Multiple viewing elements endoscope system with modular imaging units
An optical assembly adapted to be positioned within an endoscope tip and having three modular camera units, comprising: a front modular camera unit defined by a front central axis and a first and second side modular camera units defined by first and second side central axes that are substantially parallel to one another and substantially perpendicular to the front central axis. Each modular camera unit further comprises a holder for housing an associated optical element and an image sensor in data communication with a corresponding printed circuit board. The front, first side and second side modular camera units are respectively positioned in first, second and third compartments of an assembly holder.
1. A modular imaging unit assembly adapted to be positioned within an endoscope tip, the modular imaging unit assembly comprising:
an optical element for receiving reflected light, said optical element having a central longitudinal axis;
a holder for housing said optical element;
a sensor for detecting said reflected light, wherein said sensor is attached to a surface of said holder, and wherein said sensor is in optical communication with said optical element;
a printed circuit board having a length measured along a first direction defined by the central longitudinal axis, a width measured along a second direction perpendicular to the first direction, and a height measured along a third direction perpendicular to the first and second directions; and
a connector connecting said sensor with said printed circuit board, wherein the connector places said sensor in data communication with said printed circuit board, wherein the connector has a length measured along the first direction, wherein the length of the connector is greater than the length of the printed circuit board, wherein the connector has a width measured along the third direction and a height measured along the second direction, wherein the connector includes a planar surface extending in a plane defined by the first and third directions, wherein the planar surface is formed by a first part of the connector and a second part of the connector, wherein a width of the first part is less than a width of the second part, and a length of the first part is greater than a length of the second part;
wherein a first end portion of the connector is connected to the sensor, and a second end portion of the connector is connected to the printed circuit board, the first and second end portions being opposite end portions of the connector;
wherein the printed circuit board is attached to a side of the connector, the side of the connector lying in a plane defined by the first and second directions; and
wherein the second part of the connector projects substantially perpendicularly from an edge of the printed circuit board.
2. The modular imaging unit assembly of claim 1 , wherein the connector includes a planar surface extending in a plane defined by the first and third directions, and the printed circuit board includes a planar surface extending in a plane defined by the first and second directions, and wherein the planar surface of the connector meets the planar surface of the printed circuit board at a common edge.
3. A modular imaging unit assembly adapted to be positioned within an endoscope tip, the imaging unit comprising:
front, first side, and second side optical elements for receiving reflected light, said front optical element having a central longitudinal axis;
a holder for housing said front, first side, and second side optical elements;
front, first side, and second side sensors for detecting said reflected light, wherein said front, first side, and second side sensors are attached to surfaces of said holder, and wherein said front, first side, and second side sensors are in optical communication with said front, first side, and second side optical elements, respectively; and
front, first side, and second side printed circuit boards, wherein said front and at least one of the first and second side printed circuit boards extend parallel to each other;
a connector connecting said front sensor with said front printed circuit board, wherein said connector includes a first plate member having a first width and a first length, and a second plate member having a second length and a second width, wherein the first width is less than the second width, and the first length is longer than the second length;
wherein the holder further comprises:
a first compartment defined by a first wall and a curved base,
a second compartment defined by said first wall, a second wall, and a third wall, and
a third compartment defined by the first wall, the second wall, and a fourth wall, and
wherein the first plate member is positioned atop the third compartment and is perpendicular to the first wall and fourth wall.
4. The modular imaging unit assembly of claim 3 , wherein the front optical element and sensor are positioned in the first compartment, the first side optical element and sensor are positioned in the second compartment, and the second side optical element and sensor are positioned in the third compartment.
5. The modular imaging unit assembly of claim 4 , wherein the holder comprises a first slit positioned between the third wall and second wall for receiving the first side printed circuit board.
6. The modular imaging unit assembly of claim 5 , wherein the holder comprises a second slit positioned between the fourth wall and second wall for receiving the second side printed circuit board.
7. The modular imaging unit assembly of claim 3 , wherein a side of the second plate member is attached to the front printed circuit board.
8. The modular imaging unit assembly of claim 7 , wherein the second plate member projects substantially perpendicularly from the front printed circuit board.
9. The modular imaging unit assembly of claim 3 , wherein the front printed circuit board extends between the first and second side printed circuit boards.
10. A modular imaging unit assembly adapted to be positioned within an endoscope tip and having at least two modular imaging units, the modular imaging unit assembly comprising:
an assembly holder comprising at least a first compartment and a second compartment;
a front modular imaging unit positioned within the first compartment, wherein the front modular imaging unit comprises:
a front optical element for receiving reflected light, said front optical element having a front central longitudinal axis,
a front sensor for detecting said reflected light, wherein said front sensor is in optical communication with said front optical element,
a front printed circuit board having a planar surface, and
a front connector connecting said front sensor with said front printed circuit board, wherein the front connector places said front sensor in data communication with said front printed circuit board; and
a side modular imaging unit positioned within the second compartment, wherein the at least one side modular imaging unit comprises:
a side optical element for receiving reflected light, said side optical element having a side central longitudinal axis, wherein said side central longitudinal axis is substantially perpendicular to said front central longitudinal axis,
a side sensor for detecting said reflected light, wherein said side sensor is in optical communication with said side optical element, and
a side printed circuit board having a planar surface, wherein the planar surface of the side printed circuit board is parallel to the planar surface of the front printed circuit board, and wherein the planar surfaces of the front and side printed circuit boards are perpendicular to the side central longitudinal axis;
wherein the front and side printed circuit boards are positioned adjacent to, and parallel to, each other, and proximal to each of the first compartment and the second compartment, and
wherein the front connector extends from the front optical element to a position proximal of the second compartment without extending through the second compartment.