Component mounting apparatus and suction position setting method

1. A component mounting apparatus which sucks a component and mounts the component on a substrate, the apparatus comprising:

component supplying means for supplying the component by intermittently feeding an accommodation member, on which a plurality of accommodation sections for accommodating the component are formed, in a predetermined direction;

suction position setting means for setting a suction position that is offset from a reference position on the accommodation member, which is reference for suction of the component, in a direction toward a side of the accommodation section to which the component moves within the accommodation section due to the feeding of the accommodation member, the suction position based on a difference between a dimension of the accommodation section in the predetermined direction and a dimension of the component accommodated in the accommodation section in the predetermined direction; and

component mounting means for sucking the component supplied by the component supplying means at the suction position to pick up the component from the accommodation section and mounting the component onto the substrate.

2. The component mounting apparatus according to claim 1 ,

wherein the suction position setting means sets the suction position that is offset with respect to the reference position in the direction toward the side by the half of the difference.

3. The component mounting apparatus according to claim 1 , further comprising:

imaging means for imaging the component from below before the component that is picked up from the accommodation section by the component mounting means is mounted on the substrate,

wherein the suction position setting means obtains a positional deviation amount of the component with respect to the suction position based on an image captured by the imaging means and sets the suction position by correcting the offset position based on the positional deviation amount.

4. A suction position setting method for a component mounting apparatus which supplies a component by intermittently feeding an accommodation member, on which a plurality of accommodation sections for accommodating the component are formed, in a predetermined direction, sucks the supplied component at a suction position to pick up the component from the accommodation section, and mounts the component onto a substrate, the method comprising:

setting the suction position that is offset from a reference position on the accommodation member, which is reference for suction of the component, in a direction toward a side of the accommodation section to which the component moves within the accommodation section due to the feeding of the accommodation member, the suction position based on a difference between a dimension of the accommodation section in the predetermined direction and a dimension of the component accommodated in the accommodation section in the predetermined direction.

5. A component mounting apparatus which sucks a component and mounts the component on a substrate, the apparatus comprising:

component supplying device that supplies the component by intermittently feeding a carrier tape, on which a plurality of accommodation sections for accommodating the component are formed, in a predetermined direction; and

processing circuitry configured to

set a suction position that is offset from a reference position on the accommodation member, which is reference for suction of the component, in a direction toward a side of the accommodation section to which the component moves within the accommodation section due to the feeding of the accommodation member, the suction position based on a difference between a dimension of the accommodation section in the predetermined direction and a dimension of the component accommodated in the accommodation section in the predetermined direction; and

suck the component supplied by the component supplying device at the suction position to pick up the component from the accommodation section and mounting the component onto the substrate.

6. The component mounting apparatus according to claim 5 ,

wherein the processing circuitry sets the suction position that is offset with respect to the reference position in the direction toward the side by the half of the difference.

7. The component mounting apparatus according to claim 5 , further comprising:

a camera that images the component from below before the component that is picked up from the accommodation section by the component mounting device is mounted on the substrate,

wherein the processing circuitry obtains a positional deviation amount of the component with respect to the suction position based on an image captured by the camera and sets the suction position by correcting the offset position based on the positional deviation amount.

8. The component mounting apparatus according to claim 1 , wherein

the component mounting means includes a suction nozzle to suck the component and a mark camera configured to image the reference position and the component within the accommodation section, and

the suction position setting means determines the difference based on images from the mark camera.

9. The component mounting apparatus according to claim 5 , further comprising:

a mounting head controlled by the processing circuitry to suck the component supplied by the component supplying device at the suction position, the mounting head including a suction nozzle to suck the component and a mark camera configured to image the reference position and the component within the accommodation section,

wherein the processing circuitry determines the difference based on images from the mark camera.

10. The component mounting apparatus according to claim 1 , wherein

the accommodation member is a carrier tape and the reference position is a center of a feeding hole of the carrier tape.

11. The component mounting apparatus according to claim 5 , wherein

the reference position is a center of a feeding hole of the carrier tape.