Devices, systems, and methods for thermal management of rack-mounted computing infrastructure devices

1. An enclosure for thermal management configured to be mounted inside an electronics cabinet to provide a flow path to one or more interface devices, the enclosure comprising:

a first lateral portion; and

a second lateral portion configured to be joined to the first lateral portion at an expansion region;

wherein the first and second lateral portions are configured to be expanded laterally to define a width of the enclosure in an installed position; and

wherein the flow path provided by the enclosure to the one or more interface devices has an inlet formed in a front of the enclosure and an outlet formed in a rear of the enclosure, the inlet being on an opposite side of the enclosure from the outlet.

2. The enclosure of claim 1 , wherein:

the first lateral portion has one or more slots oriented substantially parallel to a direction of lateral expansion of the enclosure,

the second lateral portion has at least one post configured to be disposed within a corresponding slot of the one or more slots, and

the first lateral portion is configured to move relative to the second lateral portion along a path defined by the one or more slots.

3. The enclosure of claim 2 , wherein the at least one post is configured to be threadably engaged by a fastener to press together portions of the first lateral portion against the second lateral portion at the one or more slots to prevent lateral movement thereof when the fastener is fully threadably engaged with the at least one post.

4. The enclosure of claim 1 , comprising:

mounting flanges on a front edge of each of the first and second lateral portions; and

a recess located behind the mounting flanges on the first and second lateral portions, the recess being configured to accommodate mounting hardware protruding through the mounting flanges on the front edge of the first and second lateral portions,

wherein the width of the enclosure at a position between the front edge and a rear edge is substantially identical to a distance between outer edges of the mounting flanges.

5. The enclosure of claim 1 , comprising a front panel having a plurality of perforations and/or openings and one or more cabling slots formed therein.

6. A system for thermal management comprising:

an electronics cabinet with front and rear mounting rails;

at least one enclosure comprising:

a first lateral portion; and

a second lateral portion configured to be joined to the first lateral portion at an expansion region,

wherein the first and second lateral portions are configured to be expanded laterally to define a width of the enclosure; and

one or more interface devices installed in the at least one enclosure and accessible at a rear of the enclosure;

wherein the enclosure is mounted to the front mounting rails at a front of the enclosure and to the rear mounting rails at the rear of the enclosure, and

wherein the at least one enclosure is configured to provide a flow path from an inlet side of the electronics cabinet at the front of the enclosure to an inlet of the one or more interface devices installed therein.

7. The system of claim 6 , comprising first and second bypass panels installed at the rear of the at least one enclosure,

wherein the first and second bypass panels are configured to prevent recirculation of hot exhaust air from a rear of the electronics cabinet, and

wherein the first bypass panel is installed in a bottom 0.5 RU (rack unit) space thereof and the second bypass panel is installed in a top 0.5 RU space thereof.

8. The system of claim 7 , wherein the one or more interface devices are installed to be vertically between the first and second bypass panels, and wherein the first and second bypass panels are configured with one or more gaskets to sealingly engage an adjacent surface of the one or more interface devices.

9. The system of claim 6 , comprising a front panel attached to the front of the enclosure, the front panel comprising a plurality of perforations or openings and one or more cabling slots formed therein.

10. The system of claim 6 , wherein the front of the at least one enclosure is mounted to an internal surface of the front mounting rails and the rear of the at least one enclosure is mounted to an internal surface of the rear mounting rails, so the enclosure does not extend beyond the front or rear mounting rails of the electronics cabinet.

11. The system of claim 10 , wherein the one or more interface devices are mounted to an external surface of the front and/or rear mounting rails of the electronics cabinet, wherein a majority of a mass of the one or more interface devices is supported by the mounting rails instead of the enclosure.

12. The system of claim 6 , comprising, when one or more of the one or more interface devices is not present, a filler panel installed at the rear of the enclosure to prevent recirculation of hot exhaust air into and/or through the enclosure.

13. A method of providing conditioned air from a front of an electronics cabinet to one or more interface devices installed in an enclosure, the method comprising:

inserting the enclosure into the electronics cabinet so the enclosure is disposed between front and rear mounting rails of the electronics cabinet, wherein the enclosure comprises first and second lateral portions movably attached to each other at an expansion region;

attaching the enclosure to the mounting rails;

inserting the one or more interface devices into a rear opening of the enclosure; and

preventing recirculation of hot air through the rear opening of the enclosure.

14. The method of claim 13 , comprising:

installing a front panel on the enclosure to cover a front opening of the enclosure;

providing one or more perforations and/or openings in the front panel for conditioned air to pass therethrough to an inlet of the one or more interface devices; and

securing one or more cable through one or more cabling notches formed in the front panel.

15. The method of claim 13 , comprising:

expanding the enclosure laterally at the expansion region by moving the first and second lateral portions relative to each other in a direction of a width of the enclosure; and

securing the first and second lateral portions at a width that is substantially identical to a distance between the front mounting rails or the rear mounting rails.

16. The method of claim 15 , wherein expanding the enclosure laterally at the expansion region comprises at least one post of the second lateral portion moving along a path defined by one or more slot formed in the first lateral portion, and wherein securing the first and second lateral portions comprises threadably engaging a fastener over the at least one post to press portions of the first and second lateral portions together.

17. The method of claim 13 , wherein attaching the enclosure to the mounting rails comprises:

attaching a front of the enclosure to an internal surface of the front mounting rails of the electronics cabinet; and

attaching a rear of the enclosure to an internal surface of the rear mounting rails of the electronics cabinet.

18. The method of claim 17 , wherein the one or more interface devices are mounted to an external surface of the front and/or rear mounting rails of the electronics cabinet, and wherein a majority of a mass of the one or more interface devices is supported by the mounting rails instead of the enclosure.

19. The method of claim 13 , wherein preventing recirculation of hot air comprises:

installing a first bypass panel in a bottom 0.5 RU space at the rear of the enclosure; and

installing a second bypass panel in a top 0.5 RU space at the rear of the enclosure;

wherein the one or more interface devices are installed vertically between the first and second bypass panels, and

wherein the first and second bypass panels are configured to sealingly engage with an adjacent surface of an adjacent interface device of the one or more interface devices.

20. The method of claim 13 , comprising installing a filler panel when one or more of the one or more interface devices is uninstalled from the enclosure.