Light emitting device
A light emitting device includes a mounting board including: a base part, and one or more wiring structures, each of which includes one or more first wiring parts, and one or more second wiring parts, in that order, from a base part side, wherein, in a plan view, an area of each of the one or more second wiring parts is smaller than an area of each of the one or more first wiring parts; one or more light emitting elements bonded to the second wiring parts via bonding members; and a reflective member covering at least a portion of the bonding members and at least a portion of the one or more wiring structures. A reflectance of the one or more first wiring parts is higher than a reflectance of the bonding members. The one or more second wiring parts and the bonding members comprise the same material at their outermost surfaces.
1. A light emitting device comprising:
a mounting board comprising:
a base part, and
one or more wiring structures, each of which includes:
one or more first wiring layers located on an upper surface of the base part, and
one or more second wiring layers located on an upper surface of the one or more first wiring layers,
wherein a lower surface of the one or more second wiring layers contacts an upper surface of the one or more first wiring layers,
wherein, in a plan view, an area of each of the one or more second wiring layers is smaller than an area of each of the one or more first wiring layers;
one or more light emitting elements bonded to the second wiring layers via bonding members; and
a reflective member covering at least a portion of the bonding members and at least a portion of the one or more wiring structures,
wherein a reflectance of the one or more first wiring layers is higher than a reflectance of the bonding members,
wherein the one or more second wiring layers and the bonding members comprise the same material at their outermost surfaces,
wherein one or more outermost surfaces of the one or more first wiring layers comprise a metal selected from the group consisting of Al, Ag, Rh, Pt, Pd, and Ru, and an alloy containing at least one of these metals.
2. The light emitting device according to claim 1 ,
wherein, in a plan view, an area of each of the one or more second wiring layers is smaller than an area of one of the light emitting elements.
3. The light emitting device according to claim 1 ,
wherein the plurality of second wiring layers are located in an area directly under the one or more light emitting elements.
4. The light emitting device according to claim 1 ,
wherein the one or more second wiring layers comprise Au at one or more outermost surfaces thereof.
5. The light emitting device according to claim 1 ,
wherein each of the second wiring layers has a circular or elliptical shape in a plan view.
6. The light emitting device according to claim 1 ,
wherein an area of an upper face of each of the one or more second wiring layers is smaller than an area of a lower face of each of the one or more second wiring layers.
7. The light emitting device according to claim 1 ,
wherein each of the one or more wiring structures includes one or more third wiring layers, each of the one or more third wiring layers serving as an external connection layer exposed from the reflective member,
each of the one or more first wiring layers has an extended area exposed from the reflective member, and
each of the one or more third wiring layers is located on a respective one of the extended areas of the one or more first wiring layers.
8. The light emitting device according to claim 1 further comprising:
a light transmissive member joined to an upper face of each of the one or more light emitting elements.
9. The light emitting device according to claim 8 ,
wherein the light transmissive member contains at least one phosphor.
10. The light emitting device according to claim 1 ,
wherein a thickness of each of the one or more first wiring layers is in a range of from 2.5 μm to 10.0 μm.
11. The light emitting device according to claim 1 ,
wherein a thickness of each of the one or more second wiring layers is in a range of from 0.5 μm to 10.0 μm.