LED lamp with internal mirror
The present disclosure provides a lamp assembly ( 200 ), comprising a base ( 202 ), an outer jacket ( 204 ) mounted to the base ( 202 ), a first reflective substrate ( 206, 208 ) positioned within the outer jacket ( 204 ), and a first solid-state light source ( 220 ) disposed proximate the first reflective substrate ( 206, 208 ). The outer jacket ( 204 ) may be glass. The outer jacket ( 204 ) may hermetically seal the first solid-state light source ( 220 ).
1. A lamp assembly, comprising:
a base;
an outer jacket mounted to the base;
a first reflective substrate positioned within the outer jacket, wherein the first reflective substrate comprises a specular reflective surface covering at least a portion of one or more faces of a circuit board, and electrical circuit components of an LED driver are mounted on at least one face of the circuit board; and
a first solid-state light source disposed proximate the first reflective substrate.
2. The lamp assembly of claim 1 , wherein the outer jacket is formed of glass.
3. The lamp assembly of claim 1 , wherein the outer jacket comprises a polymer.
4. The lamp assembly of claim 1 , wherein the outer jacket comprises a translucent ceramic.
5. The lamp assembly of claim 1 , wherein the first solid-state light source is an LED light source.
6. The lamp assembly of claim 1 , wherein the first solid-state light source is an LED filament light source.
7. The lamp assembly of claim 1 , wherein the first solid-state light source is mounted within a cutout of the first reflective substrate.
8. The lamp assembly of claim 1 , wherein the first reflective substrate has a combination of specular and diffuse surface reflectance.
9. The lamp assembly of claim 1 , further comprising:
a second reflective substrate positioned within the outer jacket; and
a second solid-state light source disposed on the second reflective substrate.
10. The lamp assembly of claim 9 , wherein the first reflective substrate is mounted on a first face of a printed circuit board and the second reflective substrate is mounted on a second face of the printed circuit board.
11. The lamp assembly of claim 10 , wherein the second reflective substrate is disposed in a stand-off relationship with the second face of the printed circuit board.
12. The lamp assembly of claim 1 , further comprising:
a second reflective substrate positioned within the outer jacket;
a second solid-state light source disposed on the second reflective substrate;
a third reflective substrate positioned within the outer jacket; and
a third solid-state light source disposed on the second reflective substrate.
13. The lamp assembly of claim 12 , wherein the first reflective substrate is mounted between the second and third reflective substrates and the first solid state light source is mounted within a cutout of the first reflective substrate.
14. The lamp assembly of claim 1 , wherein electrical circuit components of a dimmable LED driver are mounted on at least one face of the circuit board.
15. The lamp assembly of claim 1 , wherein the LED driver is electrically coupled to the solid state light source.
16. The lamp assembly of claim 1 , wherein the first solid-state light source and the electrical circuit components of an LED driver are hermetically sealed in the outer jacket.
17. The lamp assembly of claim 1 , wherein a heat conducting fluid comprising a non-oxidative gas is present in the lamp assembly and is hermetically sealed in the outer jacket.
18. The lamp assembly of claim 17 , wherein the heat conducting fluid comprises helium.
19. The lamp assembly of claim 1 , wherein the specular reflective surface comprises at least one of an interference thin film or a specular metal coating, covering at least a portion of one or more faces of a circuit board.
20. A lamp assembly, comprising:
a base;
an outer jacket mounted to the base;
a first reflective substrate positioned within the outer jacket, wherein the first reflective substrate comprises a specular reflective surface covering at least a portion of one or more faces of a circuit board, and electrical circuit components of an LED driver are mounted on at least one face of the circuit board; and
a first solid-state light source disposed proximate the first reflective substrate,
wherein the first solid-state light source and the electrical circuit components of the LED driver are hermetically sealed in the outer jacket, and
wherein a heat conducting fluid comprising a non-oxidative gas is present in the lamp assembly and is hermetically sealed in the outer jacket.