter of greater than or equal to 0.1 nm and less than or equal to 100 nm.
8. The Fe—P—Cr alloy thin plate of claim 7 , wherein a volume fraction of the crystal grain based on an amorphous matrix is 1% to 10%.
9. A method of manufacturing an Fe—P—Cr alloy thin plate, comprising:
forming a plating solution including an iron compound, a phosphorus compound, and a chromium compound;
applying a current to the formed plating solution;
electrodepositing an Fe—P—Cr alloy layer including, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), and the balance of Fe and other inevitable impurities on a cathode plate using the current; and
delaminating the Fe—P—Cr alloy layer from the cathode plate to obtain an Fe—P—Cr alloy thin plate.
10. The method of manufacturing an Fe—P—Cr alloy thin plate of claim 9 , wherein the Fe—P—Cr alloy thin plate has a thickness of 1 μm to 100 μm.
11. The method of manufacturing an Fe—P—Cr alloy thin plate of claim 9 , wherein the forming of the plating solution including the iron compound, the phosphorus compound, and the chromium compound includes
forming a plating solution including an iron compound, a phosphorus compound, a chromium compound, and a nickel compound.
12. The method of manufacturing an Fe—P—Cr alloy thin plate of claim 11 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, the chromium compound, and the nickel compound,
a concentration of the iron compound in the plating solution is 0.5 M to 4.0 M, and
the iron compound includes FeSO 4 , Fe(SO 3 NH 2 ) 2 , FeCl 2 , or a combination thereof.
13. The method of manufacturing an Fe—P—Cr alloy thin plate of claim 12 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, the chromium compound, and the nickel compound,
a concentration of the phosphorus compound in the plating solution is 0.01 M to 3.0 M, and
the phosphorus compound includes NaH 2 PO 2 , H 3 PO 2 , H 3 PO 3 , or a combination thereof.
14. The method of manufacturing an Fe—P—Cr alloy thin plate of claim 13 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, the chromium compound, and the nickel compound,
a concentration of the chromium compound in the plating solution is 0.001 M to 2.0 M, and
the chromium compound includes CrCl 3 , Cr 2 (SO 4 ) 3 , CrO 3 , or a combination thereof.
15. The method of manufacturing an Fe—P—Cr alloy thin plate of claim 14 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, the chromium compound, and the nickel compound,
a concentration of the nickel compound in the plating solution is 0.1 M to 3.0 M, and
the nickel compound includes NiSO 4 , NiCl 2 , or a combination thereof.
16. The method of manufacturing an Fe—P—Cr alloy thin plate of claim 11 , wherein the forming of the plating solution including the iron compound, the phosphorus compound, the chromium compound, and the nickel compound includes
forming a plating solution including the iron compound, the phosphorus compound, the chromium compound, the nickel compound, and an additive, wherein a concentration of the additive in the plating solution is 0.001 M to 0.1 M.
17. The method of manufacturing an Fe—P—Cr alloy thin plate of claim 9 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, and the chromium compound,
pH of the plating solution is 1 to 4.
18. The method of manufacturing an Fe—P—Cr alloy thin plate of claim 9 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, and the chromium compound,
a temperature of the plating solution is 30° C. to 100° C.
19. The method of manufacturing an Fe—P—Cr alloy thin plate of claim 9 , wherein in the applying of a current to the formed plating solution,
a current density is 1 A/dm 2 to 100 A/dm 2 .
20. The method of manufacturing an Fe—P—Cr alloy thin plate of claim 9 , wherein the electrodepositing of the Fe—P—Cr alloy layer including, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), and the balance of Fe and other inevitable impurities on a cathode plate using the current includes
electrodepositing an Fe—P—Cr—Ni alloy layer including, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), Ni (0.5-5.0%), and the balance of Fe and other inevitable impurities on a cathode plate using the current.