A work machine including a flow device for flowing molten solder from under a circuit board, and a backup pin for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, which are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.
1. A work machine comprising:
a holding device configured to hold an electronic component having a lead and to insert the lead into a through-hole formed in a circuit board;
a flow device configured to flow molten solder from under the circuit board towards the lead inserted into the through-hole;
a first moving device configured to move the flow device to any position under the circuit board;
a support tool configured to support the circuit board from below when the lead is inserted into the through-hole; and
a second moving device configured to move the support tool to any position below the circuit board.
2. The work machine according to claim 1 , wherein the second moving device includes
a raising and lowering device configured to raise and lower the support tool under the circuit board, and
a horizontal direction moving device configured to move the support tool to any position on a horizontal plane that is perpendicular to a movement direction of the support tool due to the raising and lowering device,
wherein
the first moving device and the horizontal direction moving device are the same device, and
the first moving device moves the flow device to any position on the horizontal plane.
3. The work machine according to claim 2 , further comprising:
a control device configured to control operation of each of the holding device, the flow device, the first moving device, and the second moving device,
wherein
the control device includes an operation control section configured to selectively perform
a first mounting work of mounting the electronic component on the circuit board by using the flow device to flow molten solder towards the lead inserted into the through-hole, after the lead has been inserted into the through-hole in a state with the circuit board supported from below by the support tool, and
a second mounting work of mounting the electronic component on the circuit board by using the flow device to flow molten solder towards the lead inserted into the through-hole, after the lead has been inserted into the through-hole in a state without the circuit board supported from below by the support tool.
4. The work machine according to claim 1 , further comprising:
a control device configured to control operation of each of the holding device, the flow device, the first moving device, and the second moving device,
wherein
the control device includes an operation control section configured to selectively perform
a first mounting work of mounting the electronic component on the circuit board by using the flow device to flow molten solder towards the lead inserted into the through-hole, after the lead has been inserted into the through-hole in a state with the circuit board supported from below by the support tool, and
a second mounting work of mounting the electronic component on the circuit board by using the flow device to flow molten solder towards the lead inserted into the through-hole, after the lead has been inserted into the through-hole in a state without the circuit board supported from below by the support tool.