IP Library Granted Patent US 10,532,401
Granted Patent B2
US 10,532,401 · App. 15/556,307 · Granted Jan 14, 2020

Liquid-cooling cold plate and method for manufacturing same

Inventors: Satoru Ujiie (Tokyo, JP); Takahiro Daikoku (Tokyo, JP)
Assignee: HITACHI KOKUSAI ELECTRIC INC.
B22D19/0072F28F9/0131H05K7/20254F28F2240/00
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Quick Facts
Patent No.
US 10,532,401
App. No.
15/556,307
Granted
Jan 14, 2020
Kind
B2
Abstract

In a method of manufacturing a liquid-cooling cold plate, cast molding is performed after embedding a metal pipe for supplying a cooling liquid inside a casting mold. Fixing brackets to be attached to the metal pipe is provided to maintain a positional relationship between a plurality of portions of the metal pipe embedded in the casting mold. The casting molding is performed by pouring molten metal into the casting mold while the fixing metal parts are attached to the metal pipe.

Claims (6)

1. A method of manufacturing a liquid-cooling cold plate, in which cast molding is performed after embedding a curved metal pipe for supplying a cooling liquid in a casting mold, and a heat-generating component is disposed on the cast molded metal pipe, the method comprising:

providing a plurality of pipe pressing portions in conformation with the shape of the curved metal pipe in positions which avoid portions directly below the heat-generating component for pressing and fixing the metal pipe at the casting mold, and

performing casting molding by pouring molten metal into the casting mold while sandwiching, pressing and fixing the metal pipe by the pipe pressing portions.

2. A liquid-cooling cold plate, in which cast molding is performed after embedding a curved metal pipe, and a heat-generating component is mounted directly above the cast molded metal pipe, comprising:

a pair of recesses configured to be provided in a plurality of positions which avoid portions directly below the heat-generating component,

wherein the metal pipe is pressed, fixed and sandwiched by the pair of recesses when the metal pipe is embedded in the liquid-cooling cold plate.

Assignments (3)
CHANGE OF ADDRESS Recorded May 15, 2025
From: HITACHI KOKUSAI ELECTRIC INC.
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 071275/0058 →
CHANGE OF NAME Recorded May 15, 2025
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI DENKI ELECTRIC INC.
Reel/Frame 071275/0236 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2017
From: UJIIE, SATORU; DAIKOKU, TAKAHIRO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 043514/0609 →
Priority Claims (1)
JP 2015-081660 · Apr 13, 2015 · national
Continuity (1)
Related Publication 20180078997A1 · Mar 22, 2018
Cited By (1)
US 12,296,651