IP Library Granted Patent US 10,141,658
Granted Patent B2
US 10,141,658 · App. 15/603,062 · Granted Nov 27, 2018

Antenna module

Inventors: Chie Yamamoto (Kanagawa, JP); Hideki Iwaki (Kanagawa, JP); Ryosuke Shiozaki (Tokyo, JP)
Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
H01Q21/22H01Q1/38H01Q3/34H01Q9/045H01Q9/0457H01Q21/0075H01Q21/0093H05K1/0222H05K1/0251H01P5/028H01Q1/3233H01Q11/04H01Q21/065H01Q21/08H05K1/0243H05K1/0373H05K3/4626
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Quick Facts
Patent No.
US 10,141,658
App. No.
15/603,062
Granted
Nov 27, 2018
Kind
B2
Abstract

An antenna module includes a multilayer board, a phased array antenna that includes antenna elements arranged on an outer face of a second conductor layer included in the multilayer board and adjusts one or more beam directions of the antenna elements, a radio frequency (RF) chip that is arranged on an outer face of first conductor layers included in the multilayer board and outputs the radio frequency signal, a matching circuit that is arranged on the outer face of the first conductor layers and adjusts matching between impedance of the antenna elements and impedance of the RF chip, a through hole that couples the first conductor layers and the second conductor layer, and one or more vias that are on an outer side in a diameter direction of the through hole and couples the first conductor layers.

Claims (27)

1. An antenna module comprising:

a multilayer board;

a phased array antenna that includes a plurality of antenna elements arranged on an outer face of a second conductor layer included in the multilayer board and adjusts one or more beam directions of the plurality of antenna elements by controlling a phase of each of radio frequency signals transmitted from the plurality of antenna elements;

a radio frequency (RF) chip that is arranged on an outer face of a plurality of first conductor layers included in the multilayer board and outputs the radio frequency signal;

a matching circuit that is arranged on the outer face of the plurality of first conductor layers and adjusts matching between impedance of the plurality of antenna elements and impedance of the RF chip;

a through hole that couples the plurality of first conductor layers and the second conductor layer; and

one or more vias that are on an outer side in a diameter direction of the through hole and couples the plurality of first conductor layers.

2. The antenna module according to claim 1 , wherein

each of the one or more vias includes

a first via arranged in an outer layer included in the plurality of first conductor layers, and

a second via arranged in an inner layer included in the plurality of first conductor layers, and

the first via and the second via are stacked on an identical axis.

3. The antenna module according to claim 1 , wherein

each of the one or more vias includes

a first via arranged in an outer layer included in the plurality of first conductor layers, and

a second via arranged in an inner layer included in the plurality of first conductor layers, and

the first via and the second via are stacked on different axes.

4. The antenna module according to claim 2 , wherein

a diameter of the first via and a diameter of the second via are equal to each other.

5. The antenna module according to claim 3 , wherein

a diameter of the first via and a diameter of the second via are different from each other.

6. The antenna module according to claim 1 , wherein

permittivity and dielectric loss of an electrical insulation base that forms the second conductor layer are smaller than permittivity and dielectric loss of an electrical insulation base that forms the plurality of first conductor layers.

7. The antenna module according to claim 1 , wherein

a distance between the through hole and the each of the one or more vias is shorter than or equal to ¼ of a wavelength of a frequency of the radio frequency signal.

8. The antenna module according to claim 1 , wherein

a principal material of an electrical insulation base that forms the plurality of first conductor layers and a principal material of an electrical insulation base that forms the second conductor layer are identical to each other.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2024
From: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
To: PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
Reel/Frame 066703/0132 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2017
From: YAMAMOTO, CHIE; IWAKI, HIDEKI; SHIOZAKI, RYOSUKE
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 042991/0759 →
Priority Claims (1)
JP 2016-108984 · May 31, 2016 · national
Continuity (1)
Related Publication 20170346195A1 · Nov 30, 2017