Light-Emitting Component and Method for Producing a Light-Emitting Component

1 - 16 . (canceled)

17 . A light-emitting component comprising:

a layer sequence for generating light,

wherein the layer sequence comprises a marking, and

wherein the marking is formed as a luminescence degradation of the layer sequence.

18 . The light-emitting component according to claim 17 , wherein the layer sequence for generating light is aged in a targeted manner in a region of the marking.

19 . The light-emitting component according to claim 17 , wherein, when the light-emitting component is in normal operation, the marking has a reduced electroluminescence compared to a region of the layer sequence that is free of the marking.

20 . The light-emitting component according to claim 17 , wherein the marking has a reduced photoluminescence under UV irradiation compared to a region of the layer sequence that is free of the marking.

21 . The light-emitting component according to claim 17 , wherein the layer sequence includes at least one organic layer.

22 . The light-emitting component according to claim 21 , wherein the at least one organic layer comprises the marking.

23 . The light-emitting component according to claim 21 , wherein the organic layer is defective or destroyed in a targeted manner in a region of the marking.

24 . The light-emitting component according to claim 17 , wherein the marking is formed intrinsically with respect to the light-emitting component so that an outer surface of the light-emitting component is free of the marking.

25 . The light-emitting component according to claim 17 , wherein the marking includes a plurality of degraded regions, the degraded regions are separated from one another by non-degraded regions.

26 . The light-emitting component according to claim 17 , wherein the marking includes a coding.

27 . The light-emitting component according to claim 17 , wherein a lateral extent of the marking is between 1 μm*1 μm and 150 μm*150 μm.

28 . A method for producing a light-emitting component having a layer sequence for generating radiation, the method comprising:

forming a marking by coherent radiation, wherein the marking comprises a luminescence degradation in the layer sequence.

29 . The method according to claim 28 , wherein a wavelength of the coherent radiation is between 150 nm and 550 nm.

30 . The method according to claim 28 , further comprising:

forming a first electrode on the layer sequence, wherein the first electrode extends at least partially over the layer sequence in a lateral direction;

forming the marking in the layer sequence in a vertical direction from a side of the layer sequence that faces away from the first electrode; and

after forming the marking in the layer sequence, forming a second electrode on the layer sequence on the side of the layer sequence facing away from the first electrode in the vertical direction so that the second electrode at least partially extends over the layer sequence in the lateral direction.

31 . The method according to claim 28 , further comprising:

forming an auxiliary layer that at least partially extends over the layer sequence in the lateral direction; and

forming the marking in the layer sequence in a vertical direction through the auxiliary layer from a side of the layer sequence that faces the auxiliary layer.

32 . The method according to claim 28 , further comprising:

providing a substrate that at least partially extends over the layer sequence in the lateral direction; and

forming the marking in the layer sequence in a vertical direction through the substrate from a side of the layer sequence that faces the substrate.

33 . The method according to claim 28 , wherein the marking includes a coding, and wherein a lateral extent of the marking is at most 150 μm*150 μm.

34 . A light-emitting component comprising:

a layer sequence for generating light,

wherein the layer sequence comprises a marking,

wherein the marking is formed as a luminescence degradation of the layer sequence,

wherein the marking includes a coding, and

wherein a lateral extent of the marking is at most 150 μm*150 μm.