PHOTOVOLTAIC DEVICE AND METHODS OF FORMING THE SAME

1 . A method of manufacturing a photovoltaic device comprising the steps of:

depositing a semiconductor absorber layer on a substrate, wherein the semiconductor absorber layer is formed from CdTe;

depositing a p-type back contact buffer layer on the semiconductor absorber layer, wherein the p-type back contact buffer layer is formed from MnTe, and wherein the depositing a p-type back contact buffer layer step is an evaporation step whereby the MnTe back contact buffer layer is deposited on the semiconductor absorber layer by impinging evaporated MnTe onto the semiconductor absorber layer, the evaporated MnTe generated by heating a source of MnTe; and

depositing a back contact layer on the p-type back contact buffer layer.

2 . The method of claim 1 , wherein the evaporation step is performed at a temperature of up to about 1200° C.

3 . The method of claim 1 , wherein the MnTe is doped up to about 10 19 cm −3 .

4 . A method of manufacturing a photovoltaic device comprising the steps of:

depositing a semiconductor absorber layer on a substrate, wherein the semiconductor absorber layer is formed from CdTe;

depositing a p-type back contact buffer layer on the semiconductor absorber layer, wherein the depositing a p-type back contact buffer layer step is a sputtering step whereby the MnTe back contact buffer layer is deposited on the semiconductor absorber layer by sputtering MnTe with a MnTe target onto the semiconductor absorber layer; and

depositing a back contact layer on the p-type back contact buffer layer.

5 . The method of claim 4 , wherein the sputtering step is performed at a temperature of up to about 300° C.

6 . The method of claim 4 , wherein the MnTe is doped up to about 10 19 cm −3 .

7 . A method of manufacturing a photovoltaic device comprising the steps of:

depositing a semiconductor absorber layer on a substrate, wherein the semiconductor absorber layer is formed from CdTe;

depositing a p-type back contact buffer layer on the semiconductor absorber layer, wherein the depositing a p-type back contact buffer layer step is a chemical reaction step involving:

a. depositing MnI 2 solution onto the semiconductor absorber layer by one of application of liquid MnI 2 thereon and evaporating MnI 2 onto thereon; and

b. annealing the MnI 2 -coated semiconductor absorber layer to form the p-type back contact; and

depositing a back contact layer on the p-type back contact buffer layer.

8 . The method of claim 7 , wherein the annealing step is conducted at a temperature of from about 400° C. to about 650° C. in an oxygen-deficient environment.

9 . The method of claim 7 , wherein the annealing step is conducted in the presence of a flow of an inert gas to remove annealing byproduct gases.

10 . The method of claim 7 , wherein the p-type back contact buffer layer is formed from SnTe.

11 . The method of claim 10 , wherein the depositing a p-type back contact buffer layer step is a sputtering step whereby the SnTe back contact buffer layer is deposited on the semiconductor absorber layer by sputtering SnTe with a SnTe target onto the semiconductor absorber layer.

12 . The method of claim 10 , wherein the depositing a p-type back contact buffer layer step is a vapor transport deposition step whereby SnTe is deposited on the semiconductor absorber layer.

13 . The method of claim 10 , wherein the SnTe back contact buffer layer has a thickness from about 10 nm to about 500 nm.

14 . The method of claim 7 , wherein the p-type back contact buffer layer is formed from Cd 1-x Mn x Te.

15 . The method of claim 14 , wherein the Cd 1-x Mn x Te comprises Cd 0.5 Mn 0.5 Te.