Endoscope
An endoscope includes: an imaging unit disposed at a distal end portion of an insertion section inserted into a body of a subject; and a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section. The imaging unit includes: a solid state image sensor including a light receiving unit; a flexible circuit board electrically connecting the solid state image sensor; and a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board.
1. An endoscope comprising:
an imaging unit disposed at a distal end portion of an insertion section, the insertion section being configured to be inserted into a body of a subject; and
a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section, wherein
the imaging unit includes:
a solid state image sensor including a light receiving unit;
a flexible circuit board electrically connected to the solid state image sensor; and
a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board,
the rigid circuit board includes a first surface whose longitudinal direction extends in an axial direction of the distal end portion, and a second surface opposed to the first surface substantially in parallel, the first surface having a width larger than a width of the second surface in a cross-section orthogonal to the longitudinal direction,
the rigid circuit board includes a third surface and a fourth surface different from the first surface and the second surface, and the third surface and the fourth surface extending in an axial direction of the distal end portion, and the third surface or the fourth surface being opposed to the built-in component,
the solid state image sensor includes a light receiving surface provided with the light receiving unit, a land on the sensor for connection with the flexible circuit board is formed on the light receiving surface, and the light receiving surface extends in a plane orthogonal to the axial direction of the distal end portion,
the rigid circuit board is formed with a land on the circuit board for connection with the flexible circuit board, on the first or second surface, and is disposed such that a fifth surface orthogonal to the axial direction of the distal end portion is opposed to a surface of the solid state image sensor opposite to the light receiving surface of the solid state image sensor, and
the flexible circuit board is disposed to be opposed to a side surface of the solid state image sensor, and the first or second surface of the rigid circuit board.
2. The endoscope according to claim 1 , wherein
the built-in component comprises a plurality of the built-in components, the plurality of built-in components being stored in the insertion section, and
the third surface or the fourth surface is opposed to a built-in component having a largest diameter of the plurality of built-in components.
3. The endoscope according to claim 1 , wherein a circuit pattern is arranged on each of the first surface and the second surface of the rigid circuit board, and at least one cable land is provided on a proximal end side of the first surface, the at least one cable land being configured to connect to a cable.
4. The endoscope according to claim 1 , further comprising a plurality of electronic components mounted on the rigid circuit board, and an electronic component having a highest mounting height among the plurality of electronic components is mounted on the first surface.