IP Library Granted Patent US 10,573,289
Granted Patent B2
US 10,573,289 · App. 15/583,861 · Granted Feb 25, 2020

Package waveguide for acoustic sensor with electronic delay compensation

Inventors: Richard Przybyla (Emeryville, CA); Andre Guedes (San Francisco, CA); Stefon Shelton (Oakland, CA); Meng-Hsiung Kiang (Berkeley, CA); David Horsley (Berkeley, CA)
Assignee: CHIRP MICROSYSTEMS, INC.
G10K11/002G01S7/521G01S15/10G10K11/346
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Quick Facts
Patent No.
US 10,573,289
App. No.
15/583,861
Granted
Feb 25, 2020
Kind
B2
Abstract

A system and method use an array of ultrasonic transducers to emit and receive sound in a phased array fashion by using acoustic waveguides to achieve a desired acoustic radiation and reception pattern. A chip package attached to an acoustic transducer array includes acoustic waveguides coupled to acoustic ports. Each waveguide is coupled between a corresponding acoustic transducer and a corresponding acoustic port. A spacing of a pair of acoustic ports is different than a spacing of a corresponding pair of acoustic transducers.

Claims (34)

1. An acoustic transducer package, comprising:

an acoustic transducer array having a plurality of acoustic transducers formed on a substrate;

a chip package attached to the acoustic transducer array, wherein the chip package includes a plurality of acoustic waveguides coupled to a plurality of acoustic ports, wherein each acoustic waveguide in the plurality of acoustic waveguides is coupled between a corresponding acoustic transducer in the plurality of acoustic transducers and a corresponding acoustic port in the plurality of acoustic ports, wherein a spacing of a pair of acoustic ports in the plurality of acoustic ports is different than a spacing of a corresponding pair of acoustic transducers in the plurality of acoustic transducers.

2. The acoustic transducer package of claim 1 , wherein the spacing of the pair of acoustic ports in the plurality of acoustic ports is larger than the spacing of the corresponding pair of acoustic transducers in the plurality of acoustic transducers.

3. The acoustic transducer package of claim 1 , wherein the spacing of the pair of acoustic ports in the plurality of acoustic ports is smaller than the spacing of the corresponding pair of acoustic transducers in the plurality of acoustic transducers.

4. The acoustic transducer package of claim 1 , wherein the acoustic ports in the plurality of acoustic ports are spaced with a pitch that is less than 5λ, where λ is an acoustic wavelength.

5. The acoustic transducer package of claim 1 , wherein the spacing between acoustic ports in the plurality of acoustic ports is non-uniform.

6. The acoustic transducer package of claim 4 , wherein the pitch is between ½λ and λ.

7. The acoustic transducer package of claim 1 , wherein one or more acoustic waveguides in the plurality of acoustic waveguides are characterized by a length of ¼λ*(2n−1)+C where λ is an acoustic wavelength, n=is a positive integer and C is a correction term that accounts for end effects produced by the acoustic ports.

8. The acoustic transducer package of claim 1 , further comprising an integrated circuit coupled to the acoustic transducer array.

9. The acoustic transducer package of claim 8 , wherein the integrated circuit is attached to the chip package.

10. The acoustic transducer package of claim 8 , wherein the integrated circuit includes a signal generation unit configured to generate a plurality of driving signals, wherein each driving signal of the plurality of driving signals drives a corresponding transducer of the plurality of transducers.

11. The acoustic transducer package of claim 10 , further comprising a plurality of signal amplifiers coupled between the signal generation unit and the acoustic transducer array, wherein each signal amplifier of the plurality of signal amplifiers amplifies a corresponding driving signal of the plurality of driving signals.

12. The acoustic transducer package of claim 10 , further comprising a plurality of delay elements coupled between the signal generation unit and the acoustic transducer array, wherein each delay element of the plurality of delay elements applies a delay to a corresponding driving signal of the plurality of driving signals.

13. The acoustic transducer package of claim 8 , wherein the integrated circuit includes a beamforming and target recognition block coupled to the acoustic transducer array.

14. The acoustic transducer package of claim 13 , wherein the beamforming and target recognition block is configured to extract features signals received from the acoustic transducer array.

15. The acoustic transducer package of claim 13 , wherein the beamforming and target recognition block is configured to perform spatial filtering of signals received from the acoustic transducer array.

