Methods for producing an etch resist pattern on a metallic surface
Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include applying a composition comprising a first reactive component onto a metallic surface to form a primer layer; and image-wise printing by a nonimpact printing process on the primer layer another composition comprising a second reactive component to produce an etch-resist mask, wherein when droplets of the second composition contact the primer layer, the reactive components undergo a chemical reaction so as to immobilize the droplets. The set may include a first liquid composition comprising a fixating reactive component and a second liquid composition comprising an etch-resist reactive component, wherein the fixating reactive component and the fixating reactive component are capable undergoing a chemical reaction to form a bi-component material that is insoluble in water and in an acidic etch solution.
1. A two-part ink composition set for applying an etch-resist mask on a metallic layer, the two-part ink composition set comprising:
a first aqueous composition comprising a first reactive polymer; and
a second aqueous composition comprising a second reactive polymer,
wherein the first and second reactive polymers are capable of undergoing a chemical reaction with each other to form a bi-component material that is insoluble in water and in an acidic etch solution,
wherein one of the first and second polymers comprises a cationic component,
wherein the other of the first and second polymers comprises an anionic component, and
wherein the chemical reaction occurs between the cationic and anionic components.
2. The two-part ink composition set of claim 1 , wherein the first reactive polymer comprises one or more of a polyethyleneimine, a heteropolymer of vinyl pyrrolidone, a poly-quaternary amine, and a polyamine in a natural form or as an ammonium salt.
3. The two-part ink composition set of claim 1 , wherein the second reactive polymer comprises one or both of acrylate and styrene acrylate.
4. The two-part ink composition set of claim 1 , wherein the second aqueous composition further comprises a dye.
5. The two-part ink composition set of claim 1 , wherein the first and second reactive polymers are capable of undergoing the chemical reaction with each other in response to deposition of the second aqueous composition on the first aqueous composition.
6. A method of applying an etch mask on a metallic layer using the two-part ink composition set of claim 1 , the method comprising:
depositing the first aqueous composition onto the metallic layer of a substrate; and
depositing the second aqueous composition onto the first aqueous composition in a mask pattern,
wherein the depositing the second aqueous composition causes a chemical reaction between the first reactive polymer of the first aqueous composition and the second reactive polymer of the second aqueous composition to form the bi-component material in the mask pattern on the metallic layer of the substrate.
7. The method of claim 6 , further comprising removing one or more additional components of the first aqueous composition deposited on the metallic layer that do not undergo the chemical reaction.
8. The method of claim 7 , wherein removing the one or more additional components of the first aqueous composition and the depositing of an etch solution are performed concurrently.
9. The method of claim 6 , wherein the first aqueous composition, the second aqueous composition, or both are deposited by inkjet printing.
10. The method of claim 6 , wherein one of the first reactive polymer and the second reactive polymer comprises one or more of a polyethyleneimine, a heteropolymer of vinyl pyrrolidone, a poly-quaternary amine, and a polyamine in a natural form or as an ammonium salt.
11. The method of claim 6 , wherein one of the first reactive polymer and the second reactive polymer comprises comprising one or both of an acrylate and a styrene acrylate.
12. The method of claim 6 , further comprising drying the first aqueous composition deposited on the metallic layer before depositing the second aqueous composition.
13. The method of claim 6 , wherein the metallic layer comprises copper.
14. The method of claim 6 , wherein the second aqueous composition further comprises a dye.
15. The method of claim 6 , wherein the first aqueous composition is deposited to form a continuous layer of the first aqueous composition on the metallic layer.
16. The method of claim 6 , wherein the first aqueous composition is deposited in the mask pattern.
17. The method of claim 6 , wherein the first aqueous composition is deposited onto the metallic layer using a coating process.
18. The method of claim 6 , further comprising removing the metallic layer in regions not protected by the bi-component material in the mask pattern by applying an etch solution.
19. The method of claim 18 , further comprising removing the bi-component material in the mask pattern after depositing the etch solution.