Light emitting diode assembly using thermal pyrolytic graphite for thermal management
A light emitting diode assembly comprising such thermal management assembly is shown and described herein. The light emitting diode assembly may comprise a light emitting diode in thermal contact with a heat spreader. The heat spreader may comprise a core and/or fins. The core and/or fins comprise a thermal pyrolytic graphite material. The thermal management assembly comprising the core and/or fins can dissipate heat from the light emitting diode.
1. A light emitting diode assembly comprising at least one light emitting diode and a thermal management assembly, the thermal management assembly comprising:
a body member in thermal communication with the light emitting diode; and
a fin member extending from and in thermal communication with the body member,
wherein the fin member partially comprises a thermal pyrolytic graphite material disposed between a first substrate and a second substrate, and
wherein the fin member further comprises interlayers disposed between the thermal pyrolytic graphite and the first substrate, and between the thermal pyrolytic graphite and the second substrate, wherein the interlayers comprise a metal-based material and form a carbide with the thermal pyrolytic graphite.
2. The light emitting diode assembly of claim 1 , wherein the light emitting diode assembly comprises a thermal management assembly for an automotive headlight device.
3. The light emitting diode assembly of claim 1 , the metal-based material of the interlayers of the fin member comprises an activating material that is chosen from titanium, zirconium, hafnium, aluminum, tantalum, iron, silicon, or a combination of two or more thereof to form the carbide.
4. The light emitting diode assembly of claim 1 , wherein the first substrate and the second substrate of the fin member are independently formed from (i) a metal chosen from copper, aluminum, tungsten, molybdenum, nickel, iron, tin, silver, gold, beryllium, or an alloy of two or more thereof, or (ii) a ceramic material chosen from a silicon nitride, a silicon carbide, an aluminum nitride, an aluminum oxide, a beryllium oxide, or boron nitride.
5. The light emitting diode assembly of claim 1 , wherein the body member comprises a thermal pyrolytic graphite material disposed between a first substrate and a second substrate.
6. The light emitting diode assembly of claim 5 , wherein the body comprises an interlayer disposed between the thermal pyrolytic graphite and the first substrate, and an interlayer disposed between the thermal pyrolytic graphite and the second substrate, wherein the interlayers comprise a metal-based material and form a carbide with the thermal pyrolytic graphite.
7. The light emitting diode assembly of claim 6 , wherein the interlayers of the body comprise a metal based material comprising an activating material that is chosen from titanium, zirconium, hafnium, aluminum, tantalum, iron, silicon, or a combination of two or more thereof to form a carbide.
8. The light emitting diode assembly of claim 6 , wherein the first substrate and the second substrate of the body are independently formed from (i) a metal chosen from copper, aluminum, tungsten, molybdenum, nickel, iron, tin, silver, gold, beryllium, or an alloy of two or more thereof, or (ii) a ceramic material chosen from a silicon nitride, a silicon carbide, an aluminum nitride, an aluminum oxide, a beryllium oxide, or boron nitride.
9. A light emitting diode assembly, comprising:
at least one light emitting diode;
a body member in thermal communication with the at least one light emitting diode; and
at least one fin member extending from and in thermal communication with the body member,
wherein a fin member of the at least one fin member partially comprises a thermal pyrolytic graphite material disposed between a first substrate and a second substrate, and
wherein the fin member further comprises interlayers disposed between the thermal pyrolytic graphite and the first substrate, and between the thermal pyrolytic graphite and the second substrate, wherein the interlayers comprise a metal-based material.
10. The light emitting diode assembly of claim 9 , wherein the body member further comprises an electrical connection coupled to the at least one light emitting diode.
11. The light emitting diode assembly of claim 9 , wherein the metal-based material of the interlayers of the fin member comprises an activating material that is chosen from titanium, zirconium, hafnium, aluminum, tantalum, iron, silicon, or a combination of two or more thereof to form a carbide.
12. The light emitting diode assembly of claim 9 , wherein the first substrate and the second substrate of the fin member are independently formed from (i) a metal chosen from copper, aluminum, tungsten, molybdenum, nickel, iron, tin, silver, gold, beryllium, or an alloy of two or more thereof, or (ii) a ceramic material chosen from a silicon nitride, a silicon carbide, an aluminum nitride, an aluminum oxide, a beryllium oxide, or boron nitride.
13. The light emitting diode assembly of claim 9 , wherein the body member comprises a thermal pyrolytic graphite material disposed between a first substrate and a second substrate.
14. The light emitting diode assembly of claim 13 , wherein the body comprises an interlayer disposed between the thermal pyrolytic graphite and the first substrate, and an interlayer disposed between the thermal pyrolytic graphite and the second substrate, wherein the interlayers of the body comprise a metal-based material and form a carbide with the thermal pyrolytic graphite.
15. The light emitting diode assembly of claim 14 , wherein the interlayers of the body comprise a metal based material comprising an activating material that is chosen from titanium, zirconium, hafnium, aluminum, tantalum, iron, silicon, or a combination of two or more thereof.
16. The light emitting diode assembly of claim 13 , wherein the first substrate and the second substrate of the body are independently formed from (i) a metal chosen from copper, aluminum, tungsten, molybdenum, nickel, iron, tin, silver, gold, beryllium, or an alloy of two or more thereof, or (ii) a ceramic material chosen from a silicon nitride, a silicon carbide, an aluminum nitride, an aluminum oxide, a beryllium oxide, or boron nitride.