Three-dimensional antenna array module
An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.
1. An antenna module, comprising:
an antenna substrate;
a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate;
a plurality of packaged circuitry on a second surface of the antenna substrate, wherein the plurality of packaged circuitry comprises a plurality of radio-frequency (RF) chips and at least one mixer chip,
wherein the plurality of radio-frequency (RF) chips and the at least one mixer chip are mounted on the second surface of the antenna substrate;
wherein the plurality of packaged circuitry is further mounted on a printed circuit board (PCB) based on a plurality of holes in the PCB; and
a first supporting ball on a first side of a packaged circuitry of the plurality of packaged circuitry and a second supporting ball on a second side of the packaged circuitry on the second surface of the antenna substrate,
wherein each of the plurality of 3-D antenna cells comprises a raised antenna patch, and
wherein a packaged circuitry of the plurality of packaged circuitry is electrically connected with the raised antenna patch of the plurality of 3-D antenna cells.
2. The antenna module according to claim 1 , wherein each of the plurality of 3-D antenna cells is a 3-D metal stamped antenna.
3. The antenna module according to claim 1 , wherein a height of each of the plurality of 3-D antenna cells is one-fourth of wavelength at an operational frequency.
4. The antenna module according to claim 1 , wherein a width of each of the plurality of 3-D antenna cells is half of wavelength at an operational frequency.
5. The antenna module according to claim 1 , wherein each of the plurality of 3-D antenna cells comprises the raised antenna patch with air dielectric.
6. The antenna module according to claim 5 , wherein the raised antenna patch comprises a top plate at a height greater than each of the plurality of 3-D antenna cells.
7. The antenna module according to claim 5 , wherein the raised antenna patch comprises four projections having outwardly increasing widths.
8. The antenna module according to claim 1 , wherein each of the plurality of 3-D antenna cells further comprises four supporting legs.
9. The antenna module according to claim 8 , wherein each of the four supporting legs is between a pair of adjacent projections of four projections associated with the raised antenna patch of each of the plurality of 3-D antenna cells.
10. The antenna module according to claim 1 , wherein the plurality of holes in the PCB is embedded with a heat sink.
11. The antenna module according to claim 1 , wherein each of the plurality of 3-D antenna cells further comprises a plurality of supporting legs,
wherein the raised antenna patch comprises a top plate at a height greater than each of the plurality of 3-D antenna cells, and
wherein each supporting leg of the plurality of supporting legs is between a pair of adjacent projections associated with the raised antenna patch and each supporting leg is directly connected with the top plate of the raised antenna of each of the plurality of 3-D antenna cells.
12. An antenna module, comprising:
an antenna substrate;
a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate;
a plurality of packaged circuitry on a second surface of the antenna substrate; and
a first supporting ball on a first side of a packaged circuitry of the plurality of packaged circuitry and a second supporting ball on a second side of the packaged circuitry on the second surface of the antenna substrate,
wherein each of the plurality of 3-D antenna cells comprises a raised antenna patch,
wherein the plurality of packaged circuitry is further mounted on a printed circuit board (PCB) based on a plurality of holes in the PCB, and
wherein a packaged circuitry of the plurality of packaged circuitry is electrically connected with the raised antenna patch of the plurality of 3-D antenna cells.
13. The antenna module according to claim 12 , wherein the plurality of holes in the PCB is embedded with a heat sink.
14. An antenna module, comprising:
an antenna substrate;
a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate;
a plurality of packaged circuitry on a second surface of the antenna substrate; and
a first supporting ball on a first side of a packaged circuitry of the plurality of packaged circuitry and a second supporting ball on a second side of the packaged circuitry on the second surface of the antenna substrate,
wherein the plurality of packaged circuitry is further mounted on a printed circuit board (PCB) based on a plurality of holes in the PCB,
wherein each of the plurality of 3-D antenna cells comprises a raised antenna patch, and
wherein a packaged circuitry of the plurality of packaged circuitry is electrically connected with the raised antenna patch of the plurality of 3-D antenna cells.
15. An antenna module, comprising:
an antenna substrate;
a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate;
a plurality of packaged circuitry on a second surface of the antenna substrate; and
a first supporting ball on a first side of a packaged circuitry of the plurality of packaged circuitry and a second supporting ball on a second side of the packaged circuitry on the second surface of the antenna substrate,
wherein the plurality of packaged circuitry is further mounted on a printed circuit board (PCB) based on a plurality of holes in the PCB,
wherein the plurality of holes in the PCB is embedded with a heat sink,
wherein each of the plurality of 3-D antenna cells comprises a raised antenna patch, and
wherein a packaged circuitry of the plurality of packaged circuitry is electrically connected with the raised antenna patch of the plurality of 3-D antenna cells.