IP Library Patent Application 15553386
Patent Application
App. No. 15/553,386

CURABLE GRANULAR SILICONE COMPOSITION AND METHOD FOR MANUFACTURING THEREOF

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Patent No.
US None
App. No.
15/553,386
Abstract

A curable granular silicone composition is provided, which may be in a pellet form. The curable granular silicone composition comprises: (A) hot meltable silicone fine particles having a hydrosilylation reactive group and/or radical reactive group, with a softening point of 30° C. or higher; (B) a filler that does not have a softening point or does not soften below the softening point of component (A); and (C) a curing agent. The curable granular silicone composition has hot melt properties, and has excellent handling workability and curability.

Claims (31)

1 . A curable granular silicone composition comprising:

(A) hot meltable silicone fine particles having a hydrosilylation reactive group and/or radical reactive group, with a softening point of 30° C. or higher;

(B) a filler that does not have a softening point or does not soften below the softening point of component (A); and

(C) a curing agent.

2 . The curable granular silicone composition according to claim 1 , wherein the hydrosilylation reactive group in component (A) is present and is an alkenyl group with 2 to 20 carbon atoms and/or a silicon-bonded hydrogen atom.

3 . The curable granular silicone composition according to claim 1 , wherein the radical reactive group in component (A) is present and is an alkyl group with 1 to 20 carbon atoms, an alkenyl group with 2 to 20 carbon atoms, a group containing acrylic, &group containing methacrylic, or a silicon-bonded hydrogen atom.

4 . The curable granular silicone composition according to claim 1 , wherein component (A) is silicone fine particles including:

(A 1 ) a resinous organopolysiloxane;

(A 2 ) a crosslinked organopolysiloxane formed by partially crosslinking at least one type of organopolysiloxane;

(A 3 ) a block copolymer including a resinous organosiloxane block and linear organosiloxane block;

or a mixture of two types or more thereof.

5 . The curable granular silicone composition according to claim 1 , wherein the average particle size of component (A) is 1 to 5000 μm.

6 . The curable granular silicone composition according to claim 1 , wherein component (B) is a reinforcing filler, white pigment, heat conductive filler, electrically conductive filler, phosphor, or a mixture of two types or more thereof.

7 . The curable granular silicone composition according to claim 1 , wherein the average particle size of component (B) is 1 nm to 500 μm.

8 . The curable granular silicone composition according to claim 1 , wherein the amount of component (B) is 10 to 3000 parts by mass with regard to 100 parts by mass of component (A).

9 . The curable granular silicone composition according to claim 1 , wherein the curable granular silicone composition is in a pellet form.

10 . A method for manufacturing a curable granular silicone composition, comprising the step of powder mixing components comprising:

(A) hot meltable silicone fine particles having a hydrosilylation reactive group and/or radical reactive group, with a softening point of 30° C. or higher;

(B) a filler that does not have a softening point or does not soften below the softening point of component (A); and

(C) a curing agent,

at a temperature below the softening point of component (A).

11 . A method for molding a cured product, comprising the following steps:

(I) heating and melting the curable granular silicone composition according to claim 1 at a temperature higher than the softening point of component (A);

(II) injecting the curable silicone composition obtained in step (I) into a metal mold; and

(III) curing the curable silicone composition injected in step (II).

12 . The curable granular silicone composition according to claim 1 , wherein component (A) has at least two reactive groups in a molecule.

13 . The curable granular silicone composition according to claim 12 , wherein the reactive groups in component (A) are alkenyl groups and/or silicon-bonded hydrogen atoms.

14 . The curable granular silicone composition according to claim 1 , wherein component (A) also has at least one silicon-bonded group selected from a phenyl group, a hydroxyl group, and combinations thereof.

15 . The curable granular silicone composition according to claim 4 , wherein component (A) is silicone fine particles including component (A 1 ).

16 . The curable granular silicone composition according to claim 4 , wherein component (A) is silicone fine particles including component (A 2 ).

17 . The curable granular silicone composition according to claim 4 , wherein component (A) is silicone fine particles including component (A 3 ).

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2017
From: IMAIZUMI, TORU; OZAKI, KOUICHI; YAMAZAKI, RYOSUKE
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 044140/0460 →