Method of machining a lead frame, and lead frame

1. A method of processing a lead frame having at least one electrically conductive contact section, comprising:

forming a depression in the at least one electrically conductive contact section so that a first electrically conductive contact subsection and a second electrically conductive contact subsection are formed, which are delimited from one another by the depression, wherein the depression has a bottom via which an electrically conductive connection between the first electrically conductive contact subsection and the second electrically conductive contact subsection is established, and

forming a housing made of a housing material, which housing comprises a housing frame that at least partially embeds the lead frame, formation of the housing comprising introduction of housing material into the depression so that a housing frame section formed by the housing material introduced into the depression is formed between the first and second electrically conductive contact subsections to mechanically stabilize the first and second electrical conductive contact subsections by the housing frame section.

2. The method according to claim 1 , wherein formation of the housing frame section comprises formation of an adhesive barrier section arranged outside the depression so that the housing frame section comprises an adhesive barrier section arranged outside the depression.

3. The method according to claim 1 , wherein, in a plurality of electrically conductive contact sections, they are at least partially connected by at least one mechanical stabilizing element, which is at least partially embedded in the housing frame during formation of the housing.

4. The method according to claim 3 , wherein the at least one mechanical stabilizing element is removed after formation of the housing.

5. The method according to claim 3 , wherein the at least one mechanical stabilizing element is removed after formation of the housing, and removal comprises etching.

6. The method according to claim 3 , wherein the at least one mechanical stabilizing element is removed after formation of the housing, the removal comprises etching, and a region intended to remain free from etching is provided with etching protection.

7. The method according to claim 3 , wherein the at least one mechanical stabilizing element is removed after formation of the housing, the removal comprises etching, and etching comprises dry etching and/or wet etching.

8. The method according to claim 3 , wherein the at least one mechanical stabilizing element is removed after formation of the housing, the removal comprises etching, the etching comprises dry etching and/or wet etching, and the dry etching comprises chlorine etching and/or the wet etching comprises etching by HCl and FeCl.

9. The method according to claim 3 , wherein the at least one mechanical stabilizing element is removed after formation of the housing, the removal comprises etching, and the electrically conductive contact section is partially coated with a metal before the formation of the housing to form a metal coating, a region to be etched remaining free from the metal layer coating.

10. The method according to claim 1 , comprising separation of the first and second electrically conductive contact subsections from one another so that the first and second electrically conductive contact subsections are electrically insulated from one another.

11. The method according to claim 10 , wherein separation comprises etching.

12. The method according to claim 1 , wherein formation of the depression comprises etching.

13. A lead frame, comprising:

at least one electrically conductive contact section,

wherein a depression is formed in the at least one electrically conductive contact section,

so that a first electrically conductive contact subsection and a second electrically conductive contact subsection are formed, which are delimited from one another by the depression,

the lead frame is at least partially embedded in a housing frame of a housing made of a housing material,

the housing frame comprises a housing frame section formed by a housing material between the first and second electrically conductive contact subsections introduced into the depression to mechanically stabilize the first and second electrical conductive contact subsections by the housing frame section, and

the first and second electrically conductive contact subsections are separated from one another so that the first and second electrically conductive contact subsections are electrically insulated from one another due to a removal of the depression.

14. The lead frame according to claim 13 , wherein the housing frame section comprises an adhesive barrier section arranged outside the depression.

15. The lead frame according to claim 13 , wherein a plurality of first and second electrically conductive contact subsections are formed, a plurality of the first and/or second electrically conductive contact subsections respectively having an anchoring element, others of the first and/or second electrically conductive contact subsections being free from an anchoring element.

16. An optoelectronic lighting device, comprising an optoelectronic semiconductor component and the lead frame according to claim 13 , wherein the semiconductor component is arranged on one of the first and second electrically conductive contact subsections, an electrically conductive connection being formed between the optoelectronic semiconductor component and the other of the first and second electrically conductive contact subsections.