Method for manufacturing display device
View Patent ↗A flexible substrate including a display area and a area to be bent, the area to be bent being provided with a wiring layer and not overlapping the display area. A first resin layer that extends along a boundary of the area to be bent and continuously surrounds the area to be bent is formed. Subsequently, a second resin layer is injected into an area surrounded by the first resin layer.
1. A method for manufacturing a display device comprising:
preparing a structure including a display area and an area to be bent, the display area being provided with a display element layer that emits light of a plurality of pixels, the area to be bent being provided with a wiring layer and not overlapping the display area;
forming a first resin layer that extends along a boundary of the area to be bent including a side extending in one direction, and extends continuously surrounds the area to be bent;
injecting, after the forming, a second resin layer in an area surrounded by the first resin layer;
cutting, after the injecting, the structure along a cutting line that extends in the one direction and overlaps the second resin layer.
2. The method for manufacturing the display device according to claim 1 , wherein
viscosity of the second resin layer before curing is lower than viscosity of the first resin layer before curing.
3. The method for manufacturing the display device according to claim 1 , wherein
a thickness of the second resin layer which is injected is smaller than a thickness of the first resin layer.
4. The method for manufacturing the display device according to claim 1 , further comprising, before the forming, adhering a film to cover the display area of the structure, wherein
the first resin layer is in contact with the film.
5. The method for manufacturing the display device according to claim 1 , further comprising attaching an integrated circuit to an area of the structure opposite to the display area across the area to be bent, the integrated circuit electrically connecting to the wiring layer, wherein
the first resin layer is in contact with the integrated circuit.
6. The method for manufacturing the display device according to claim 5 , wherein
the first resin layer continuously surrounds a periphery of the integrated circuit in a plan view.
7. The method for manufacturing the display device according to claim 1 , further comprising attaching a flexible printed circuit to an area in the structure opposite to the display area across the area to be bent, the flexible printed circuit electrically connecting to the wiring layer, wherein
the first resin layer is in contact with the flexible printed circuit.
8. The method for manufacturing the display device according to claim 7 , wherein
a connected area and a folding area are formed in the flexible printed circuit, the connected area being an area where a conductive wire exposes, the folding area being an area that is folded back so that the conductive wire extending from the connected area is directed to the connected area, and
the first resin layer is in contact with the folding area of the flexible printed circuit.
9. A method for manufacturing a display device comprising:
preparing a structure including a display area and an area to be bent, the display area being provided with a display element layer that emits light of a plurality of pixels, the area to be bent being provided with a wiring layer and not overlapping the display area;
forming a first resin layer that extends along a boundary of the area to be bent, and extends continuously surrounds the area to be bent;
injecting, after the forming, a second resin layer in an area surrounded by the first resin layer, viscosity of the second resin layer before curing is lower than viscosity of the first resin layer before curing.