Dielectric substrate and antenna device
View Patent ↗A dielectric substrate for transmitting a signal with a frequency f 0 includes a dielectric and a copper film pattern arranged on a first surface of the dielectric. The copper film pattern has a first dimension L in a direction parallel to a propagation direction of an electromagnetic wave that has the frequency f 0 and that propagates on the first surface, and the first dimension L is given by: L = 1 ɛ r - 1 k λ 0 where ε r represents a relative permittivity of the dielectric, k represents a constant in a range of 0.15 to 0.70, and λ 0 represents a free space wavelength of the signal.
1. A dielectric substrate, comprising:
a dielectric; and
a copper film pattern arranged on a first surface of the dielectric, wherein an antenna configured to radiate a signal with a frequency f 0 is arranged on the first surface, and
wherein the copper film pattern has a first dimension L in a direction parallel to a propagation direction of an electromagnetic wave that has the frequency f 0 and that propagates on the first surface, and the first dimension L is given by:
L
=
1
ɛ
r
-
1
k
λ
0
where ε r represents a relative permittivity of the dielectric, k represents a constant in a range of 0.15 to 0.70, and λ 0 represents a free space wavelength of the signal, and
wherein, in the propagation direction of the electromagnetic wave, a distance between the antenna and the copper film pattern is smaller than or equal to 2λ 0 .
2. The dielectric substrate according to claim 1 ,
wherein the copper film pattern arranged on the first surface comprises a plurality of copper film patterns, and
in the propagation direction of the electromagnetic wave, a distance between adjacent copper film patterns of the plurality of copper film patterns is smaller than or equal to λ 0 .
3. The dielectric substrate according to claim 1 ,
wherein the copper film pattern has a second dimension in a direction orthogonal to the propagation direction of the electromagnetic wave, and
the second dimension is larger than λ 0 /2.
4. The dielectric substrate according to claim 1 ,
wherein the antenna arranged on the first surface comprises a plurality of antennas, and
the copper film pattern is arranged between at least two antennas of the plurality of antennas.
5. The dielectric substrate according to claim 1 ,
wherein the copper film pattern includes a plurality of copper film patterns,
the antenna is positioned between adjacent copper film patterns of the plurality of copper film patterns, and
a distance, in the propagation direction of the electromagnetic wave, between the antenna and each of the adjacent copper film patterns is smaller than or equal to 2λ 0 .
6. The dielectric substrate according to claim 1 ,
wherein a transmission line for transmitting the signal with the frequency f 0 is arranged on the first surface, and
in the propagation direction of the electromagnetic wave, a distance between the transmission line and the copper film pattern is smaller than or equal to 2λ 0 .
7. The dielectric substrate according to claim 6 ,
wherein the transmission line arranged on the first surface comprises a plurality of transmission lines, and
the copper film pattern is arranged between at least two transmission lines of the plurality of transmission lines.
8. A radar device comprising the dielectric substrate of claim 1 .
9. An antenna device comprising:
a dielectric;
an antenna arranged on a first surface of the dielectric, the antenna configured to radiate a signal with a frequency f 0 ; and
a copper film pattern arranged on the first surface,
wherein the copper film pattern has a first dimension L in a direction parallel to a propagation direction of an electromagnetic wave that has the frequency f 0 and that propagates on the first surface, and the first dimension L is given by:
L
=
1
ɛ
r
-
1
k
λ
0
where ε r represents a relative permittivity of the dielectric, k represents a constant in a range of 0.15 to 0.70, and λ 0 represents a free space wavelength of the signal, and
wherein, in the propagation direction of the electromagnetic wave, a distance between the antenna and the copper film pattern is smaller than or equal to 2λ 0 .
10. The antenna device according to claim 9 ,
wherein the copper film pattern includes a plurality of copper film patterns,
the antenna is positioned between adjacent copper film patterns of the plurality of copper film patterns, and
a distance, in the propagation direction of the electromagnetic wave, between the antenna and each of the adjacent copper film patterns is smaller than or equal to 2λ 0 .
11. The antenna device according to claim 9 ,
wherein the copper film pattern arranged on the first surface includes a plurality of copper film patterns, and,
in the propagation direction of the electromagnetic wave, a distance between adjacent copper film patterns of the plurality of copper film patterns is smaller than or equal to λ 0 .
12. The antenna device according to claim 9 ,
wherein the antenna includes a plurality of antennas, and
the copper film pattern is arranged between at least two antennas of the plurality of antennas.
13. The antenna device according to claim 9 , further comprising:
a transmission line arranged on the first surface,
wherein the transmission line is configured to transmit the signal with the frequency f 0 , and,
in the propagation direction of the electromagnetic wave, a distance between the transmission line and the copper film pattern is smaller than or equal to 2λ 0 .
14. The antenna device according to claim 13 ,
wherein the transmission line arranged on the first surface includes a plurality of transmission lines, and
the copper film pattern is arranged between at least two transmission lines of the plurality of transmission lines.
15. The antenna device according to claim 9 ,
wherein the copper film pattern has a second dimension in a direction orthogonal to the propagation direction of the electromagnetic wave, and
the second dimension is larger than λ 0 /2.