IP Library Patent Application 15607013
Patent Application
App. No. 15/607,013

TEMPERATURE SENSOR ASSEMBLIES AND METHODS FOR COUPLING A THERMISTOR TO A CABLE

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Quick Facts
Patent No.
US None
App. No.
15/607,013
Abstract

According to some aspects of the present disclosure, a temperature sensor assembly includes a thermistor including a first lead and a second lead, and a nonconductive separator defining at least two channels, with the first lead positioned in a first one of the channels and the second lead positioned in a second one of the channels to electrically isolate the first lead from the second lead. The assembly also includes a cable including a first conductor wire and a second conductor wire, with the first conductor wire coupled to the first lead and the second conductor wire coupled to the second lead, and a tube at least partially enclosing the thermistor, the nonconductive separator, and at least a portion of the cable. Methods for connecting thermistors to cables are also disclosed.

Claims (33)

1 . A temperature sensor assembly comprising:

a thermistor including a first lead and a second lead;

a nonconductive separator defining at least two channels, the first lead positioned in a first one of the channels and the second lead positioned in a second one of the channels to electrically isolate the first lead from the second lead;

a cable including a first conductor wire and a second conductor wire, the first conductor wire coupled to the first lead and the second conductor wire coupled to the second lead; and

a tube at least partially enclosing the thermistor, the nonconductive separator, and at least a portion of the cable.

2 . The temperature sensor assembly of claim 1 , wherein the first conductor wire is soldered to the first lead to define a first solder joint and the second conductor wire is soldered to the second lead to defined a second solder joint.

3 . The temperature sensor assembly of claim 2 , wherein the first solder joint is electrically isolated from the second solder joint by the nonconductive separator.

4 . The temperature sensor assembly of claim 1 , wherein the nonconductive separator comprises nylon.

5 . (canceled)

6 . The temperature sensor assembly of claim 1 , wherein the tube includes an adhesive on an inner surface of the tube.

7 . The temperature sensor assembly of claim 1 , wherein the tube comprises a heat-shrink material.

8 . The temperature sensor assembly of claim 7 , wherein the heat-shrink material comprises a polyolefin.

9 . The temperature sensor assembly of claim 1 , wherein the tube is an end cap sealed around a perimeter of the cable.

10 . The temperature sensor assembly of claim 9 , wherein the end cap includes a tip aligned with a center axis of the thermistor.

11 . The temperature sensor assembly of claim 1 , wherein the first lead and the second lead are non-insulated leads.

12 . The temperature sensor assembly of claim 1 , wherein the tube does not include any filler insulating material.

13 . The temperature sensor assembly of claim 1 , wherein the thermistor comprises a negative temperature compensation (NTC) chip thermistor.

14 . The temperature sensor assembly of claim 1 , further comprising a circuit board, the cable connected to the circuit board at an end of the cable opposite the thermistor.

15 . A temperature sensor assembly comprising:

a thermistor including a first lead and a second lead;

a cable having a first wire and a second wire, the first wire coupled to the first lead at a first joint, and the second wire coupled to the second lead at a second joint;

a nonconductive separator positioned between the first joint and the second joint to inhibit electrical shorting between the first joint and the second joint; and

an end cap covering the thermistor, the nonconductive separator, the first joint and the second joint, the end cap sealed around the perimeter of the cable, the end cap comprising a heat-shrink material having an adhesive disposed on an inner surface of the end cap.

16 . The temperature sensor assembly of claim 15 , wherein the nonconductive separator defines at least two channels, the first lead is positioned in a first one of the channels and the second lead is positioned in a second of the channels to electrically isolate the first lead from the second lead.

17 . A method of connecting a thermistor having a first lead and a second lead, to a cable having a first wire and a second wire, the method comprising:

coupling the first wire to the first lead to form a first joint;

coupling the second wire to the second lead to form a second joint;

positioning a nonconductive separator between the first joint and the second joint with the first joint received in a first channel of the nonconductive separator and the second joint received in a second channel of the nonconductive separator to electrically isolate the first joint from the second joint; and

covering the thermistor, the nonconductive separator, the first joint and the second joint with an end cap.

18 . The method of claim 17 , wherein covering includes sealing the end cap around the perimeter of the cable.

19 . The method of claim 17 , wherein the end cap comprises a heat-shrink material and covering includes heating the end cap to shrink the end cap around the thermistor, the nonconductive separator, the first joint and the second joint.

20 . The method of claim 17 , further comprising coupling an end of the cable opposite the thermistor to a printed circuit board.

21 . The method of claim 17 , wherein coupling the first wire to the first lead includes soldering the first wire to the first lead, and coupling the second wire to the second lead includes soldering the second wire to the second lead. Serial No. To Be Assigned Page 6 of 7

Assignments (5)
ABL SECURITY AGREEMENT Recorded Mar 3, 2020
From: ENERGY LABS, INC.; VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 052075/0497 →
SECURITY AGREEMENT Recorded Mar 3, 2020
From: ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.; VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.
To: CITIBANK, N.A.
Reel/Frame 052076/0874 →
RELEASE OF SECURITY INTEREST Recorded Mar 2, 2020
From: THE BANK OF NEW YORK MELLON TRUST COMPANY N.A.
To: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.
Reel/Frame 052071/0913 →
SECOND LIEN SECURITY AGREEMENT Recorded Jun 10, 2019
From: VERTIV IT SYSTEMS, INC.; VERTIV CORPORATION; VERTIV NORTH AMERICA, INC.; ELECTRICAL RELIABILITY SERVICES, INC.; VERTIV ENERGY SYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049415/0262 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2017
From: KRZYWOSZ, MICHAEL M
To: VERTIV ENERGY SYSTEMS, INC.
Reel/Frame 043170/0756 →