Method for producing a radiofrequency device passive wire antenna
A method for producing a radiofrequency device having a first antenna circuit connected to a radiofrequency chip and a second antenna circuit associated with, or coupled to, the first circuit, the method including the following steps: formation of the first antenna circuit in the form of a conductive wire deposited in a guided manner on a first substrate; and formation of the second antenna circuit in the form of a conductive wire deposited on the same first substrate in a guided manner and at a calibrated distance from the first antenna circuit.
1. A method for producing a radiofrequency device comprising a first antenna circuit connected to a radiofrequency chip, and a second antenna circuit disposed at a distance from the first antenna circuit at which the second antenna circuit increases a communication range of the radiofrequency device,
comprising the following steps:
forming the first antenna circuit by depositing a conductive wire onto a first substrate, and
after forming the first antenna circuit, forming the second antenna circuit by depositing a conductive wire onto the first substrate and at the distance from the first antenna circuit, wherein the method results in the final product in the fabrication flow.
2. A method according to claim 1 , wherein the first circuit includes terminal portions for interconnection to the radiofrequency chip in the form of alternations.
3. A method according to claim 1 , wherein portions of wire of the antenna circuit are deposited onto a substrate using embroidery or overlay.
4. A method according to claim 1 , wherein the second circuit is a passive antenna coupled with a radiofrequency transponder.
5. A method according to claim 1 , further comprising a step of depositing an anisotropic conductive material onto each terminal portion of the first antenna circuit and a step of transferring and connecting a/an coated/encapsulated chip via said anisotropic conductive material.
6. A method according to claim 1 , further comprising a step of depositing a conductive material by printing, specifically screen printing, onto each terminal portion of the first antenna circuit and a step of transferring and connecting an unpackaged chip via said conductive material.
7. A method according to claim 1 , further comprising a step of coating/encapsulating the chip in a package, except for the studs thereof, prior to the transfer thereof against connection terminal portions.
8. A method according to claim 1 , further comprising at least a step of forming a part of the first circuit or fixing the radiofrequency chip in a cavity or an opening—provided in one of the substrates.
9. A method for producing a radiofrequency device comprising a first antenna circuit connected to a radiofrequency chip, and a second antenna circuit disposed at a distance from the first antenna circuit at which the second antenna circuit increases a communication range of the radiofrequency device,
comprising the following steps:
forming the first antenna circuit by depositing a conductive wire onto a first substrate, and
after forming the first antenna circuit, forming the second antenna circuit by depositing a conductive wire onto a second substrate and at the distance from the first antenna circuit,
wherein the method results in the final product in the fabrication flow.
10. A method according to claim 9 , wherein the first circuit includes terminal portions for interconnection to the radiofrequency chip in the form of alternations.
11. A method according to claim 9 , wherein portions of wire of the antenna circuit are deposited onto a substrate using embroidery or overlay.
12. A method according to claim 9 , wherein the second circuit is a passive antenna coupled with a radiofrequency transponder.
13. A method according to claim 9 , further comprising a step of depositing an anisotropic conductive material onto each terminal portion of the first antenna circuit and a step of transferring and connecting a/an coated/encapsulated chip via said anisotropic conductive material.
14. A method according to claim 9 , further comprising a step of depositing a conductive material by printing, specifically screen printing, onto each terminal portion of the first antenna circuit and a step of transferring and connecting an unpackaged chip via said conductive material.
15. A method according to claim 9 , further comprising a step of coating/encapsulating the chip in a package, except for the studs thereof, prior to the transfer thereof against connection terminal portions.
16. A method according to claim 9 , further comprising at least a step of forming a part of the first circuit or fixing the radiofrequency chip in a cavity or an opening provided in one of the substrates.