IP Library Granted Patent US 10,263,352
Granted Patent B2
US 10,263,352 · App. 15/617,767 · Granted Apr 16, 2019

Electrical contact pad for electrically contacting a connector

Inventors: Graham Harry Smith, Jr. (Mechanicsburg, PA); Scott Eric Walton (Mount Joy, PA); Michael Frank Cina (Elizabethtown, PA)
Assignee: TE CONNECTIVITY CORPORATION
H01R12/714H01R12/7005H01R13/6474H05K1/117H01P5/028H01R12/721H05K1/025H05K3/403H05K2201/094H05K2201/09381H05K2201/09418H05K2201/09427H05K2201/09727
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Quick Facts
Patent No.
US 10,263,352
App. No.
15/617,767
Granted
Apr 16, 2019
Kind
B2
Abstract

An electrical contact pad for electrically contacting a connector includes a first region having a first length in a longitudinal direction, and a second region having a second length in the longitudinal direction that is greater than the first length. The first region is arranged to contact a first arm of the connector and the second region is arranged to contact a second arm of the connector. The first length being smaller than the second length results in a beneficial increases the impedance of the electrical contact pad. A chamfered edge of the contact pad results in an additional beneficial increase in the impedance of the electrical contact pad.

Claims (28)

1. A circuit board wafer disposed within a first portion of a connector for communicating signals to resilient contact members disposed within a second portion of the connector, the circuit board wafer comprising:

a plurality of electrical contact pads arranged side-by-side, wherein each contact pad includes:

a first region having a first length in a longitudinal direction; and

a second region having a second length in the longitudinal direction that is greater than the first length, wherein

the first and second regions are centered longitudinally with one another,

the first region is arranged to contact a first arm of a contact member and the second region is arranged to contact a second arm of the contact member, and

the first length is smaller than the second length to thereby increase an impedance of the electrical contact pad, and

wherein the first region of a first electrical contact pad is disposed adjacent to the second region of a second electrical contact pad.

2. The electrical contact pad according to claim 1 , wherein the first length is selected to facilitate contact with two points of the first arm, which are separated by a first distance, and the second length is selected to facilitate contact with two points of the second arm, which are separated by a second distance that is greater than the first distance.

3. The electrical contact pad according to claim 2 , wherein the first length of the first region is greater than the first distance, and the second length of the second region is greater than the second distance.

4. A circuit board wafer disposed within a first portion of a connector for communicating signals to resilient contact members disposed within a second portion of the connector, the circuit board wafer comprising:

a plurality of electrical contact pads arranged side-by-side, wherein each contact pad includes:

a first edge connected to a trace;

a second edge opposite the first edge at an end of the contact pad;

first and second side edges extending between the first and second edges, wherein a corner between the second edge and one of the side edges is chamfered to thereby increase of an impedance of the electrical contact pad.

5. The circuit board wafer according to claim 4 , wherein a radius of the chamfered corner is about 1.6 mm and a radii of other corners of the electrical pad are less than about 0.4 mm.

6. The circuit board wafer according to claim 4 , wherein a corner of the first edge region of a first electrical contact pad is chamfered on a side nearest the second electrical contact pad.

7. An electrical connector comprising:

a bottom housing;

a plurality of circuit wafers disposed within the bottom housing; and

a shroud that forms a top of the electrical connector that is configured to engage the bottom housing to secure the plurality of circuit wafers between the bottom housing and the shroud,

wherein the plurality of circuit wafers include one or more contact pads, wherein at least one contact pad includes:

a first region having a first length in a longitudinal direction; and

a second region having a second length in the longitudinal direction that is greater than the first length,

wherein the first region is arranged to contact a first arm of the connector and the second region is arranged to contact a second arm of the connector, and

wherein the first length being smaller than the second length increases an impedance of the electrical contact pad.

8. The electrical connector according to claim 7 , wherein the first length is selected to facilitate contact with two points of the first arm, which are separated by a first distance, and the second length is selected to facilitate contact with two points of the second arm, which are separated by a second distance that is greater than the first distance.

9. The electrical connector pad according to claim 8 , wherein the first length of the first region is greater than the first distance, and the second length of the second region is greater than the second distance.

Assignments (4)
MERGER Recorded Apr 28, 2022
From: TE CONNECTIVITY SERVICES GMBH
To: TE CONNECTIVITY SOLUTIONS GMBH
Reel/Frame 060885/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2021
From: TE CONNECTIVITY CORPORATION
To: TE CONNECTIVITY SERVICES GMBH
Reel/Frame 056524/0226 →
CHANGE OF ADDRESS Recorded Jun 8, 2021
From: TE CONNECTIVITY SERVICES GMBH
To: TE CONNECTIVITY SERVICES GMBH
Reel/Frame 056524/0531 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2017
From: SMITH, GRAHAM HARRY, JR.; WALTON, SCOTT ERIC; CINA, MICHAEL FRANK
To: TE CONNECTIVITY CORPORATION
Reel/Frame 042925/0096 →
Continuity (2)
Provisional Application 62348639 · Jun 10, 2016
Related Publication 20170358878A1 · Dec 14, 2017
Cited By (1)
US 12,444,869