User interface cooling using audio component
This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
1. A speaker, comprising:
a device housing having opposing top and bottom surfaces and a vertical axis extending therebetween;
a user interface assembly comprising a capacitive touch sensor for receiving touch inputs disposed at the top surface of the device housing;
a printed circuit board (PCB) disposed between the user interface assembly and the bottom surface and secured to an interior facing surface of the user interface assembly; and
a subwoofer disposed between the user interface assembly and the bottom surface and configured to push air toward the PCB during operation of the speaker, wherein the vertical axis extends through the user interface assembly, the PCB, and the subwoofer.
2. The speaker as recited in claim 1 , wherein the user interface assembly comprises a convex touch sensitive user interface.
3. The speaker as recited in claim 2 , wherein a touch sensor of the convex touch sensitive user interface has a substantially planar touch surface.
4. The speaker as recited in claim 3 , wherein the user interface assembly comprises an exterior cosmetic surface separated from a user interface PCB by a wedge-shaped substrate, the wedge-shaped substrate having a dielectric constant suitable for transmitting user inputs received at the cosmetic surface to the touch sensor.
5. A speaker, comprising:
a device housing opposing top and bottom surfaces and a vertical axis extending therebetween;
a user interface assembly comprising a capacitive touch sensor for receiving touch inputs disposed at a top end of the device housing, wherein the device housing defines vents arranged along a periphery of the user interface assembly;
a printed circuit board (PCB) disposed between the user interface assembly and the bottom surface and secured to an interior facing surface of the user interface assembly; and
a subwoofer disposed between the user interface assembly and the bottom surface and configured to push air toward the PCB during operation of the speaker, wherein the vertical axis extends through the user interface assembly, the PCB, and the subwoofer.
6. The speaker as recited in claim 5 , wherein the vents are covered by an acoustic fabric.
7. The speaker as recited in claim 6 , wherein the acoustic fabric abuts a periphery of the user interface assembly.
8. The speaker as recited in claim 1 , wherein the air pushed toward the PCB is generated by sub-audible waves.
9. The speaker as recited in claim 1 , wherein the subwoofer is configured to oscillate at frequencies that induce vibrations at the user interface assembly in response to one or more user inputs.
10. An electronic device, comprising:
a device housing having opposing top and bottom surfaces and a vertical axis extending therebetween;
a user interface assembly comprising a capacitive touch sensor for receiving touch inputs disposed at the top surface of the device housing;
a printed circuit board (PCB) disposed between the user interface assembly and the bottom surface and secured to an interior facing surface of the user interface assembly; and
an audio component having a diaphragm configured to push air toward the PCB during operation of the electronic device, wherein the vertical axis extends through the user interface assembly, the PCB, and the audio component.
11. The electronic device as recited in claim 10 , wherein the PCB includes a processor configured to control operation of a component of the electronic device.
12. The electronic device as recited in claim 10 , wherein the audio component is a subwoofer.
13. The electronic device as recited in claim 12 , wherein the subwoofer cooperates with a support structure within the device housing to divide an interior volume defined by the device housing by acoustically sealing a first region of the interior volume from a second region of the interior volume, wherein the PCB is disposed within the first region.
14. The electronic device as recited in claim 13 , wherein the subwoofer uses the second region of the interior volume as a back volume for the subwoofer.
15. The electronic device as recited in claim 13 , further comprising audio driver assemblies disposed within the second region of the interior volume.
16. The electronic device as recited in claim 10 , wherein the user interface assembly includes a light source configured to illuminate a region of the user interface assembly.