IP Library Granted Patent US 11,217,741
Granted Patent B2
US 11,217,741 · App. 15/568,553 · Granted Jan 4, 2022

MEMS process power

Inventor: Robert Littrell (Boston, MA)
Assignee: Vesper Technologies Inc.
H01L41/0838B81B3/0072B81C1/00666C23C14/0641C23C14/14C23C14/34C23C14/542H01L41/04H01L41/083H01L41/1136H01L41/27H01L41/316H04R7/06H04R17/02H04R31/003B81B2201/0257B81B2203/0118B81C2201/017
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Quick Facts
Patent No.
US 11,217,741
App. No.
15/568,553
Granted
Jan 4, 2022
Kind
B2
Abstract

A transducer includes a first piezoelectric layer; and a second piezoelectric layer that is above the first piezoelectric layer; wherein the second piezoelectric layer is a more compressive layer with an average stress that is less than or more compressive than an average stress of the first piezoelectric layer.

Claims (23)

1. A transducer comprising:

a first piezoelectric layer; and

a second piezoelectric layer that is above the first piezoelectric layer;

wherein the first piezoelectric layer has non-uniform amount of residual stress that becomes more tensile as the thickness of the first piezoelectric layer increases, and the second piezoelectric layer has an average residual stress that is more compressive than an average residual stress of the first piezoelectric layer, or

wherein the first piezoelectric layer has non-uniform amount of residual stress that becomes more compressive as the thickness of the first piezoelectric layer increases, and the second piezoelectric layer has an average residual stress that is more tensile than an average residual stress of the first piezoelectric layer; and

wherein the first and second piezoelectric layers lie substantially flat.

2. The transducer of claim 1 , wherein a compressive layer is a layer that deflects downwards and wherein a tensile layer is a layer that deflects upwards.

3. The transducer of claim 1 , wherein the second piezoelectric layer is a more compressive layer with an average residual stress that is less than or more compressive than the average residual stress of the first piezoelectric layer.

4. The transducer of claim 1 , wherein the second piezoelectric layer is a more tensile layer with an average residual stress that is greater than or less compressive than the average residual stress of the first piezoelectric layer.

5. The transducer of claim 1 , wherein a vertical stress of the second piezoelectric layer offsets a vertical stress of the first piezoelectric layer to eliminate deflection in the transducer.

6. The transducer of claim 1 , wherein the transducer comprises a MEMS transducer, an acoustic transducer, a piezoelectric transducer or a microphone.

7. The transducer of claim 1 , further comprising a third intervening layer between the first and second piezoelectric layers.

8. The transducer of claim 7 , wherein the third intervening layer comprises a layer of molybdenum.

9. The transducer of claim 7 , wherein the average residual stress of the second piezoelectric layer compensates for a residual stress imparted by the third intervening layer.

10. The transducer of claim 1 , wherein the first and second piezoelectric layers form a cantilever.

11. The transducer of claim 1 , wherein the first and second piezoelectric layers comprise the same material.

12. The transducer of claim 11 , wherein the first and second piezoelectric layers comprise layers of aluminum nitride.

13. The transducer of claim 1 , wherein the first piezoelectric layer comprises a different material than the second piezoelectric material.

14. The transducer of claim 1 , wherein the second piezoelectric layer is fabricated by adjusting a bias power to a level that produces the average residual stress that compensates for the non-uniform amount of residual stress through the thickness of the first piezoelectric layer.

15. The transducer of claim 14 , wherein the level of the bias power is used throughout an entirety of the fabrication of the second piezoelectric material.

16. The transducer of claim 1 , wherein the second piezoelectric layer is fabricated by adjusting a gas flow rate to a level that produces the average residual stress that compensates for the non-uniform amount of residual stress through the thickness of the first piezoelectric layer.

17. The transducer of claim 1 , wherein the first and second piezoelectric layers lying substantially flat comprises the first and the second piezoelectric layers having less than a threshold amount of curvature or deflection.

18. The transducer of claim 1 , wherein the second piezoelectric layer comprises a non-uniform amount of vertical stress.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2025
From: QUALCOMM TECHNOLOGIES, INC.
To: QUALCOMM INCORPORATED
Reel/Frame 069818/0431 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 10, 2018
From: LITTRELL, ROBERT J.
To: VESPER TECHNOLOGIES INC.
Reel/Frame 045773/0038 →
Continuity (2)
Provisional Application 62152731 · Apr 24, 2015
Related Publication 20180159021A1 · Jun 7, 2018