IP Library Granted Patent US 10,589,493
Granted Patent B2
US 10,589,493 · App. 15/556,150 · Granted Mar 17, 2020

Multilayer structure, and packaging material formed from the multilayer structure

Inventor: Ryohei Komuro (Osaka, JP)
Assignee: MITSUBISHI CHEMICAL CORPORATION
B32B27/08B29C48/16B32B5/022B32B5/024B32B7/12B32B15/08B32B21/08B32B27/10B32B27/18B32B27/20B32B27/28B32B27/306B32B27/32B32B27/34B32B27/36B32B29/002B65D65/16B65D65/40B65D81/24C08J5/124C08K5/098C08L29/04B29C48/08B29C48/21B29K2023/0625B29K2023/086B29K2105/0094B29K2509/00B29K2995/0067B29L2031/712B32B2264/104B32B2270/00B32B2307/412B32B2307/514B32B2307/7242B32B2439/70B32B2439/80C08J2323/26C08J2423/06C08J2429/04
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Quick Facts
Patent No.
US 10,589,493
App. No.
15/556,150
Granted
Mar 17, 2020
Kind
B2
Abstract

A multilayer structure is provided, which includes a layer containing a saponified ethylene-vinyl ester copolymer, and a layer of a thermoplastic resin other than the saponified ethylene-vinyl ester copolymer provided on at least one side of the saponified ethylene-vinyl ester copolymer-containing layer with the intervention of an adhesive resin layer. An interface layer having a thickness (X) of 50 to 400 nm is present in an interface between the saponified ethylene-vinyl ester copolymer-containing layer and the adhesive resin layer. Alternatively, a viscosity increase rate in the interface between the saponified ethylene-vinyl ester copolymer-containing layer and the adhesive resin layer is 0.1% to 8%. Therefore, the multilayer structure has long-run durability, and is less liable to have poor appearance even if being produced by a multilayer coextrusion method.

Claims (18)

1. A multilayer structure comprising:

a layer containing a saponified ethylene-vinyl ester copolymer;

a layer of a thermoplastic resin other than the saponified ethylene-vinyl ester copolymer provided on at least one side of the saponified ethylene-vinyl ester copolymer-containing layer; and

an adhesive resin layer provided between the saponified ethylene-vinyl ester copolymer-containing layer and the thermoplastic resin layer;

wherein an interface layer having a thickness (X) of 50 to 400 nm is present in an interface between the saponified ethylene-vinyl ester copolymer-containing layer and the adhesive resin layer;

wherein the saponified ethylene-vinyl ester copolymer-containing layer further contains 350 to 800 ppm of a zinc salt of a higher fatty acid based on an amount of the saponified ethylene-vinyl ester copolymer.

2. The multilayer structure according to claim 1 ,

wherein a thickness ratio between the saponified ethylene-vinyl ester copolymer-containing layer and the adhesive resin layer is 10/90 to 99/1.

3. The multilayer structure according to claim 1 ,

wherein the saponified ethylene-vinyl ester copolymer-containing layer includes a plurality of saponified ethylene-vinyl ester copolymer-containing layers and the adhesive resin layer includes a plurality of adhesive resin layers, and

wherein a thickness ratio between a thickest one of the saponified ethylene-vinyl ester copolymer-containing layers and a thickest one of the adhesive resin layers is 10/90 to 99/1.

4. The multilayer structure according to claim 1 , wherein the saponified ethylene-vinyl ester copolymer-containing layer has a thickness of 0.1 to 500 μm.

5. The multilayer structure according to claim 1 , wherein the adhesive resin layer has a thickness of 0.1 to 500 μm.

6. The multilayer structure according to claim 1 , wherein the saponified ethylene-vinyl ester copolymer is a mixture of two or more saponified ethylene-vinyl ester copolymers having different ethylene structural unit contents.

7. The multilayer structure according to claim 6 , wherein the two or more saponified ethylene-vinyl ester copolymers each have different ethylene structural unit contents, and

wherein the largest ethylene structural unit content of the two or more saponified ethylene-vinyl ester copolymers differs from the smallest ethylene structural unit content of the two or more saponified ethylene-vinyl ester copolymers by 10 to 25 mol % (ΔEt).

8. A packaging material comprising the multilayer structure according to claim 1 .

9. The multilayer structure according to claim 1 , wherein an adhesive resin of the adhesive resin layer has an absorbance ratio (α:β) of from 0.005:1 to 0.1:1.

Assignments (2)
MERGER Recorded May 2, 2019
From: THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD.
To: MITSUBISHI CHEMICAL CORPORATION
Reel/Frame 049110/0285 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2017
From: KOMURO, RYOHEI
To: THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD.
Reel/Frame 043509/0407 →
Priority Claims (2)
JP 2015-054224 · Mar 18, 2015 · national
JP 2015-069631 · Mar 30, 2015 · national
Continuity (1)
Related Publication 20180043664A1 · Feb 15, 2018