Optical communication modules
View Patent ↗An optical assembly may include a platform disposed within a housing that has a limited space. The platform may be tilted by a first angle to fit a fiber array into the limited space of the housing. The optical assembly may also include a silicon photonics device mounted on the tilted platform. The silicon photonics device may include a grating coupler. The optical assembly may also include the fiber array directly coupled to the grating coupler on the silicon photonics device at a coupling position that deviates from a vertical coupling position by a second angle.
1. An optical assembly comprising:
a platform disposed within a housing that has a limited enclosed space at least partially defined between a top wall and a bottom wall of the housing which are vertically separated and at least partially defined between opposing sidewalls of the housing that extend vertically between the top wall and the bottom wall, the platform including a tilted upper surface being tilted by a first angle relative to the bottom wall of the housing to fit a fiber array into the limited enclosed space of the housing;
a silicon photonics device mounted on the tilted upper surface of the platform, the silicon photonics device including a grating coupler; and
the fiber array directly coupled to the grating coupler on the silicon photonics device at a coupling position that deviates from a reference coupling position by a second angle, the reference coupling position oriented perpendicular to the tilted upper surface of the platform;
wherein the silicon photonics device further comprises:
a laser source mounted on the tilted upper surface of the platform, the laser source configured to emit a light beam that propagates through at least a portion of the silicon photonics device;
a lens mounted on the tilted upper surface of the platform and positioned to receive the light beam emitted from the laser source;
an isolator mounted on the tilted upper surface of the platform and positioned to receive the light beam after it propagates through the lens;
a focusing lens mounted on the tilted upper surface of the platform and positioned to receive the light beam after it propagates through the isolator;
a photonic integrated circuit (PIC) mounted on the tilted upper surface of the platform, the grating coupler included in the PIC to couple the light beam out of the PIC and into the fiber array; and
a prism mounted on the PIC to couple the light beam that propagates through the focusing lens into the PIC.
2. The optical assembly of claim 1 , wherein the first angle has a value of about 20 degrees.
3. The optical assembly of claim 1 , wherein the second angle has a value of about 8 degrees.
4. The optical assembly of claim 1 , wherein the fiber array includes a v-groove fiber array.
5. The optical assembly of claim 1 , wherein the fiber array includes a single mode fiber.
6. The optical assembly of claim 1 , wherein the silicon photonics device includes a transmit optical subassembly (TOSA) and a receive optical subassembly (ROSA).
7. The optical assembly of claim 1 , wherein the grating coupler is mounted on the PIC.
8. The optical assembly of claim 1 , wherein the housing has a footprint of a small form factor module including a 12× small form-factor pluggable (CXP) transceiver, a C form-factor pluggable (CFP) transceiver, a CFP4 transceiver, or a quad small form factor pluggable (QSFP) transceiver.
9. The optical assembly of claim 1 , wherein the limited enclosed space of the housing includes a vertical dimension of about 8 millimeters and the fiber array is bent with a radius of about 6 millimeters to fit into the vertical dimension of the housing.
10. An optical assembly comprising:
a housing with a footprint of a small form factor module, the housing comprising a top wall, a bottom wall vertically separated from the top wall, and two opposing sidewalls that extend vertically between the top wall and the bottom wall, and the small form factor module includes a 12× small form-factor pluggable (CXP) transceiver, a C form-factor pluggable (CFP) transceiver, a CFP4 transceiver, or a quad small form factor pluggable (QSFP) transceiver;
a platform disposed within the housing, the platform including a tilted upper surface arranged at a first angle of about 20 degrees relative to the bottom wall of the housing;
a silicon photonics device mounted on the tilted upper surface of the platform, the silicon photonics device including:
a grating coupler;
a laser source mounted on the tilted upper surface of the platform, the laser source configured to emit a light beam that propagates through at least a portion of the silicon photonics device;
a lens mounted on the tilted upper surface of the platform and positioned to receive the light beam emitted from the laser source;
an isolator mounted on the tilted upper surface of the platform and positioned to receive the light beam after it propagates through the lens;
a focusing lens mounted on the tilted upper surface of the platform and positioned to receive the light beam after it propagates through the isolator;
a photonic integrated circuit (PIC) mounted on the tilted upper surface of the platform, the grating coupler included in the PIC to couple the light beam out of the PIC; and
a prism mounted on the PIC to couple the light beam that propagates through the focusing lens into the PIC; and
a v-groove fiber array directly butt coupled to the grating coupler on the silicon photonics device at a coupling position that deviates from a reference coupling position by a second angle of about 8 degrees, the reference coupling position being perpendicular to a slope of the tilted upper surface of the platform,
wherein:
the v-groove fiber array is bent with a radius of about 6 millimeters;
the tilted upper surface of the platform is tilted by the first angle to fit the bent v-groove fiber array into the housing;
the grating coupler is configured to convert a beam spot of the light beam from a first mode field diameter (MFD) to a second MFD that is greater than the first MFD;
the first MFD is in a range from 300 nanometers to 500 nanometers; and
the second MFD is about 10 micrometers.
