Substrate with reflective coating including silicate or alkylsilicate network
The present invention relates to a method for providing a reflective coating to a substrate for a light-emitting device, comprising the steps of: providing a substrate having a first surface portion with a first surface material and a second surface portion with a second surface material different from the first surface material; applying a reflective compound configured to attach to said first surface material to form a bond with the substrate in the first surface portion that is stronger than a bond between the reflective compound and the substrate in the second surface portion; curing said reflective compound to form a reflective coating having said bond between the reflective coating and the substrate in the first surface portion; and subjecting said substrate to a mechanical treatment with such an intensity as to remove said reflective coating from said second surface portion while said reflective coating remains on said first surface portion.
1. A substrate adapted to be provided with a light-emitting device, comprising:
a carrier;
a conductor pattern forming metallic connection pads having a top surface configured to be electrically connected to a light-emitting device; and
a reflective coating provided on said substrate and comprising pigment and a silicate or alkylsilicate network, wherein said network is arranged to provide a bond between said reflective coating and said carrier,
wherein the reflective coating is self-aligned with the connection pads such that the reflective coating directly abuts edges of the connection pads and does not cover any portion of the top surface of the connection pads.
2. The substrate according to claim 1 , wherein said reflective coating is provided between said carrier and said conductor pattern.
3. The substrate according to claim 1 , wherein said bond is a chemical bond.
4. The substrate according to claim 1 , wherein the substrate comprises a ceramic surface to which said network adheres.
5. A light-output device comprising:
a substrate according to claim 1 , and
at least one light-emitting device mounted on said substrate.
6. The light-output device according to claim 5 , wherein said light-emitting device comprises at least one light-emitting diode chip.
7. The substrate according to claim 1 wherein the reflective coating is self-aligned with the connection pads due to the reflective coating being initially deposited over the connection pads and the carrier, wherein the bond between the reflective coating and the carrier is greater than a bond between the reflective coating and the top surface of the connection pads, allowing the reflective coating to be removed from the top surface of the connection pads without removing the reflective coating from the carrier.
8. The substrate according to claim 1 , wherein the reflective coating is provided on the carrier between the connection pads.