Package for light emitting device and method for packaging the same
There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increase.
1. A light emitting apparatus comprising:
a circuit board comprising an electric circuit layer thereon;
a light emitting device chip on the circuit board, wherein the light emitting device chip is electrically connected to the circuit board;
a lens covering the light emitting device chip;
a first barrier disposed on the circuit board and around the light emitting device chip; and
a molding part comprising at least one kind of phosphor and disposed on, and in direct physical contact with, the light emitting device chip,
wherein the lens is completely spaced apart from the light emitting device chip and the molding part,
wherein the first barrier is disposed on a flat upper surface of the circuit board,
wherein the lens comprises a Fresnel lens,
wherein the light emitting device chip is electrically connected to the circuit board by flip chip bonding, and
wherein the lens comprises a substantially flat bottom surface,
wherein the substantially flat bottom surface is disposed above the first barrier,
wherein a material of the first barrier is different from all materials of the flat upper surface of the circuit board,
wherein the first barrier is disposed on the electric circuit layer of the circuit board,
wherein the electric circuit layer is disposed between the first barrier and the circuit board, and
wherein the first barrier is completely spaced apart from the flat upper surface of the circuit board.
2. The light emitting apparatus according to claim 1 , wherein the first barrier has a ring shape and wherein an outer circumference of the first barrier is substantially circular.
3. The light emitting apparatus according to claim 1 , wherein the lens has at least one of a concave shape, a convex shape, a trapezoidal shape, and an inverted pyramid shape.
4. The light emitting apparatus according to claim 1 , wherein the first barrier extends vertically away from the flat upper surface of the circuit board.
5. The light emitting apparatus according to claim 1 , wherein a top surface of the first barrier is lower than that of the molding part, and
wherein a top surface of the molding part is curved.
6. The light emitting apparatus according to claim 1 , comprising a second barrier on the flat upper surface of the circuit board and around the first barrier.
7. The light emitting apparatus according to claim 6 , wherein the second barrier is in direct physical contact with the lens.
8. The light emitting apparatus according to claim 1 , wherein the lens comprises a support extended from a bottom surface thereof, and
wherein a bottom surface of the molding part is flush with a bottom surface of the support.
9. The light emitting apparatus according to claim 6 , wherein a top surface of the first barrier is on a same second plane as a top surface of the second barrier, the same second plane being parallel to the flat upper surface of the circuit board.
10. The light emitting apparatus according to claim 1 , wherein a top surface of the first barrier is higher than that of the light emitting device chip.
11. The light emitting apparatus according to claim 1 , wherein the substantially flat bottom surface of the lens is directly over and facing the molding part in a vertical direction perpendicular to the flat upper surface of the circuit board.
12. The light emitting apparatus according to claim 6 , wherein a bottom surface of the first barrier disposed on the flat upper surface of the circuit board is on a same first plane as a bottom surface of the second barrier disposed on the flat upper surface of the circuit board, the same first plane being parallel to the flat upper surface of the circuit board.
13. A light emitting apparatus comprising:
a circuit board comprising an electric circuit layer and an insulating layer, wherein the electric circuit layer is disposed on the insulating layer;
a plurality of light emitting device chips on the board, wherein each light emitting device chip of the plurality of light emitting device chips is electrically connected to the board by flip chip bonding;
a lens unit comprising a plurality of Fresnel lenses;
a first barrier disposed around the plurality of light emitting device chips and in direct physical contact with the lens unit;
a second barrier on a flat upper surface of the circuit board and around the first barrier; and
a molding part comprising at least one kind of phosphor and disposed on, and in direct physical contact with, the light emitting device chip of the plurality of light emitting device chips,
wherein the lens unit is spaced apart from each light emitting device chip of the plurality of light emitting device chips,
wherein the lens unit covers the plurality of light emitting device chips,
wherein a material of the first barrier is different from all materials of the flat upper surface of the circuit board at a portion of the circuit board with which the first barrier is in direct contact, and
wherein a bottom surface of the first barrier disposed on the flat upper surface of the circuit board is on a same first plane as a bottom surface of the second barrier disposed on the flat upper surface of the circuit board, the same first plane being parallel to the flat upper surface of the circuit board.
14. The light emitting apparatus according to claim 13 , wherein each Fresnel lens of the plurality of Fresnel lenses has a middle convex-shaped portion, and left and right symmetric portions.
15. The light emitting apparatus according to claim 13 , wherein the barrier comprises polycarbonate (PC).
16. The light emitting apparatus according to claim 13 , wherein the lens unit comprises a flat lower surface directly over and facing the molding part in a vertical direction perpendicular to the flat upper surface of the circuit board.
17. The light emitting apparatus according to claim 13 , wherein a top surface of the first barrier is on a same second plane as a top surface of the second barrier, the same second plane being parallel to the flat upper surface of the circuit board.
18. A light emitting apparatus comprising:
a circuit board comprising an electric circuit layer and an insulating layer, wherein the electric circuit layer is disposed on the insulating layer;
a light emitting device chip on the board, wherein the light emitting device chip is electrically connected to the circuit board;
a first barrier disposed around the light emitting device chip;
a molding part comprising at least one kind of phosphor and disposed on, and in direct physical contact with, the light emitting device chip,
a lens unit comprising a plurality of Fresnel lenses; and
a second barrier disposed outside of the molding part and the first barrier,
wherein the circuit board comprises a flat upper surface,
wherein the lens unit is spaced apart from the light emitting device chip, and the molding part,
wherein the lens unit is in direct physical contact with the second barrier,
wherein the light emitting device chip is electrically connected to the board by flip chip bonding,
wherein a material of the first barrier is different from all materials of the flat upper surface of the circuit board at a portion of the circuit board with which the first barrier is in direct contact, and
wherein a bottom surface of the first barrier disposed on the flat upper surface of the circuit board is on a same first plane as a bottom surface of the second barrier disposed on the flat upper surface of the circuit board, the same first plane being parallel to the flat upper surface of the circuit board.
19. The light emitting apparatus according to claim 18 , wherein each Fresnel lens of the plurality of Fresnel lenses has a middle convex-shaped portion, and left and right symmetric portions.
20. The light emitting apparatus according to claim 18 , wherein the second barrier comprises polycarbonate (PC).
21. The light emitting apparatus according to claim 18 , wherein the lens unit comprises a flat lower surface directly over and facing the molding part in a vertical direction perpendicular to the flat upper surface of the circuit board.
22. The light emitting apparatus according to claim 18 , wherein a top surface of the first barrier is on a same second plane as a top surface of the second barrier, the same second plane being parallel to the flat upper surface of the circuit board.