Light emitting device package
View Patent ↗A packaged light emitting device die 20 includes a package body having a profiled leadframe 10 embedded in a body 12 of reflecting material. The leadframe 10 is exposed on mounting surface 14 only on at least one solder bonding area 16 . Solder 22 is present only on the at least one solder bonding area 16 and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe 10 . Moreover, the reflecting material can function as a solder resist to self-align the solder 22 to the at least one solder bonding area 16.
1. A packaged light emitting device comprising:
a package comprising a body having a reflective surface and reflective sidewalls around the reflective surface, the package further comprising a leadframe;
the leadframe having a raised portion and a lower portion, the lower portion having a top surface in a first plane and the raised portion having a top surface on a second plane different from the first plane, the raised portion being exposed through the reflective surface of the body to define at least two bonding areas, comprising a first bonding area and a second bonding area, surrounded by the reflective surface and the reflective sidewalls, the at least two bonding areas of the raised portion being electrically connected to the lower portion by the leadframe;
a mounting surface for a flip-chip light emitting device die, the flip-chip light emitting die having a first bottom bonding pad and a second bottom bonding pad, the mounting surface comprising a continuous surface formed of the at least two bonding areas and the reflective surface, the lower portion of the leadframe being at least partially encased in the body, such that at least a portion of the lower portion is between the reflective sidewalls and the at least two bonding areas;
a conductive bond material covering the at least two bonding areas; and
the flip-chip light emitting device die having its first bottom bonding pad mounted to the first bonding area by the conductive bond material and its second bottom bonding pad mounted to the second bonding area by the conductive bond material, such that the reflective surface is exposed and surrounds the flip-chip light emitting device die with no other material being exposed between edges of the flip-chip light emitting die and the reflective sidewalls.
2. The device of claim 1 wherein the at least two bonding areas comprises at least two solder bonding areas, wherein the conductive bond material comprises a solder, and wherein the reflective surface resists solder so that the solder does not adhere to the reflective surface.
3. The device of claim 1 wherein the mounting surface comprises a continuous planar surface formed of the at least two bonding areas and the reflective surface.
4. The device of claim 1 wherein the body is in the form of a reflective cup.
5. The device of claim 1 wherein the body is flat.
6. The device of claim 1 wherein the conductive bond material is a solder.