IC chip card with integrated biometric sensor pads
An integrated circuit (IC) chip card includes a card body and an integrated IC chip module located in a recess provided by the card body on one side thereof. The IC chip module includes a substrate having outward-facing and inward-facing surfaces, and a first plurality of contact pads supportably interconnected to the outward-facing surface of the substrate for contact engagement with at least one appendage of a user. The IC chip module further includes a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a biometric signal received therefrom. The IC chip module may also include a second plurality of contact pads supportably interconnected to the outward-facing surface of the substrate for engaging a contact card reader for contact communication signal transmissions and/or a first antenna supportably interconnected to the inward-facing surface of the substrate for contactless communication signal transmissions with a contactless card reader. Communication signal processing may be completed by the first IC chip and/or a second IC chip supportably interconnected to the inward-facing surface of the substrate.
1. A chip card comprising:
a card body and an integrated circuit (IC) chip module located in a recess provided by the card body on one side of the chip card-:-, wherein said IC chip module includes:
a substrate having outward-facing and inward-facing surfaces;
a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with at least one appendage of a user;
a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a biometric signal received therefrom; and,
a second plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact communication with a contact chip card reader; and,
a first antenna for contactless communication with a contactless chip card reader, wherein said first antenna is supportably interconnected to said inward-facing surface of said substrate of the IC chip module, wherein each of said first plurality of contact pads and second plurality of contact pads is electrically interconnected through said substrate to a different corresponding electrically conductive contact supportably interconnected to the inward-facing surface of the substrate, and wherein said first antenna is disposed in in non-overlapping relation to each of said contacts corresponding with said first plurality of contact pads and said second plurality of contact pads.
2. A chip card as recited in claim 1 , wherein said biometric signal is one of an electrocardiogram signal and fingerprint signal.
3. A chip card as recited in claim 2 , wherein said first plurality of contact pads include first and second pads spaced by at least a predetermined distance for separate engagement with first and second appendages of a user to provide an electrocardiogram signal to said first IC chip for processing.
4. A chip card as recited in claim 1 , further comprising:
a second IC chip supportably interconnected to the inward-facing surface of the substrate of the IC chip module and electrically interconnected to said second plurality of contact pads and said first antenna for processing contact communication signals to/from a contact chip card reader and contactless communication signals to/from a contactless chip card reader.
5. A chip card as recited in claim 1 , wherein said first and second plurality of contact pads are formed, together on said outward facing surface of said substrate by one or more production operations.
6. A chip card as recited in claim 1 , wherein said second plurality of contact pads are located within a predetermined area within said recess on said one side of the chip card, and said first plurality of contact pads are located outside of and adjacent to said predetermined area and within said recess on said one side of the chip card.
7. A chip card comprising:
card body and an integrated circuit (IC) chip module located in a recess provided by the card body on one side of the chip card, wherein said IC chip module includes:
a substrate having outward-facing and in-ward facing surfaces;
a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with at least one appendage of a user;
a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a biometric signal received therefrom; and
a second plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact communication with a contact chip card reader, wherein said second plurality of contact pads are located within a predetermined area within said recess on said one side of the chip card, and said first plurality of contact pads are located outside of and adjacent to said predetermined area and within said recess on said one side of the chip card, and wherein said first plurality of contact pads include first and second pads spaced by at least a predetermined distance that is greater than a distance between any two of said second plurality of contact pads.
8. A chip card as recited in claim 7 , wherein said second plurality of contact pads are located for electrical interconnection with said first IC chip in compliance with ISO/IEC Standard 7816-2.
9. A chip card as recited in claim 7 , wherein said IC chip module further comprises:
a second IC chip supportably interconnected to the inward-facing surface of the substrate of the IC chip module and electrically interconnected to said second plurality of contact pads for processing contact communication signals to and from a contact chip card reader.
10. A chip card as recited in claim 9 , wherein said second plurality of contact pads are located in compliance with ISO/IEC Standard 7816-2.
11. A chip card as recited in claim 9 , wherein said first IC chip is electrically interconnected to said first plurality of contact pads utilizing flip-chip interconnections.
12. A chip card as recited in claim 11 , wherein said second IC chip is electrically interconnected to said second plurality of contact pads utilizing wire-bonded interconnections.
