IP Library Granted Patent US 10,424,703
Granted Patent B2
US 10,424,703 · App. 15/556,020 · Granted Sep 24, 2019

Method of producing an optical semiconductor device

Inventors: Yasunari Ooyabu (Osaka, JP); Hiroki Kono (Osaka, JP); Yi-min Chou (Taiwan, CN)
Assignee: EPISTAR CORPORATION
H01L33/60H01L24/97H01L33/46H01L33/50H01L33/505H01L2224/97H01L2924/12041H01L2924/12042H01L2933/0025H01L2933/0041H01L2933/0058
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Quick Facts
Patent No.
US 10,424,703
App. No.
15/556,020
Granted
Sep 24, 2019
Kind
B2
Abstract

A method for producing a light reflecting layer-including optical semiconductor element includes the steps of temporarily fixing electrode surfaces of a plurality of optical semiconductor elements each having the electrode surface provided with an electrode, a light emitting surface opposing the electrode surface and provided with a light emitting layer, and a connecting surface connecting a peripheral end edge of the electrode surface to that of the light emitting surface to a temporarily fixing sheet at spaced intervals to each other; filling a first gap between the optical semiconductor elements that are next to each other with a light reflecting sheet and forming a light reflecting layer on the connecting surfaces of the plurality of optical semiconductor elements; removing the light reflecting layer attaching to the light emitting surfaces of the plurality of optical semiconductor elements; and cutting the light reflecting layer between the optical semiconductor elements that are next to each other.

Claims (10)

1. A method of producing an optical semiconductor device, comprising:

providing a plurality of optical semiconductor elements which are arranged on a sheet, each optical semiconductor element having a light emitting surface and peripheral side surfaces, wherein the plurality of optical semiconductor elements is spaced apart from each other by first gaps;

pressing a first sheet onto the plurality of optical semiconductor elements in a configuration of filling in the first gaps and covering the light emitting surface and the peripheral side surfaces of each of the plurality of optical elements surfaces;

removing a first part of the sheet to form a layer with a flat top surface

separating the plurality of optical semiconductor elements from each other by forming a second gap; and filling a second sheet in the second gap inside each first gap.

2. The method of claim 1 , wherein the layer is a phosphor layer.

3. The method of claim 2 , wherein the second sheet is a reflective sheet .

4. The method of claim 1 , wherein the second sheet surrounds the peripheral side surfaces of each of the plurality of optical semiconductor elements .

5. The method of claim 1 , wherein the reflective sheet is reflective to light from the plurality of optical semiconductor elements.

6. The method of claim 1 , wherein each of the plurality of optical semiconductor elements has a plurality of electrodes, the light emitting surface and the plurality of the electrodes are arranged on opposite sides of each optical semiconductor element.

Assignments (3)
CHANGE OF NAME Recorded Feb 18, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075171/0402 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2017
From: NITTO DENKO CORPORATION
To: EPISTAR CORPORATION
Reel/Frame 044278/0175 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2017
From: OOYABU, YASUNARI; KONO, HIROKI; CHOU, YI-MIN
To: NITTO DENKO CORPORATION
Reel/Frame 043502/0265 →
Priority Claims (2)
JP 2015-052523 · Mar 16, 2015 · national
JP 2016-043581 · Mar 7, 2016 · national
Continuity (1)
Related Publication 20180309034A1 · Oct 25, 2018