IP Library Granted Patent US 11,031,536
Granted Patent B2
US 11,031,536 · App. 15/580,559 · Granted Jun 8, 2021

Vehicle battery thermoelectric device with integrated cold plate assembly and method of assembling same

Inventor: Shaun Peter McBride (Augsburg, DE)
Assignee: Gentherm Incorporated
H01L35/32H01L35/02H01M10/625H01M10/6572H01L35/08
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Quick Facts
Patent No.
US 11,031,536
App. No.
15/580,559
Granted
Jun 8, 2021
Kind
B2
Abstract

A cooling system for thermally conditioning a component which includes a battery and a heat spreader supporting the battery. Multiple thermoelectric devices are bonded to the heat spreader, for example, using solder or braze, which provides improved heat transfer. A cold plate assembly operatively thermally engages the thermoelectric devices.

Claims (27)

1. A cooling system for thermally conditioning a component, the cooling system comprising:

a battery;

a heat spreader supporting the battery;

multiple thermoelectric devices operatively secured to the heat spreader, wherein each of the multiple thermoelectric devices include pellets consisting of p-n materials, the pellets are directly secured to and between pads by a first solder having a first melting point, wherein one pad secured directly to one side of the pellets is secured to a cold side substrate by the first solder, and another pad secured to another side of the pellets is secured directly to a hot side substrate by the first solder;

a cold side plate is secured to the cold side substrate, the heat spreader operatively thermally engaging the thermoelectric device via the cold side plate, the cold side plate is secured to the heat spreader by a second solder having a second melting point that is less than the first melting point;

a hot side plate is secured to the hot side substrate;

a cold plate assembly operatively thermally engaging the thermoelectric devices via the hot side plate;

a thermal foil securing the cold plate assembly to the hot side plate; and

a DC/DC converter arranged in operative thermal engagement with the cold plate assembly.

2. The cooling system according to claim 1 , wherein the first melting point is in a range of 200° C.-260° C., and the second melting point is in a range of 110° C.-160° C.

3. A cooling system for thermally conditioning a component, the cooling system comprising:

a battery;

a heat spreader supporting the battery;

multiple thermoelectric devices operatively secured to the heat spreader, wherein each of the multiple thermoelectric devices include pellets consisting of p-n materials secured to and between pads by a solder, wherein one pad secured to one side of the pellets is secured to the heat spreader;

a hot side substrate secured to another pad secured to another side of the pellets;

a cold plate assembly operatively thermally engaging the hot side substrate; and

a DC/DC converter is mounted to and in operative thermal engagement with the cold plate assembly.

4. A cooling system for thermally conditioning a component, the cooling system comprising:

a battery;

a heat spreader supporting the battery;

multiple thermoelectric devices operatively secured to the heat spreader, wherein each of the multiple thermoelectric devices include pellets consisting of p-n materials, the pellets are secured to and between pads by a first solder having a first melting point, wherein one pad secured to one side of the pellets is secured to a cold side substrate by the first solder, and another pad secured to another side of the pellets is secured to a hot side substrate by the first solder;

a cold side plate is secured to the cold side substrate, the heat spreader operatively thermally engaging the thermoelectric device via the cold side plate, wherein the cold side plate is secured to the heat spreader by a second solder having a second melting point that is less than the first melting point;

a hot side plate is secured to the hot side substrate;

a cold plate assembly operatively thermally engaging the thermoelectric devices via the hot side plate;

a DC/DC converter mounted to and in thermal engagement with the cold plate assembly; and

a cooling loop that includes a heat exchanger in fluid communication with the cold plate assembly.

5. The cooling system according to claim 4 , wherein the first melting point is in a range of 200° C.-260° C., and the second melting point is in a range of 110° C.-160° C.

Assignments (2)
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Jun 28, 2019
From: GENTHERM INCORPORATED
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049627/0311 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2018
From: MCBRIDE, SHAUN PETER
To: GENTHERM INCORPORATED
Reel/Frame 045668/0019 →
Cited By (1)
US 12,442,569