Organic optoelectronic component and method for producing an organic optoelectronic component
According to the present disclosure, a method for producing an optoelectronic component is provided. The method includes forming an organic first layer above a substrate, and forming an organic second layer above the first surface region. The first layer includes a surface. The surface is opposite the substrate and includes a first surface region and a second surface region. The second surface region surrounds the first surface region. The second surface region remains free of the second layer. The first layer and the second layer differ in their chemical composition.
1. A method for producing an optoelectronic component, the method comprising:
forming an organic first layer above a substrate, wherein the first layer comprises a surface;
wherein the surface is opposite the substrate and comprises a first surface region and a second surface region, wherein the second surface region surrounds the first surface region;
forming an organic second layer as second layer above the first surface region,
wherein the second surface region remains free of the second layer;
wherein the first layer and the second layer differ in their chemical composition.
2. The method as claimed in claim 1 ,
wherein the second layer comprises a solvent configured in such a way that it substantially does not dissolve a material of the first layer.
3. The method as claimed in claim 1 ,
wherein successively formed layers are processed from solvents respectively orthogonal to one another.
4. The method as claimed in claim 1 ,
wherein the first layer comprises a solvent which is orthogonal to the solvent of the second layer.
5. The method as claimed in claim 1 ,
wherein the first layer and the second layer are part of an organic light emitting diode.
6. The method as claimed in claim 1 ,
wherein the first layer and/or the second layer are/is part of an optically functional layer structure configured for converting electrical energy into electromagnetic radiation.
7. The method as claimed in claim 1 ,
wherein the first layer and/or the second layer are/is formed as a dissolving stop layer,
wherein the dissolving stop layer has a layer thickness of less than 20 nm.
8. The method as claimed in claim 1 ,
wherein the first layer and/or the second layer are/is formed as a metallization layer,
wherein the metallization layer comprises exposed contact regions.
9. The method as claimed in claim 1 , further comprising:
forming an encapsulation above the substrate, which encapsulation covers the first layer and the second layer.
10. The method as claimed in claim 1 ,
wherein wherein the first and second layers form a stair-stepped multi-layer structure.
11. The method as claimed in claim 2 ,
wherein the material of the first layer is a solvent of the first layer or is an organic material of the first layer which is dissolved in the solvent of the first layer.
12. The method as claimed in claim 2 ,
wherein successively formed layers are processed from solvents respectively orthogonal to one another.
13. The method as claimed in claim 2 ,
wherein the first layer comprises a solvent which is orthogonal to the solvent of the second layer.
14. The method as claimed in claim 3 ,
wherein the solvent of the first layer and the solvent of the second layer are in each case from the following group of solvent types:
polar solvent,
perfluorinated solvent,
aprotic polar solvent,
hydroxylic solvent, or
apolar organic solvent.
15. The method as claimed in claim 3 ,
wherein forming the first layer comprises extracting the solvent of the first layer at least partly from the layer in order to dry the first layer before the second layer is formed.
16. An optoelectronic component comprising:
a substrate;
an organic first layer, wherein the first layer comprises a surface;
wherein the surface is opposite the substrate and comprises a first surface region and a second surface region, wherein the second surface region surrounds the first surface region; and
an organic second layer above the first surface region, wherein the second surface region is free of the second layer;
wherein the first layer and the second layer differ in their chemical composition.
17. The optoelectronic component as claimed in claim 16 , wherein the second layer comprises a material which is soluble in a solvent, and wherein the first layer comprises a material which is substantially insoluble in the solvent.
18. The optoelectronic component as claimed in claim 16 , wherein the first layer comprises a solvent which is orthogonal to the solvent of the second layer.
19. A method for producing a layer stack, the method comprising:
forming a first layer from a first solution above a substrate, wherein the first layer comprises a surface;
wherein the surface is opposite the substrate and comprises a first surface region and a second surface region, wherein the second surface region surrounds the first surface region;
forming a second layer from a second solution above the first surface region,
wherein the second surface region remains free of the second layer;
wherein the first layer and the second layer differ in their chemical composition.
20. The method as claimed in claim 19 ,
wherein the second layer comprises a solvent configured in such a way that it substantially does not dissolve a material of the first layer and/or wherein successively formed layers are processed from solvents respectively orthogonal to one another.