Method of producing a housing cover, method of producing an optoelectronic component, and optoelectronic component

1. A method of producing a housing cover comprising:

providing a cover blank having a mounting surface formed on an underside;

connecting the underside of the cover blank to a silicon slice;

creating at least one opening in the silicon slice to expose at least a part of the mounting surface;

arranging a base metallization on the exposed part of the mounting surface; and

removing the silicon slice.

2. The method according to claim 1 , further comprising, after arrangement of the base metallization, arranging a solder metallization on the base metallization.

3. The method according to claim 2 , wherein the solder metallization comprises AuSn.

4. The method according to claim 2 , wherein arranging the solder metallization is performed by a galvanic process, a vapor deposition or immersion in liquid solder.

5. The method according to claim 1 , wherein the cover blank comprises a glass.

6. The method according to claim 1 ,

wherein the cover blank is provided in an interconnected assembly along with further cover blanks, and

the method further comprises dividing up the interconnected assembly.

7. The method according to claim 1 ,

wherein the cover blank is provided with a cavity arranged on the underside, and

the mounting surface is arranged on a wall enclosing the cavity.

8. The method according to claim 1 , wherein providing the cover blank comprises polishing the mounting surface.

9. The method according to claim 1 , wherein connecting the cover blank to the silicon slice is performed by anodic bonding.

10. The method according to claim 1 wherein creating the opening in the silicon slice is performed by a wet-chemical or dry-chemical etching process.

11. The method according to claim 1 , wherein the base metallization comprises TiPtAu.

12. The method according to claim 1 , wherein arranging the base metallization is performed by a cathode sputtering process or a vapor deposition.

13. The method according to claim 1 , wherein removing the silicon slice is performed by an etching process.

14. The method according to claim 1 , wherein removing the silicon slice is performed by etching with KOH.

15. A method of producing an optoelectronic component comprising:

providing a lower housing part of an optoelectronic component;

producing a housing cover by the method according to claim 1 ; and

connecting the housing cover to the lower housing part.

16. The method according to claim 15 , wherein connecting the housing cover to the lower housing part is performed by eutectic soldering.

17. The method according to claim 15 , wherein the lower housing part is provided with a coating comprising gold.