Intelligent power module, electric vehicle or hybrid vehicle, and method of assembling intelligent power module

1. An intelligent power module, comprising:

a heat radiation device;

an attachment frame comprising a frame body, and disposed on a mounting surface of the heat radiation device;

a power semiconductor module comprising a package configured to seal a semiconductor device therein; and

a drive circuit part configured to drive the power semiconductor module, and disposed over the power semiconductor module,

wherein an area defined by an outer periphery of the frame body is larger than an area of the package of the power semiconductor module in a plan view,

wherein a thickness of the frame body is less than a thickness of the power semiconductor module, and

wherein the attachment frame includes a plurality of holes formed inside the frame body, and the power semiconductor module is mounted on the mounting surface of the heat radiation device via respective ones of the plurality of holes.

2. The intelligent power module of claim 1 , further comprising a joining member configured to join the power semiconductor module on the mounting surface.

3. The intelligent power module of claim 2 , wherein the joining member includes a thermally conductive resin configured to hold the power semiconductor module on the mounting surface.

4. The intelligent power module of claim 3 , further comprising:

a heat insulating sheet disposed on the power semiconductor module; and

a presser plate, provided on the heat insulating sheet, configured to restrict movement of the power semiconductor module held by the thermally conductive resin.

5. The intelligent power module of claim 4 , wherein the presser plate includes a thin metal plate having a spring property.

6. The intelligent power module of claim 5 , wherein the presser plate is fixed to the heat radiation device.

7. The intelligent power module of claim 5 , wherein the presser plate includes a portion through which a wiring line passes, the wiring line electrically connecting the power semiconductor module and the drive circuit part.

8. The intelligent power module of claim 5 , wherein the presser plate is provided with a thin metal plate having a heat radiation property and is capable of radiating heat generated by the power semiconductor module.

9. The intelligent power module of claim 2 , wherein the joining member includes a solder configured to fix the power semiconductor module to the mounting surface.

10. The intelligent power module of claim 9 , further comprising:

a heat insulating sheet disposed on the power semiconductor module, and

a heat radiation plate and/or a heat radiation sheet, provided on the heat insulating sheet, configured to radiate heat generated from the power semiconductor module fixed by the solder.

11. The intelligent power module of claim 1 , wherein the heat radiation device includes a water-cooled cooler provided therein.

12. The intelligent power module of claim 1 , wherein the heat radiation device includes an air-cooled cooler provided outside thereof.

13. The intelligent power module of claim 1 , comprising a plurality of power semiconductor modules, wherein the heat radiation device, the attachment frame and the drive circuit part are arranged as an integral structure with respect to the plurality of power semiconductor modules.

14. The intelligent power module of claim 1 , wherein the attachment frame is made of a resin.

15. The intelligent power module of claim 1 , wherein the power semiconductor module includes one or more semiconductor device of an IGBT, a diode, a Si-based MOSFET, a SiC-based MOSFET and a GaN-based FET.

16. The intelligent power module of claim 13 , wherein the power semiconductor module constitutes a switching module.

17. An intelligent power module, comprising:

a heat radiation device;

an attachment frame comprising a frame body, and disposed on a mounting surface of the heat radiation device;

a plurality of power semiconductor modules, each power semiconductor module comprising a package configured to seal a semiconductor device therein; and

a drive circuit part configured to drive the plurality of power semiconductor modules, and disposed over the plurality of power semiconductor modules,

wherein each of the plurality of power semiconductor modules constitutes a two-in-one module, and the plurality of power semiconductor modules constitutes a six-in-one module type inverter or converter,

wherein an area defined by an outer periphery of the frame body is larger than a sum of an area of the package of each of the plurality of power semiconductor modules in a plan view,

wherein a thickness of the frame body is less than a thickness of each of the plurality of power semiconductor modules, and

wherein the attachment frame includes a plurality of holes formed inside the frame body, and the plurality of power semiconductor modules are mounted on the mounting surface of the heat radiation device via respective ones of the plurality of holes.

18. The intelligent power module of claim 1 , wherein the intelligent power module is to be used for a power control unit of an electric vehicle or a hybrid vehicle and is configured to operate in response to a control signal supplied from an ECU.

19. An electric vehicle or a hybrid vehicle equipped with the intelligent power module of claim 1 .

20. The electric vehicle or the hybrid vehicle of claim 19 , further comprising:

an ECU configured to control an operation of the intelligent power module; and

a temperature monitoring circuit configured to monitor a temperature state of the intelligent power module.