Thermally interfacing chip on glass assembly
In one example embodiment, an optoelectronic assembly includes an electronic substrate, a transparent component coupled on a first side of the electronic substrate, and a first component coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure. A laser array or a receiver array may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component.
1. An optoelectronic assembly, comprising:
a transparent component that extends between a first surface and an oppositely positioned second surface;
a laser array coupled to the second surface of the transparent component, the laser array oriented to transmit optical signals through the transparent component;
a receiver array coupled to the second surface of the transparent component, the receiver array oriented to receive optical signals through the transparent component;
an electronic substrate mechanically coupled to the transparent component;
a first component coupled to the electronic substrate opposite the transparent component, the first component defining a receptacle; and
a second component positioned between the first component and the transparent component in the receptacle defined by the first component, a first continuous surface of the second component coupled to both the laser array and the receiver array by a thermal interface material, the thermal interface material being softer than the first component and the second component, and a second surface of the second component coupled to the first component by solder, the second surface of the second component positioned opposite the first surface of the second component.
2. The optoelectronic assembly of claim 1 , wherein the electronic substrate is mechanically coupled to the transparent component with second solder, the second solder having a melting point different than a melting point of the solder.
3. The optoelectronic assembly of claim 1 , wherein the transparent component is coupled to the second component by adhesive positioned therebetween.
4. The optoelectronic assembly of claim 1 , further comprising a redistribution layer positioned on the second surface of the transparent component, the redistribution layer electrically coupled to at least the electronic substrate and the laser array or the receiver array.
5. The optoelectronic assembly of claim 4 , further comprising an electronic component coupled to the second surface of the transparent component, the electronic component electrically coupled to the laser array or the receiver array by the redistribution layer.
6. The optoelectronic assembly of claim 4 , further comprising a passive component coupled to the second surface of the transparent component, the passive component electrically coupled to the redistribution layer.
7. The optoelectronic assembly of claim 4 , further comprising one or more lenses positioned on the first surface of the transparent component, the laser array oriented to transmit optical signals through at least one of the lenses, and the receiver array oriented to receive optical signals through at least another one of the lenses.
8. An optoelectronic assembly, comprising:
an electronic substrate;
a transparent component coupled on a first side of the electronic substrate;
a first component coupled to a second side of the electronic substrate opposite the first side;
wherein the electronic substrate, the transparent component, and the first component define a hermetically sealed enclosure;
a laser array and a receiver array mechanically coupled to the transparent component inside of the enclosure and oriented to transmit and receive optical signals through the transparent component, respectively, the laser array and the receiver array electrically coupled to the electronic substrate; and
a second component positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component and a first continuous surface of the second component coupled to both the laser array and the receiver array.
9. The optoelectronic assembly of claim 8 , further comprising a first solder forming a second interface between the second component and the first component.
10. The optoelectronic assembly of claim 9 , further comprising a redistribution layer positioned on a surface of the transparent component, the redistribution layer electrically coupled to at least the electronic substrate and the laser array or the receiver array.
11. The optoelectronic assembly of claim 10 , wherein:
the electronic substrate is mechanically coupled to the transparent component with second solder;
the electronic substrate is electrically coupled to the redistribution layer with the second solder;
the second solder includes a melting point different than a melting point of the first solder; and
a boundary confines the second solder.
12. The optoelectronic assembly of claim 10 , further comprising an electronic component coupled to the transparent component inside of the enclosure, the electronic component electrically coupled to the laser array or the receiver array by the redistribution layer.
13. The optoelectronic assembly of claim 10 , further comprising a passive component coupled to the transparent component inside of the enclosure, the passive component electrically coupled to the redistribution layer.
14. The optoelectronic assembly of claim 8 , wherein the transparent component is coupled to the second component by adhesive positioned therebetween.
15. The optoelectronic assembly of claim 8 , further comprising one or more lenses positioned on a surface of the transparent component, the laser array oriented to transmit optical signals through at least one of the lenses, and the receiver array oriented to receive optical signals through at least another one of the lenses.
16. The optoelectronic assembly of claim 8 , the second component defining a recess with the thermal interface material positioned therein.
17. An optoelectronic assembly, comprising:
a heat sink including a second component positioned inside of a receptacle of a first component;
a transparent component;
an optoelectronic array coupled to the transparent component and oriented to transmit or receive optical signals through the transparent component;
an electronic component coupled to the transparent component;
an electronic substrate positioned between the transparent component and the first component, the electronic substrate coupled to the transparent component; and
a thermal interface material positioned between the optoelectronic array, the electronic component, and the second component, the thermal interface material coupling a first continuous surface of the second component to both the optoelectronic array and the electronic component.
18. The optoelectronic assembly of claim 17 , further comprising a solder positioned at an interface of the first and second components.
19. The optoelectronic assembly of claim 17 , further comprising epoxy positioned at an interface of the electronic substrate and the first component.
20. The optoelectronic assembly of claim 17 , further comprising a solder positioned at an interface of the electronic substrate and the transparent component.