IP Library Granted Patent US 10,189,990
Granted Patent B2
US 10,189,990 · App. 15/569,146 · Granted Jan 29, 2019

Poly(phenylene ether) composition and article

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Quick Facts
Patent No.
US 10,189,990
App. No.
15/569,146
Granted
Jan 29, 2019
Kind
B2
Abstract

A composition includes specific amounts of a poly(phenylene ether), a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer, an organophosphate ester, and compound that improves adhesion to potting silicone sealant. The adhesion promoter can be a phenolic compound, a hydroxysilyl-terminated polydiorganosiloxane, or a combination thereof. The composition is particularly useful for molding parts of photovoltaic junction boxes that utilize potting silicone sealant as an internal electrical insulator.

Claims (66)

1. A composition comprising, based on the total weight of the composition:

61 to 89 weight percent of a poly(phenylene ether);

3 to 10 weight percent of a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer having a polystyrene content of 20 to 40 weight percent and a weight average molecular weight of 200,000 to 400,000 daltons;

6 to 12 weight percent of a flame retardant comprising an organophosphate ester; and

2 to 17 weight percent of an adhesion promoter selected from the group consisting of

(a) phenolic compounds having a molecular weight of 94 to 18,000 daltons;

(b) hydroxysilyl-terminated polydiorganosiloxanes of the formula

 wherein m is 2 to 50, and each occurrence of R 1 is independently C 1 -C 12 hydrocarbyl, provided that 5 to 60 mole percent of the occurrences of R 1 are independently C 6 -C 12 aryl; and

(c) combinations of the (a) phenolic compounds and the (b) hydroxysilyl-terminated polydiorganosiloxanes.

2. The composition of claim 1 , wherein the poly(phenylene ether) comprises a poly(2,6-dimethyl-1,4-phenylene ether) having an intrinsic viscosity of 0.3 to 0.5 deciliter per gram, measured at 25° C. in chloroform.

3. The composition of claim 1 , wherein the poly(phenylene ether) comprises a combination of a poly(phenylene ether) homopolymer and a poly(phenylene ether)-polysiloxane block copolymer, the combination having an intrinsic viscosity of 0.3 to 0.5 deciliter per gram, measured at 25° C. in chloroform.

4. The composition of claim 1 ,

wherein the poly(phenylene ether) comprises a poly(2,6-dimethyl-1,4-phenylene ether) having an intrinsic viscosity of 0.3 to 0.5 deciliter per gram, measured at 25° C. in chloroform;

wherein the organophosphate ester comprises resorcinol bis(diphenyl phosphate);

wherein the adhesion promoter is the phenolic compound, and wherein the phenolic compound comprises a polycarbonate having a number average molecular weight of 450 to 18,000 daltons, and a hydroxyaryl content of 450 to 35,000 parts per million by weight based the weight of hydroxyl groups and the total weight of the composition; and

wherein the composition comprises

70 to 80 weight percent of the poly(phenylene ether),

4 to 8 weight percent of the polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer,

7 to 11 weight percent of the flame retardant, and

4 to 12 weight percent of the adhesion promoter.

5. The composition of claim 1 ,

wherein the poly(phenylene ether) comprises a poly(2,6-dimethyl-1,4-phenylene ether) having an intrinsic viscosity of 0.3 to 0.5 deciliter per gram, measured at 25° C. in chloroform;

wherein the organophosphate ester comprises resorcinol bis(diphenyl phosphate);

wherein the adhesion promoter is the hydroxysilyl-terminated polydiorganosiloxane, and

wherein the hydroxysilyl-terminated polydiorganosiloxane comprises a hydroxysilyl-terminated poly(dimethylsiloxane-co-diphenylsiloxane); and

wherein the composition comprises

70 to 80 weight percent of the poly(phenylene ether),

4 to 8 weight percent of the polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer,

7 to 11 weight percent of the flame retardant, and

1 to 6 weight percent of the adhesion promoter.

