Wedge bonding component
There is provided with a surface for contacting a wire. At least a part of the surface comprises a surface of a ceramic sintered body containing aluminum oxide as a main ingredient and titanium carbide as an accessory ingredient.
1. A wedge bonding component having a contact surface configured for contacting a wire, wherein
at least a part of the contact surface comprises a ceramic sintered body containing aluminum oxide as a main ingredient and titanium carbide as an accessory ingredient, wherein crystal grains of aluminum oxide protrude from the contact surface of said ceramic sintered body relative to crystal grains of titanium carbide.
2. The wedge bonding component according to claim 1 , wherein
said ceramic sintered body contains 30% by mass or more and 40% by mass or less of titanium carbide.
3. The wedge bonding component according to claim 1 , wherein
said ceramic sintered body contains 0.06% by mass or more and 0.2% by mass or less of ytterbium in terms of an oxide.
4. The wedge bonding component according to claim 1 , wherein
said ceramic sintered body has an average crystal grain size of 0.1 μm or more and 0.9 μm or less.
5. The wedge bonding component according to claim 4 , wherein
the crystal grains of aluminum oxide are on average 1.1 times or more larger than and 2 times or less smaller than the crystal grains of titanium carbide on average.
6. The wedge bonding component according to claim 1 , wherein
said ceramic sintered body contains 50% by mass or more and 80% by mass or less of aluminum oxide.