Phased array ultrasonic transducer and method of manufacture
A phased array ultrasonic transducer includes a bonding wire structure, a damping material, a plurality of ultrasonic transducers, and a printed circuit board. The bonding wire structure includes a plurality of bonding wire elements. The damping material surrounds the bonding wire structure and is interposed with the plurality of bonding wire elements. The plurality of ultrasonic transducers is arranged in a matrix beneath a membrane, each of the plurality of ultrasonic transducers being coupled to a corresponding bonding wire element of the plurality of bonding wire elements. The printed circuit board includes a plurality of circuits. Each of the plurality of circuits is coupled to a corresponding bonding wire element of the plurality of bonding wire elements.
1. A phased array ultrasonic transducer comprising:
a bonding wire structure comprising a plurality of bonding wire elements;
a damping material surrounding the bonding wire structure and interposed with the plurality of bonding wire elements;
a plurality of ultrasonic transducers arranged in a matrix, each of said ultrasonic transducers coupled to at least one of said plurality of bonding wire elements by a contact; wherein an entirety of the damping material is positioned below the plurality of ultrasonic transducers;
a filler material filling voids between the plurality of ultrasonic transducers and the damping material, wherein the filler material includes the contact, such that each of said ultrasonic transducers is directly coupled to at least one of said plurality of bonding wire elements via the contact positioned within the filler material; and
a printed circuit board comprising a plurality of circuits, each said circuit coupled to a wire element of said plurality of bonding wire elements;
wherein the damping material is configured to absorb and attenuate ultrasonic energy.
2. The phased array ultrasonic transducer of claim 1 , wherein said printed circuit board further comprises a flexible printed circuit board.
3. The phased array ultrasonic transducer of claim 1 , wherein each of said plurality of bonding wire elements comprises a conductive column.
4. The phased array ultrasonic transducer of claim 3 , wherein said conductive column comprises copper.
5. The phased array ultrasonic transducer of claim 1 , wherein each of said plurality of bonding wire elements comprises a conductive cylinder comprising a first end coupled to a structural base.
6. The phased array ultrasonic transducer of claim 1 , wherein each of said plurality of bonding wire elements comprises a conductive cone comprising a broad end coupled to a corresponding one of said plurality of ultrasonic transducers, and a narrow end coupled to said printed circuit board.
7. The phased array ultrasonic transducer of claim 1 , wherein said damping material defines:
a first face coupled to said plurality of ultrasonic transducers and to a membrane; and
a second face opposite said first face and coupled to said printed circuit board.
8. A phased array ultrasonic transducer comprising:
a bonding wire structure comprising a plurality of bonding wire elements formed by sequentially depositing a conductive material in layers on a structural base such that said plurality of bonding wire elements are arranged in a grid of bonding wire elements;
a damping material extending across said bonding wire structure such that said bonding wire structure is surrounded and such that said damping material is interposed with said plurality of bonding wire elements, wherein said damping material defines a first face that is substantially parallel to the grid of bonding wire elements;
a plurality of ultrasonic transducers arranged in a matrix beneath a membrane, each of said plurality of ultrasonic transducers is coupled to a corresponding one of said plurality of bonding wire elements by a contact, and wherein said membrane is laminated to said first face of said damping material;
wherein an entirety of the damping material is positioned below the plurality of ultrasonic transducers;
a filler material filling voids between the plurality of ultrasonic transducers and the damping material wherein the filler material includes the contact, such that each of said ultrasonic transducers is directly coupled to at least one of said plurality of bonding wire elements via the contact positioned within the filler material; and
a printed circuit board comprising a plurality of circuits, each of said plurality of circuits coupled to a corresponding one of said plurality of bonding wire elements, said printed circuit board laminated to a second face of said damping material, said second face defined opposite said first face;
wherein the damping material is configured to absorb and attenuate ultrasonic energy.
9. The phased array ultrasonic transducer of claim 8 , wherein said damping material comprises a curable resin.
10. The phased array ultrasonic transducer of claim 8 , wherein said first face and said second face of said damping material are further defined by trimming of said damping material to predefined dimensions.
11. The phased array ultrasonic transducer of claim 8 , wherein said bonding wire structure comprises a plurality of conductive cones, each conductive cone comprising a broad end coupled to a corresponding one of said plurality of ultrasonic transducers, and a narrow end coupled to said printed circuit board.
12. The phased array ultrasonic transducer of claim 8 , wherein said printed circuit board comprises a flexible printed circuit board.