6. The composition of claim 1 , wherein the adhesion promoter is the phenolic compound, and wherein the phenolic compound comprises a polycarbonate having a number average molecular weight of 450 to 18,000 daltons, and a hydroxyaryl content of 450 to 35,000 parts per million by weight based the weight of hydroxyl groups and the total weight of the composition.

7. The composition of claim 6 , wherein the polycarbonate has a hydroxyaryl content of 450 to 2,000 parts per million by weight.

8. The composition of claim 1 , wherein the adhesion promoter is the hydroxysilyl-terminated polydiorganosiloxane.

9. The composition of claim 8 , wherein the hydroxysilyl-terminated polydiorganosiloxane comprises a hydroxysilyl-terminated poly(dimethylsiloxane-co-diphenylsiloxane).

10. An article comprising,

an injection molded part, and

a cured potting silicone sealant in contact with a surface of the injection molded part;

wherein the injection molded part comprises a composition comprising

61 to 89 weight percent of a poly(phenylene ether);

3 to 10 weight percent of a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer having a polystyrene content of 20 to 40 weight percent and a weight average molecular weight of 200,000 to 400,000 daltons;

6 to 12 weight percent of a flame retardant comprising an organophosphate ester; and

2 to 17 weight percent of an adhesion promoter selected from the group consisting of

(a) phenolic compounds having a molecular weight of 94 to 18,000 daltons;

(b) hydroxysilyl-terminated polydiorganosiloxanes of the formula

 wherein m is 2 to 50, and each occurrence of R 1 is independently C 1 -C 12 hydrocarbyl, provided that 5 to 60 mole percent of the occurrences of R 1 are independently C 6 -C 12 aryl; and

(c) combinations of the (a) phenolic compounds and the (b) hydroxysilyl-terminated polydiorganosiloxanes.

11. The article of claim 10 , wherein the cured potting silicone sealant is the product of curing an uncured potting silicone sealant comprising a first polysiloxane comprising Si—H groups, a second polysiloxane comprising CH═CH 2 groups, and a catalyst effective to catalyze a reaction of the Si—H groups and the CH═CH 2 groups.

12. The article of claim 10 , wherein the article is a photovoltaic junction box.

13. The article of claim 10 ,

wherein the poly(phenylene ether) comprises a poly(2,6-dimethyl-1,4-phenylene ether) having an intrinsic viscosity of 0.3 to 0.5 deciliter per gram, measured at 25° C. in chloroform;

wherein the organophosphate ester comprises resorcinol bis(diphenyl phosphate);

wherein the adhesion promoter is the phenolic compound, and wherein the phenolic compound comprises a polycarbonate having a number average molecular weight of 450 to 18,000 daltons, and a hydroxyaryl content of 450 to 35,000 parts per million by weight based the weight of hydroxyl groups and the total weight of the composition; and

wherein the composition comprises

70 to 80 weight percent of the poly(phenylene ether),

4 to 8 weight percent of the polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer,

7 to 11 weight percent of the flame retardant, and

4 to 12 weight percent of the adhesion promoter.

14. The article of claim 10 ,

wherein the poly(phenylene ether) comprises a poly(2,6-dimethyl-1,4-phenylene ether) having an intrinsic viscosity of 0.3 to 0.5 deciliter per gram, measured at 25° C. in chloroform;

wherein the organophosphate ester comprises resorcinol bis(diphenyl phosphate);

wherein the adhesion promoter is the hydroxysilyl-terminated polydiorganosiloxane, and wherein the hydroxysilyl-terminated polydiorganosiloxane comprises a hydroxysilyl-terminated poly(dimethylsiloxane-co-diphenylsiloxane); and

wherein the composition comprises

70 to 80 weight percent of the poly(phenylene ether),

4 to 8 weight percent of the polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer,

7 to 11 weight percent of the flame retardant, and

2 to 6 weight percent of the adhesion promoter.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE THE APPLICATION NUMBER 15039474 PREVIOUSLY RECORDED AT REEL: 054528 FRAME: 0467. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 23, 2021
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 057453/0680 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2020
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 054528/0467 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2018
From: ZHANG, FEN; GUO, MINGCHENG
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 044756/0338 →