Inspection system and inspection method
An inspection system includes a laser light source, an optical system for laser marking that irradiates a semiconductor device with laser light from a metal layer side, a control unit that controls the laser light source to control laser marking, a two-dimensional camera that detects light from the semiconductor device on a substrate side and outputs an optical reflection image, and an analysis unit that generates a pattern image of the semiconductor device, and the control unit controls the laser light source so that laser marking is performed until a mark image appears in a pattern image.
1. An inspection system for performing laser marking on a semiconductor device having a metal layer formed on a substrate, the inspection system comprising:
a first light source configured to output laser light;
an optical system for laser marking configured to irradiate the semiconductor device with the laser light from the metal layer side;
a marking controller configured to control the first light source to control the laser marking;
an observation optical system configured to be arranged on the substrate side of the semiconductor device and to transmit light from the semiconductor device;
a photodetector configured to detect the light from the semiconductor device through the observation optical system and to output a detection signal; and
an image processor configured to generate a pattern image based on the detection signal,
wherein the marking controller is configured to control the irradiation of the laser light so that the laser marking is performed until a mark image formed by the laser marking appears in the pattern image.
2. The inspection system according to claim 1 ,
wherein the marking controller is configured to control the irradiation of the laser light so that the laser marking is performed until the laser light penetrates through the metal layer.
3. The inspection system according to claim 1 ,
wherein the image processor is configured to generate the pattern image while the laser marking is being performed by the laser light.
4. The inspection system according to claim 1 , further comprising:
a second light source configured to output illumination light,
wherein the photodetector is a two-dimensional camera configured to image the illumination light reflected in the semiconductor device.
5. The inspection system according to claim 1 ,
wherein the photodetector is an infrared camera configured to image heat rays from the semiconductor device.
6. The inspection system according to claim 1 , further comprising:
a second light source configured to output light,
wherein the observation optical system comprises an optical scanner configured to scan the semiconductor device with the light output from the second light source and to transmit light reflected from the semiconductor device to the photodetector.
7. The inspection system according to claim 1 ,
wherein the first light source is configured to output the laser light having a wavelength equal to or longer than 1000 nm, and
the observation optical system comprises an optical filter configured to block light including the wavelength of the laser light.
8. The inspection system according to claim 1 ,
wherein the first light source is configured to output the laser light having a wavelength shorter than 1000 nanometers.
9. An inspection method of performing laser marking on a semiconductor device in which a metal layer is formed on a substrate, the inspection method comprising:
performing laser marking by irradiating the semiconductor device with laser light from the metal layer side;
transmitting light from the semiconductor device to a photodetector by using an observation optical system arranged on the substrate side of the semiconductor device; and
generating a pattern image based on the light from the semiconductor device,
wherein performing the laser marking comprises performing the irradiation of the laser light until a mark image formed by the laser marking appears in the pattern image.
10. The inspection method according to claim 9 ,
wherein performing the laser marking comprises performing the laser marking until the laser light penetrates the metal layer.
11. The inspection method according to claim 9 ,
wherein generating the pattern image comprises generating the pattern image while the laser marking is being performed.
12. The inspection method according to claim 9 ,
wherein the laser light has a wavelength equal to or longer than 1000 nm, and
the observation optical system comprises an optical filter blocking light having the wavelength of the laser light.
13. The inspection method according to claim 9 ,
wherein the laser light has a wavelength shorter than 1000 nanometers.