Near field communication antenna modules for devices with metal frame

1. A wireless communication device, comprising:

a near field communications chip (NFC) antenna module;

a microwave frequency antenna module; and

a metal frame peripheral structure having one or more openings disposed on a top metal border of the metal frame peripheral structure, wherein the one or more openings are to divide the metal peripheral structure into two sections, including an upper metal frame and a middle rear shell, wherein the middle rear shell is made of metal or non-metallic material, wherein when the middle rear shell is made of metal, a gap is formed between the upper metal frame and the middle rear shell, and wherein a width of the gap is at least 1.5 millimeters (mm) wide,

wherein a portion of the upper metal frame is used as a radiator for the NFC antenna module and the microwave frequency antenna module, wherein the portion of the upper metal frame is connected to a ground through a conductor, wherein an effective length of the NFC antenna module is determined by a length between a feeding point position and a grounding point position of the NFC antenna module, and

wherein the NFC antenna module comprising a feeding path for feeding, the feeding path comprising a non-balanced antenna element having portions of an antenna pattern orthogonal to a length of the gap, wherein the non-balanced antenna element includes a serpentine multi-fold shaped antenna pattern.

2. The device of claim 1 , wherein the NFC antenna module comprises the upper metal frame as a radiator, a ground path, some reactive elements, and an NFC circuit module.

3. The device of claim 1 , wherein the microwave frequency antenna module comprises a radiator made of the upper metal frame, a ground path, one or more reactive elements, and a microwave frequency circuit module.

4. The device of claim 2 , wherein a first end of the non-balanced antenna element is coupled to the NFC circuit module and a second end is coupled to the ground path.

5. The device of claim 4 , wherein the feeding path includes a direct feeding path for direct feeding, wherein during the direct feeding,

a first point is selected on the upper metal frame as a feeding point, wherein the feeding point is directly connected to a first end of a first inductor and a second end of the first inductor is connected with the NFC circuit module; and

a second point is selected on the upper metal frame as a grounding point of the NFC antenna module, wherein the grounding point is directly connected with a second inductor, wherein the second inductor is coupled to a circuit board ground and is coupled to the middle rear shell of the device.

6. The device of claim 4 , further comprising a coupling feeding module for feeding by non-contact metal sheet coupling, wherein the coupling feeding module comprises:

a coupling feeding metal sheet; and

a coupling feeding circuit board, wherein the coupling feeding metal sheet is arranged in parallel with the upper metal frame with each other with a layer of insulating substrate between them, wherein the coupling feeding metal sheet is connected to the NFC circuit module through a first inductor, wherein the coupling feeding circuit board comprises a ground layer and a clearance area between the ground layer and the coupling feed sheet, wherein within the clearance area, a second inductor is used to connect the coupling feed sheet and the ground layer, wherein the second inductor is to further filter out high-frequency signals to enhance NFC signal's quality.

7. The device of claim 4 , further comprising a non-balanced antenna assembly, wherein the non-balanced antenna assembly comprises a dielectric substrate layer and an antenna pattern attached on the dielectric substrate layer, which is arranged directly above the gap, wherein at least one side of an antenna trace is orthogonal coupled with the gap, wherein a first end of the antenna trace is connected to the near-field antenna module and a second end of the antenna trace is connected to a ground, wherein the non-balanced antenna assembly is used to couple the gap so that a potential difference is formed on both sides of the gap, and wherein an eddy current is obtained on a rear metal cover to realize the near-field communication capability of the device.

8. The device of claim 7 , wherein the antenna pattern includes a “C” type semicircular ring shape or a “ ” type structure.

9. The device of claim 2 , wherein the NFC circuit module comprises: a near-field communication chip, a differential LC low-pass filter circuit, a balance and unbalance conversion device, a non-differential impedance matching circuit, and an isolation inductor coupled in series to the NFC circuit module.

10. The device of claim 9 , wherein the balance and unbalance conversion device includes a balun with dual input and single output port settings, whereon a second output port is grounded, wherein the balun is placed between the differential LC low-pass filter circuit and the non-differential impedance matching circuit to achieve the conversion from a balanced circuit to the unbalanced circuit.

11. The device of claim 1 , further comprising a first capacitor and a second capacitor respectively connected to a microwave frequency circuit module and a ground layer, wherein the capacitors are used to isolate an interference of NFC signals to the microwave frequency circuit module.