Electronic housing design and method of improving electromagnetic compatibility by mounting and fixation technology
View Patent ↗A housing design and method of providing electromagnetic compatibility (EMC) by mitigating a slot antenna in a corner region of a housing, the corner profile including an electrically conductive insert that has a spring bias, such as a spring or coated plastic member, in a corner of the housing.
1. A housing, comprising:
a first sidewall;
a profile having at least one recess extending there through, wherein a portion of the first sidewall extends into the recess;
a second sidewall, wherein the first sidewall is adjacent to the second sidewall; and
an insert in the recess and extending in a direction of the recess, a portion of the insert in contact with the profile and the portion of the first sidewall in the recess.
2. The housing according to claim 1 , wherein the insert has a spring-bias to exert force on the portion of the first sidewall in the recess.
3. The housing according to claim 2 , wherein the spring-bias is radially outward.
4. The housing according to claim 1 , wherein the insert is electrically conductive.
5. The housing according to claim 1 , wherein the insert comprises a metal spring.
6. The housing of claim 1 , wherein a surface of the recess is electrically conductive.
7. The housing according to claim 1 , wherein the insert comprises plastic.
8. The housing according to claim 7 , where in the insert is die-casted.
9. The housing according to claim 7 , wherein the insert is extruded.
10. The housing according to claim 7 , wherein the insert has an electrically conductive surface.
11. The housing of claim 7 , wherein a surface of the recess is electrically conductive.
12. A housing, comprising:
a base;
a profile extending from the base and having a slot therein;
a wall having an edge in the slot of the profile, wherein at least a portion of the wall is electrically conductive; and
an insert having a spring bias in the slot adjacent to the wall, the insert pressing the wall to abut the profile, wherein at least a portion of the profile is electrically conductive.
13. The housing according to claim 12 , wherein the insert has a radially outward spring-bias.
14. The housing according to claim 12 , wherein the insert is electrically conductive.
15. The housing according to claim 12 , wherein the insert comprises a metal spring.
16. The housing according to claim 12 , wherein the insert comprises plastic.
17. The housing according to claim 16 , wherein insert has an electrically conductive surface.
18. The housing of claim 12 , wherein a surface of the slot is electrically conductive.
19. The housing of claim 12 , wherein the profile is electrically conductive.
20. A method of dissipating EMI in a housing having a first sidewall and a second sidewall, comprising:
providing a profile;
sliding the first sidewall into a first slot in the profile;
sliding the second sidewall into a second slot in the profile; and
providing an insert having a spring bias, the insert in one of the first slot and second slots of the profile to abut at least a portion of one of the first sidewall and second sidewall and an inner surface of the one of the first slot and the second slot to apply a spring force to the one of the first and second sidewalls to press the one of the first sidewall and second sidewall to abut the profile.