16. The acoustic transducer package of claim 13 , further comprising a plurality of signal amplifiers coupled between the beamforming and target recognition block and the acoustic transducer array, wherein each signal amplifier of the plurality of signal amplifiers amplifies a corresponding received signal from a corresponding acoustic transducer of the plurality of acoustic transducers.

17. The acoustic transducer package of claim 13 , further comprising a plurality of delay elements coupled between beamforming and target recognition block and the acoustic transducer array, wherein each delay element of the plurality of delay elements applies a delay to a corresponding received signal from a corresponding acoustic transducer of the plurality of acoustic transducers.

18. A method, comprising:

generating a plurality of acoustic signals with an acoustic transducer array having a plurality of acoustic transducers formed on a substrate;

transmitting each acoustic signal in the plurality of acoustic signals through a corresponding acoustic waveguide of a plurality of acoustic waveguides coupled to a plurality of acoustic ports, wherein each acoustic waveguide in the plurality of acoustic waveguides is coupled between a corresponding acoustic transducer in the plurality of acoustic transducers and a corresponding acoustic port in the plurality of acoustic ports, wherein a spacing of a pair of acoustic ports in the plurality of acoustic ports is different than a spacing of a corresponding pair of acoustic transducers in the plurality of acoustic transducers, wherein one or more acoustic waveguides in the plurality of acoustic waveguides are characterized by a length of ¼λ*(2n−1)+C where λ is an acoustic wavelength, n=is a positive integer and C is a correction term that accounts for end effects produced by the acoustic ports.

19. The method of claim 18 , wherein generating the plurality of acoustic signals includes generating a plurality of driving signals that drive the one or more acoustic transducers, wherein each driving signal of the plurality of driving signals drives a corresponding transducer of the plurality of transducers.

20. The method of claim 19 , further comprising amplifying the plurality of driving signals with a plurality of signal amplifiers coupled between the signal generation unit and the acoustic transducer array, wherein each signal amplifier of the plurality of signal amplifiers amplifies a corresponding driving signal of the plurality of driving signals.

21. The method of claim 19 , further comprising delaying the plurality of driving signals with a plurality of delay elements coupled to the acoustic transducer array, wherein each delay element of the plurality of delay elements applies a delay to a corresponding driving signal of the plurality of driving signals.

22. A method, comprising:

receiving one or more acoustic signals at a plurality of acoustic ports;

transmitting the one or more acoustic signals through a plurality of acoustic waveguides to a plurality of acoustic transducers formed on a substrate, wherein each acoustic waveguide in the plurality of acoustic waveguides is coupled between a corresponding acoustic transducer in the plurality of acoustic transducers and a corresponding acoustic port in the plurality of acoustic ports,

wherein a spacing of a pair of acoustic ports in the plurality of acoustic ports is different than a spacing of a corresponding pair of acoustic transducers in the plurality of acoustic transducers; and

generating a plurality of received signals with the plurality of acoustic transducers from the one or more acoustic signals.

23. The method of claim 22 , further comprising extracting features from the plurality of received signals generated with the acoustic transducer array.

24. The method of claim 22 , further comprising performing spatial filtering on the plurality of received signals generated with the acoustic transducer array.

25. The method of claim 22 , further comprising amplifying the plurality of received signals with a plurality of signal amplifiers coupled to the acoustic transducer array, wherein each signal amplifier of the plurality of signal amplifiers amplifies a corresponding received signal from a corresponding acoustic transducer of the plurality of acoustic transducers.

26. The method of claim 22 , further comprising delaying the plurality of received signals with a plurality of delay elements coupled to the acoustic transducer array, wherein each delay element of the plurality of delay elements applies a delay to a corresponding received signal from a corresponding acoustic transducer of the plurality of acoustic transducers.

Assignments (2)
MERGER Recorded Apr 6, 2022
From: CHIRP MICROSYSTEMS, INC.
To: INVENSENSE, INC.
Reel/Frame 059519/0590 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2017
From: PRZYBYLA, RICHARD; GUEDES, ANDRE; SHELTON, STEFON; KIANG, MENG-HSIUNG; HORSLEY, DAVID
To: CHIRP MICROSYSTEMS, INC.
Reel/Frame 043091/0334 →
Continuity (3)
Continuation PCTUS2015059595 · Nov 6, 2015
Provisional Application 62077149 · Nov 7, 2014
Related Publication 20170236506A1 · Aug 17, 2017