Lead frame and method of producing a chip housing
A lead frame used to produce a chip package includes a first lead frame section and a second lead frame section connected to one another by a bar, wherein the bar includes a first longitudinal section, a second longitudinal section and a third longitudinal section, the first longitudinal section adjoins the first lead frame section and the third longitudinal section adjoins the second lead frame section, the first longitudinal section and the third longitudinal section are oriented parallel to one another, the first longitudinal section and the second longitudinal section form an angle not equal to 180° and not equal to 90°, and the lead frame is planar.
1. A lead frame used to produce a chip package comprising:
a first lead frame section and a second lead frame section connected to one another by a bar,
wherein the bar comprises a first longitudinal section, a second longitudinal section and a third longitudinal section,
the first longitudinal section adjoins the first lead frame section and the third longitudinal section adjoins the second lead frame section,
the first longitudinal section adjoins the second longitudinal section and the second longitudinal section adjoins the third longitudinal section,
the first longitudinal section perpendicularly adjoins an outer edge of the first lead frame section,
the third longitudinal section perpendicularly adjoins an outer edge of the second lead frame section,
the first longitudinal section and the third longitudinal section are oriented parallel to one another,
the first longitudinal section and the second longitudinal section form an angle not equal to 180° and not equal to 90°, and
the lead frame is planar.
2. The lead frame according to claim 1 ,
wherein the first lead frame section is connected by further bars to further lead frame sections,
all the further bars respectively comprise a first longitudinal section, a second longitudinal section and a third longitudinal section,
all the first longitudinal sections of the further bars adjoin the first lead frame section,
the first longitudinal section and the third longitudinal section of each further bar are respectively oriented parallel to one another, and
the first longitudinal section and the second longitudinal section of each further bar respectively form an angle not equal to 180°.
3. The lead frame according to claim 1 , wherein the lead frame is provided for the production of a QFN chip package.
4. The lead frame according to claim 1 , wherein the lead frame is provided for the production of a chip package for an optoelectronic component.
5. A method of producing a chip package comprising:
providing the lead frame according to claim 1 ;
embedding the lead frame in a molded body; and
dividing the molded body and the lead frame, the bar being cut through.
6. The method according to claim 5 , wherein the bar is cut through in the first longitudinal section and/or in the third longitudinal section.
7. The method according to claim 5 , wherein the bar is cut through in a direction oriented perpendicularly to the first longitudinal section of the bar.
8. A method of producing an optoelectronic component comprising:
producing a chip package by the method according to claim 5 ; and
arranging an optoelectronic semiconductor chip on a section of the lead frame.