SENSOR ARRAY, MANUFACTURING METHOD THEREOF, AND SENSING METHOD
A sensor array includes a circuit board, a plurality of first sensing units, and at least one second sensing unit. The circuit board has an upper surface and a lower surface that are opposite to each other. The first sensing units are located on the upper surface of the circuit board. The first sensing units include a plurality of first electrodes and a plurality of sensing material layers. The sensing material layers are respectively located on surfaces of the first electrodes, and the sensing material layers are manufactured through applying a non-contact printing method. The second sensing unit is located on the upper surface of the circuit board. The second sensing unit includes a second electrode separated from the first electrodes. The sensing material layers respectively cover the surfaces of the first electrodes, and the second electrode is exposed to an atmospheric environment.
1 . A sensor array comprising:
a circuit board having an upper surface and a lower surface opposite to each other;
a plurality of first sensing units located on the upper surface of the circuit board and comprising:
a plurality of first electrodes; and
a plurality of sensing material layers respectively located on surfaces of the first electrodes, wherein the sensing material layers are manufactured through applying a non-contact printing method; and
at least one second sensing unit located on the upper surface of the circuit board and comprising a second electrode separated from the first electrodes, wherein the sensing material layers respectively cover the surfaces of the first electrodes, and the at least one second sensing unit is exposed to an atmospheric environment.
2 . The sensor array according to claim 1 , wherein the sensing material layers comprise metal, metal oxide, graphene, graphene oxide, carbon nanotubes, fullerene, gold clusters, polymers, metal sulfides, quantum dots, calcium titanium ore, or a combination thereof.
3 . The sensor array according to claim 1 , further comprising a chip located on the lower surface of the circuit board, the chip being electrically connected to the circuit board through wire bonding or flip-chip bonding.
4 . The sensor array according to claim 1 , further comprising a plurality of chips located on the lower surface of the circuit board, the chips being stacked together to constitute a stacked chip structure.
5 . The sensor array according to claim 1 , wherein the first electrodes comprise interdigitated electrodes, stacked electrodes, or a combination thereof, and the first sensing units are configured to sense gas, light, humidity, or a combination thereof.
6 . The sensor array according to claim 1 , wherein the second electrode is a serpentine electrode, and the at least one second sensing unit is configured to sense temperature.
7 . The sensor array according to claim 6 , wherein the at least one second sensing unit is sensing material-free.
8 . The sensor array according to claim 1 , wherein the upper surface or the lower surface of the circuit board is a curved surface, a concave surface, an inclined surface, or a surface having a combination of said surfaces.
9 . The sensor array according to claim 1 , wherein an area occupied by the sensing material layers is within a range from 1 μm 2 to 10 6 μm 2 , and an area occupied by the sensor array is within a range from 1 μm 2 to 10 6 μm 2 .
10 . A manufacturing method of a sensor array, comprising:
providing a circuit board having an upper surface and a lower surface opposite to each other;
forming a plurality of first electrodes and at least one second electrode on the upper surface of the circuit board, wherein the first electrodes are separated from the at least one second electrode; and
respectively forming a plurality of sensing material layers on surfaces of the first electrodes through applying a non-contact printing method but not on a surface of the at least one second electrode.
11 . The manufacturing method according to claim 10 , wherein the non-contact printing method comprises an ink jet printing method or an aerosol jet printing method.
12 . A sensing method comprising:
sensing mixed gases by the sensor array according to claim 1 , wherein the sensing material layers in the sensor array are reacted with a plurality of gases of the mixed gases to generate a plurality of response signals; and
receiving parameter data from a reaction database and measuring concentrations of the gases according to the parameter data and the response signals.
13 . The sensing method according to claim 12 , wherein the step of measuring the concentrations of the gases according to the parameter data and the response signals comprises:
substituting the parameter data and the response signals into a formula 1 to obtain the concentrations of the gases, wherein the formula 1 is
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R w , R t , and R z , are the response signals, S wm , S tm , S zm , S we , S te , S ze , S wt , S tt , and S zt are the parameter data, and C m , C e , and C t are the concentrations of the gases.