Tin-plated product and method for producing same
There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 μm by electroplating, a tin-copper plating layer 12 containing tin 12 b mixed with a copper-tin alloy 12 a is formed thereon so as to have a thickness of 0.6 to 10 μm by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 μm or less by electroplating if necessary.
1. A tin-plated product comprising:
a substrate of copper or a copper alloy; and
a tin-copper plating layer formed on the substrate, the tin-copper plating layer containing a plurality of discontinuous portions of tin spaced from each other in a layer of a copper-tin alloy of Cu 6 Sn 5 , and the tin-copper plating layer having a thickness of 0.6 to 10 μm,
wherein the content of copper in the tin-copper plating layer is 5 to 35% by weight.
2. A tin-plated product as set forth in claim 1 , which further comprises a tin layer formed on said tin-copper plating layer, the tin layer having a thickness of 1 μm or less.
3. A tin-plated product as set forth in claim 1 , which further comprises a nickel layer formed between said substrate and said tin-copper plating layer, the nickel layer having a thickness of 0.1 to 1.5 μm.
4. A tin-plated product comprising:
a substrate of copper or a copper alloy;
a tin-copper plating layer formed on the substrate, the tin-copper plating layer containing a plurality of discontinuous portions of tin spaced from each other in a layer of a copper-tin alloy, and the tin-copper plating layer having a thickness of 0.6 to 10 μm; and
a tin layer formed on the tin-copper plating layer, the tin layer having a thickness of 1 μm or less,
wherein the content of copper in the tin-copper plating layer is 5 to 35% by weight.
5. A tin-plated product as set forth in claim 4 , which further comprises a nickel layer formed between said substrate and said tin-copper plating layer, the nickel layer having a thickness of 0.1 to 1.5 μm.