Method for attaching ceramic phosphor plates on light-emitting device (LED) dies using a dicing tape, method to form a dicing tape, and dicing tape
A method includes mounting a ceramic phosphor ( 102 ) on an acrylic-free and metal-containing catalyst-free tacky layer ( 108 ) of a dicing tape ( 104 ), dicing the ceramic phosphor ( 102 ) from the dicing tape ( 104 ) into ceramic phosphor plates ( 11 ) 2 , removing the ceramic phosphor plates ( 112 ) from the dicing tape ( 104 ), and attaching the ceramic phosphor plates ( 112 ) on light-emitting device (LED) dies.
1. A method, comprising:
dispensing a liquid material for an acrylic-free and metal-containing catalyst-free tacky layer onto a support film or another tacky layer of a dicing tape;
blade coating the liquid material on the support film or the other tacky layer to form the acrylic-free and metal-containing catalyst-free tacky layer;
placing a ceramic phosphor on the acrylic-free and metal-containing catalyst-free tacky layer of a dicing tape;
dicing the ceramic phosphor on the dicing tape into ceramic phosphor plates;
removing the ceramic phosphor plates from the dicing tape; and
attaching the ceramic phosphor plates onto light-emitting device (LED) dies.
2. The method of claim 1 , wherein the acrylic-free and metal-containing catalyst-free tacky layer comprises a silicone thermoforming resin free of acrylic and platinum and is free of a metal-containing catalyst comprising platinum, tin, or zinc.
3. The method of claim 1 , wherein the dicing tape is mounted on a tape frame.
4. The method of claim 1 , wherein:
the acrylic-free and metal-containing catalyst-free tacky layer comprises a photo-latent or photo-initiated amine catalyst; and
removing the ceramic phosphor plates comprises photo-developing the acrylic-free and metal-containing catalyst-free tacky layer to lower its adhesive bond to the ceramic phosphor plates.
5. The method of claim 1 , wherein attaching the ceramic phosphor plates on LED dies includes applying a high refractive index (HRI) silicone-based glue on the LED dies.
6. The method of claim 1 , wherein the other tacky layer comprises acrylic.
7. A method, comprising:
dispensing a liquid material for an acrylic-free and metal-containing catalyst-free tacky layer onto a support film or another tacky layer of a dicing tape;
over-molding the liquid material on the support film or the other tacky layer to form the acrylic-free and metal-containing catalyst-free tacky layer;
placing a ceramic phosphor on the acrylic-free and metal-containing catalyst-free tacky layer of a dicing tape;
dicing the ceramic phosphor on the dicing tape into ceramic phosphor plates;
removing the ceramic phosphor plates from the dicing tape; and
attaching the ceramic phosphor plates onto light-emitting device (LED) dies.
8. The method of claim 7 , wherein:
the acrylic-free and metal-containing catalyst-free tacky layer comprises a photo-latent or photo-initiated amine catalyst; and
removing the ceramic phosphor plates comprises photo-developing the acrylic-free and metal-containing catalyst-free tacky layer to lower its adhesive bond to the ceramic phosphor plates.
9. The method of claim 7 , wherein the acrylic-free and metal-containing catalyst-free tacky layer comprises a silicone thermoforming resin free of acrylic and platinum and is free of a metal-containing catalyst comprising platinum, tin, or zinc.
10. The method of claim 7 , wherein the dicing tape is mounted on a tape frame.
11. The method of claim 7 , wherein attaching the ceramic phosphor plates on LED dies includes applying a high refractive index (HRI) silicone-based glue on the LED dies.
12. The method of claim 7 , wherein the other tacky layer comprises acrylic.
13. A method, comprising:
extruding an acrylic-free and metal-containing catalyst-free tacky layer onto a support film or another tacky layer of a dicing tape through a roll-to-roll process;
placing a ceramic phosphor on the acrylic-free and metal-containing catalyst-free tacky layer;
dicing the ceramic phosphor on the dicing tape into ceramic phosphor plates;
removing the ceramic phosphor plates from the dicing tape; and
attaching the ceramic phosphor plates onto light-emitting device (LED) dies.
14. The method of claim 13 , wherein the acrylic-free and metal-containing catalyst-free tacky layer comprises a silicone thermoforming resin free of acrylic and platinum and is free of a metal-containing catalyst comprising platinum, tin, or zinc.
15. The method of claim 13 , wherein the dicing tape is mounted on a tape frame.
16. The method of claim 13 , wherein:
the acrylic-free and metal-containing catalyst-free tacky layer comprises a photo-latent or photo-initiated amine catalyst; and
removing the ceramic phosphor plates comprises photo-developing the acrylic-free and metal-containing catalyst-free tacky layer to lower its adhesive bond to the ceramic phosphor plates.
17. The method of claim 13 , wherein attaching the ceramic phosphor plates on LED dies includes applying a high refractive index (HRI) silicone-based glue on the LED dies.
18. The method of claim 13 , wherein the other tacky layer comprises acrylic.