Packages for coil actuated position sensors
View Patent ↗An apparatus comprises one or more substrates and one or more coils. At least one of the coils is configured to produce a first magnetic field that induces eddy currents in a conductive target, which generates a reflected magnetic field. One or more magnetic field sensing elements supported by the one or more substrates detect the reflected magnetic field. A conductive support structure supports the one or more substrates. The support structure includes a gap in an area adjacent to the one or more coils so that the support structure does not generate a reflected magnetic field in response to the first magnetic field.
1. An apparatus comprising:
one or more substrates;
one or more coil supported by at least one of the one or more substrates, at least one of the coils configured to produce a first magnetic field that induces eddy currents in a conductive target that generates a reflected magnetic field;
one or more magnetic field sensing elements supported by the one or more substrates to detect the reflected magnetic field; and
a conductive support structure to support the one or more substrates, the support structure having a gap in an area adjacent to the one or more coils so that the support structure does not generate a reflected magnetic field in response to the first magnetic field.
2. The apparatus of claim 1 wherein the one or more magnetic field sensing elements are arranged in a grid pattern on the one or more substrates.
3. The apparatus of claim 1 wherein at least one of the coils comprises a plurality of traces and wherein the one or more magnetic field sensing elements are positioned on the substrate in a space between traces of the coil.
4. The apparatus of claim 1 wherein the coil includes a counter coil to produce a local magnetic field in a direction opposite to the direction of the first magnetic field.
5. The apparatus of claim 4 wherein at least one of the coils comprises a plurality of traces and wherein the one or more magnetic field sensing elements are positioned in a space between one or more traces of the counter coil.
6. The apparatus of claim 1 wherein the one or more substrates comprise one or more of: a semiconductor material, a glass material, or a ceramic material.
7. The apparatus of claim 1 wherein a first substrate of the one or more substrates supports the one or more coils and one or more second substrates of the one or more substrates support the one or more magnetic field sensing elements.
8. The apparatus of claim 7 wherein a third substrate of the one or more substrates supports a processing circuit.
9. The apparatus of claim 7 wherein the first substrate supports two or more coils.
10. The apparatus of claim 1 wherein the first substrate supports one or more coils and one or more magnetic field sensing elements.
11. The apparatus of claim 10 wherein the second one or more substrates support one or more processing circuits.
12. The apparatus of claim 1 wherein each of the magnetic field sensing elements is supported by a different substrate.
13. The apparatus of claim 1 wherein the substrates, coils, and magnetic field sensing elements form one or more magnetic field sensors.
14. The apparatus of claim 1 further comprising an adhesive to adhere at least two of the one or more substrates to each other.
15. The apparatus of claim 1 wherein the conductive support structure comprises a lead frame or a pad frame.