11. An optical communication module comprising:
a housing with a limited enclosed space at least partially defined between a top wall and a bottom wall of the housing which are vertically separated and at least partially defined between opposing sidewalls of the housing that extend vertically between the top wall and the bottom wall;
a printed circuit board (PCB) disposed within the housing;
a flexible circuit configured to couple the PCB to a silicon photonics device;
the silicon photonics device mounted on a platform that is disposed within the housing, the platform including a tilted upper surface tilted by a first angle relative to the bottom wall of the housing, the silicon photonics device including:
a grating coupler;
a laser source mounted on the tilted upper surface of the platform, the laser source configured to emit a light beam that propagates through at least a portion of the silicon photonics device;
a lens mounted on the tilted upper surface of the platform and positioned to receive the light beam emitted from the laser source;
an isolator mounted on the tilted upper surface of the platform and positioned to receive the light beam after it propagates through the lens;
a focusing lens mounted on the tilted upper surface of the platform and positioned to receive the light beam after it propagates through the isolator;
a photonic integrated circuit (PIC) mounted on the tilted upper surface of the platform, the grating coupler included in the PIC to couple the light beam out of the PIC;
a prism mounted on the PIC to couple the light beam that propagates through the focusing lens into the PIC,
wherein each of the laser source, the lens, the isolator, the focusing lens, and the prism are optically aligned in parallel fashion along the tilted upper surface of the platform such that the light beam emitted from the laser source propagates through each of at least the lens, the isolator, the focusing lens, and the prism before propagating through the PIC;
a fiber array directly coupled to the grating coupler on the silicon photonics device at a coupling position that deviates from a reference coupling position by a second angle, wherein:
the upper surface of the platform is tilted by the first angle to fit the fiber array into the limited enclosed space of the housing,
the reference coupling position is perpendicular to the tilted upper surface of the platform; and
the fiber array includes a v-groove fiber array;
a cover plate directly butt coupled to both the grating coupler and the PIC, the cover plate configured to enclose the coupling of the fiber array to the grating coupler; and
a fastener configured to couple a portion of the fiber array, at a position along the fiber array that is outside of the cover plate, to the top wall such that the fiber array is bent less than a critical bend radius of the fiber array,
wherein a front facet of one or both of the v-groove fiber array or the cover plate is angle polished to the second angle.
12. The optical communication module of claim 11 , further comprising an adaptor configured to receive a cable assembly, wherein the cable assembly is configured to couple to the fiber array.
13. The optical communication module of claim 12 , wherein the adaptor includes a multi-fiber push-on (MPO) adaptor and the cable assembly includes a quad small form-factor pluggable (QSFP) cable assembly.
14. The optical communication module of claim 11 , wherein the first angle has a value of about 20 degrees and the second angle has a value of about 8 degrees.
15. The optical communication module of claim 11 , wherein the fiber array includes a single mode fiber.
16. The optical communication module of claim 11 , wherein the silicon photonics device includes a transmit optical subassembly (TOSA) and a receive optical subassembly (ROSA).
17. The optical communication module of claim 11 , wherein the grating coupler is mounted on the PIC.
18. The optical communication module of claim 11 , wherein the housing has a footprint of a small form factor module including a 12× small form-factor pluggable (CXP) transceiver, a C form-factor pluggable (CFP) transceiver, a CFP4 transceiver, or a quad small form factor pluggable (QSFP) transceiver.
19. The optical communication module of claim 11 , wherein:
the grating coupler is configured to convert a beam spot of the light beam from a first mode field diameter (MFD) to a second MFD that is greater than the first MFD;
the first MFD is in a range from 300 nanometers to 500 nanometers; and
the second MFD is about 10 micrometers.