13. A chip card as recited in claim 7 , further comprising:
a first antenna for contactless communication with a contactless chip card reader, wherein said first antenna is supportably interconnected to said inward-facing surface of said substrate of the IC chip module.
14. A chip card as recited in claim 13 , further comprising:
a second antenna for channeling electromagnetic waves received from a contactless chip card reader toward the first antenna, wherein the first antenna is operable to utilize said electromagnetic waves to power operation of said first IC chip.
15. A chip card as recited in claim 7 , wherein said first and second plurality of contact pads are formed together on said outward-facing surface of said substrate by one or more production operations.
16. A chip card comprising:
a card body and an integrated circuit (IC) chip module located in a recess provided by the card body on one side of the chip card, wherein said IC chip module includes:
a substrate having outward-facing and inward-facing surfaces;
a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with at least one appendage of a user;
a first IC chip supportably interconnected to the outward-facing surface of the substrate and electrically interconnect to the first plurality of contact pads for processing a biometric signal received therefrom; and
a second plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact communication with a contact chip reader, wherein said first and second plurality of contact pads are collectively located for electrical interconnection with said first IC chip in compliance with ISO/IEC Standard 7816-2.
17. A chip card as recited in claim 16 , wherein said first IC chip is electrically interconnected to said first and second plurality of contact pads utilizing wire-bonded interconnections.
18. A chip card as recited in claim 16 , wherein said IC chip module further comprises:
a second IC chip supportably interconnected to the inward-facing surface of the substrate of the IC chip module and electrically interconnected to said second plurality of contact pads for processing contact communication signals to and from contact chip card reader.
19. A chip card as recited in claim 16 , further comprising:
a first antenna for contactless communication with a contactless chip card reader, wherein said first antenna is supportably interconnected to said inward-facing surface of said substrate of the IC chip module.
20. A chip card as recited in claim 19 , further comprising:
a second antenna for channeling electromagnetic waves received from a contactless chip card reader toward the first antenna, wherein the first antenna is operable to utilize said electromagnetic waves to power operation of said first IC chip.
21. A chip card comprising:
a card body and an integrated circuit (IC) chip module located in a recess provided by the card body on one side of the chip card, wherein said IC chip module includes:
a substrate having outward-facing and inward-facing surfaces;
a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with at least one appendage of a user;
a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a biometric signal received therefrom; and,
a second plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact communication with a contact chip card reader; and,
a first antenna for contactless communication with a contactless chip card reader; and,
a metallic member for channeling electromagnetic waves received from a contactless chip card reader toward the first antenna, wherein the first antenna is operable to utilize said electromagnetic waves to power operation of said first IC chip.
22. A chip card as recited in claim 21 , wherein said first antenna is supportably interconnected to said inward-facing surface of the said substrate.
23. A chip card as recited in claim 21 , wherein each of said first plurality of contact pads and second plurality of contact pads is electrically interconnected through said substrate to a different corresponding electrically conductive contact supportably interconnected to the inward-facing surface of the substrate, and wherein said first antenna is disposed in non-overlapping relation to each of said contacts corresponding with said first plurality of contact pads and said second plurality of contact pads.
24. A chip card as recited in claim 23 , wherein said metallic member comprises:
a second antenna disposed in spaced relation to said first antenna and in non-overlapping relation to each of said contacts corresponding with said first and second plurality of contact pads.
25. A chip card as recited in claim 24 , wherein said second antenna comprises:
at least one outer loop and one inner loop, wherein said at least one outer loop extends about at least a portion of said at least one inner loop, and wherein the at least one inner loop is disposed in spaced relation to said first antenna and in non-overlapping relation to each of said contacts corresponding with said first and second plurality of contact pads.
26. A chip card as recited in claim 2 , wherein said card body comprises:
a prelaminated member that includes said second antenna laminated between first and second layers; and,
first and second core layers co-laminated to opposing sides of said prelaminated member, wherein said recess extends in to at least a portion of at least one of said first and second core layers on said one side of the chip card.
27. A chip card as recited in claim 26 , wherein said first plurality of contact pads are located within a predetermined area within said recess on said one side of the chip card, and said second plurality of contact pads are located outside of and adjacent to said predetermined area and within said recess on said one side of the chip card, and further comprising:
a second IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to said first plurality of contact pads, said first IC chip and said first antenna for processing contact and contactless communication signals, wherein the first antenna is operable to utilize said electromagnetic waves to power operation of said second IC chip.